JPH0213835B2 - - Google Patents
Info
- Publication number
- JPH0213835B2 JPH0213835B2 JP57051906A JP5190682A JPH0213835B2 JP H0213835 B2 JPH0213835 B2 JP H0213835B2 JP 57051906 A JP57051906 A JP 57051906A JP 5190682 A JP5190682 A JP 5190682A JP H0213835 B2 JPH0213835 B2 JP H0213835B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- wire
- insulated
- adhesive
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 claims description 27
- 239000000853 adhesive Substances 0.000 claims description 20
- 230000001070 adhesive effect Effects 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 239000010410 layer Substances 0.000 description 13
- 230000000694 effects Effects 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5190682A JPS58168294A (ja) | 1982-03-29 | 1982-03-29 | 必要な配線パタ−ンに絶縁電線を使用した高密度配線板の製造法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5190682A JPS58168294A (ja) | 1982-03-29 | 1982-03-29 | 必要な配線パタ−ンに絶縁電線を使用した高密度配線板の製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58168294A JPS58168294A (ja) | 1983-10-04 |
| JPH0213835B2 true JPH0213835B2 (sh) | 1990-04-05 |
Family
ID=12899913
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5190682A Granted JPS58168294A (ja) | 1982-03-29 | 1982-03-29 | 必要な配線パタ−ンに絶縁電線を使用した高密度配線板の製造法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58168294A (sh) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60143694A (ja) * | 1983-12-29 | 1985-07-29 | 日立化成工業株式会社 | 配線パタ−ンに絶縁ワイヤ−を使用した配線板の製造法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52150563A (en) * | 1976-06-09 | 1977-12-14 | Nippon Telegraph & Telephone | Method of wiring circuit board |
| JPS53141468A (en) * | 1977-05-16 | 1978-12-09 | Fujitsu Ltd | Multilayer printed board |
| JPS5530822A (en) * | 1978-08-25 | 1980-03-04 | Fujitsu Ltd | Printed board |
| JPS562271B2 (sh) * | 1976-08-13 | 1981-01-19 | ||
| JPS5694697A (en) * | 1979-12-27 | 1981-07-31 | Nippon Electric Co | Multiwire circuit board |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5910767Y2 (ja) * | 1979-06-18 | 1984-04-04 | 株式会社日立製作所 | 多層印刷配線構造 |
| JPS56121279U (sh) * | 1980-02-19 | 1981-09-16 |
-
1982
- 1982-03-29 JP JP5190682A patent/JPS58168294A/ja active Granted
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52150563A (en) * | 1976-06-09 | 1977-12-14 | Nippon Telegraph & Telephone | Method of wiring circuit board |
| JPS562271B2 (sh) * | 1976-08-13 | 1981-01-19 | ||
| JPS53141468A (en) * | 1977-05-16 | 1978-12-09 | Fujitsu Ltd | Multilayer printed board |
| JPS5530822A (en) * | 1978-08-25 | 1980-03-04 | Fujitsu Ltd | Printed board |
| JPS5694697A (en) * | 1979-12-27 | 1981-07-31 | Nippon Electric Co | Multiwire circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58168294A (ja) | 1983-10-04 |
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