JPH02135763A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPH02135763A
JPH02135763A JP63290780A JP29078088A JPH02135763A JP H02135763 A JPH02135763 A JP H02135763A JP 63290780 A JP63290780 A JP 63290780A JP 29078088 A JP29078088 A JP 29078088A JP H02135763 A JPH02135763 A JP H02135763A
Authority
JP
Japan
Prior art keywords
substrate
semiconductor element
bumps
cap
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63290780A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0583187B2 (cg-RX-API-DMAC10.html
Inventor
Hiroshi Saito
宏 斉藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP63290780A priority Critical patent/JPH02135763A/ja
Publication of JPH02135763A publication Critical patent/JPH02135763A/ja
Publication of JPH0583187B2 publication Critical patent/JPH0583187B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/248—
    • H10W72/877—
    • H10W74/15—
    • H10W90/724—

Landscapes

  • Wire Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP63290780A 1988-11-16 1988-11-16 半導体装置 Granted JPH02135763A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63290780A JPH02135763A (ja) 1988-11-16 1988-11-16 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63290780A JPH02135763A (ja) 1988-11-16 1988-11-16 半導体装置

Publications (2)

Publication Number Publication Date
JPH02135763A true JPH02135763A (ja) 1990-05-24
JPH0583187B2 JPH0583187B2 (cg-RX-API-DMAC10.html) 1993-11-25

Family

ID=17760414

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63290780A Granted JPH02135763A (ja) 1988-11-16 1988-11-16 半導体装置

Country Status (1)

Country Link
JP (1) JPH02135763A (cg-RX-API-DMAC10.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000067315A1 (fr) * 1999-05-03 2000-11-09 Stmicroelectronics S.A. Protection d'une puce semiconductrice
US6294408B1 (en) * 1999-01-06 2001-09-25 International Business Machines Corporation Method for controlling thermal interface gap distance
JP2017059774A (ja) * 2015-09-18 2017-03-23 セイコーインスツル株式会社 電子部品
JP2017126645A (ja) * 2016-01-13 2017-07-20 セイコーインスツル株式会社 電子部品

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6294408B1 (en) * 1999-01-06 2001-09-25 International Business Machines Corporation Method for controlling thermal interface gap distance
WO2000067315A1 (fr) * 1999-05-03 2000-11-09 Stmicroelectronics S.A. Protection d'une puce semiconductrice
JP2017059774A (ja) * 2015-09-18 2017-03-23 セイコーインスツル株式会社 電子部品
JP2017126645A (ja) * 2016-01-13 2017-07-20 セイコーインスツル株式会社 電子部品

Also Published As

Publication number Publication date
JPH0583187B2 (cg-RX-API-DMAC10.html) 1993-11-25

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees