JPH02135141U - - Google Patents
Info
- Publication number
- JPH02135141U JPH02135141U JP4469689U JP4469689U JPH02135141U JP H02135141 U JPH02135141 U JP H02135141U JP 4469689 U JP4469689 U JP 4469689U JP 4469689 U JP4469689 U JP 4469689U JP H02135141 U JPH02135141 U JP H02135141U
- Authority
- JP
- Japan
- Prior art keywords
- electrostatic chuck
- electrostatic
- substrate
- internal electrode
- chuck
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims 1
- 239000003507 refrigerant Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000001179 sorption measurement Methods 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 1
Description
第１図及び第２図は本考案に係る静電チヤツク
の断面図、第３図Ａ及びＢは従来の静電チヤツク
の断面図である。
尚、図面中１……セラミツク基板、１ａ……セ
ラミツク層、２……上部内部電極、３……下部内
部電極、４……固定台、６……冷却水通路、Ｗ…
…ウエハーである。
1 and 2 are sectional views of an electrostatic chuck according to the present invention, and FIGS. 3A and 3B are sectional views of a conventional electrostatic chuck. In the drawings, 1...ceramic substrate, 1a...ceramic layer, 2...upper internal electrode, 3...lower internal electrode, 4...fixing stand, 6...cooling water passage, W...
...It's a wafer.
Claims (1)
いて、前記固定台は導電性材料から構成され、ま
た静電チヤツクの基板内の上部には半導体ウエハ
ー等の試料を静電力によつて吸着するための上部
内部電極を設け、静電チヤツクの基板内の下部に
は基板自体を固定台に静電力によつて吸着させる
下部内部電極を設けたことを特徴とする静電チヤ
ツク。 (2) 前記固定台は内部に冷媒通路が形成されて
いることを特徴とする請求項１に記載の静電チヤ
ツク。[Claims for Utility Model Registration] (1) In an electrostatic chuck that is mounted on a fixed base, the fixed base is made of a conductive material, and a sample such as a semiconductor wafer is mounted on the upper part of the substrate of the electrostatic chuck. The electrostatic chuck is characterized in that an upper internal electrode is provided for adsorption using electrostatic force, and a lower internal electrode is provided at the lower part of the substrate of the electrostatic chuck for adsorbing the substrate itself to a fixing base using electrostatic force. Electric chuck. (2) The electrostatic chuck according to claim 1, wherein the fixing base has a refrigerant passage formed therein.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4469689U JPH0746437Y2 (en) | 1989-04-17 | 1989-04-17 | Electrostatic chuck |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4469689U JPH0746437Y2 (en) | 1989-04-17 | 1989-04-17 | Electrostatic chuck |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02135141U true JPH02135141U (en) | 1990-11-09 |
| JPH0746437Y2 JPH0746437Y2 (en) | 1995-10-25 |
Family
ID=31558227
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4469689U Expired - Lifetime JPH0746437Y2 (en) | 1989-04-17 | 1989-04-17 | Electrostatic chuck |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0746437Y2 (en) |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04300138A (en) * | 1991-03-28 | 1992-10-23 | Shin Etsu Chem Co Ltd | Electrostatic chuck |
| JPH05198663A (en) * | 1992-01-21 | 1993-08-06 | Hitachi Ltd | Sample conveying holder |
| JPH09162272A (en) * | 1995-12-04 | 1997-06-20 | Sony Corp | Electrostatic chuck, thin board holding device, semiconductor manufacturing device, and transfer method |
| JPH11111829A (en) * | 1997-10-06 | 1999-04-23 | Ulvac Corp | Electrostatic sucking hot plate vacuum-treatment apparatus and method for vacuum treatment |
| JP2000288868A (en) * | 1999-04-02 | 2000-10-17 | Honda Motor Co Ltd | Work fixing device with cooling mechanism |
| JP2001144167A (en) * | 1999-11-12 | 2001-05-25 | Ngk Insulators Ltd | Semiconductor holder |
| JP2001189378A (en) * | 1990-12-25 | 2001-07-10 | Ngk Insulators Ltd | Wafer-chucking heating apparatus |
| JP2003100856A (en) * | 2001-09-26 | 2003-04-04 | Kyocera Corp | Wafer supporting member |
| JP2003347396A (en) * | 1990-12-25 | 2003-12-05 | Ngk Insulators Ltd | Wafer chucking heating apparatus and wafer chucking apparatus |
| JP2006344955A (en) * | 2005-06-09 | 2006-12-21 | Ngk Insulators Ltd | Electrostatic chuck |
| WO2011001978A1 (en) * | 2009-07-02 | 2011-01-06 | 株式会社クリエイティブ テクノロジー | Electrostatic attracting structure and fabricating method therefor |
| WO2015111616A1 (en) * | 2014-01-22 | 2015-07-30 | 株式会社アルバック | Plasma treatment device and wafer transportation tray |
| JP2016136552A (en) * | 2015-01-23 | 2016-07-28 | 株式会社日立ハイテクノロジーズ | Plasma processing apparatus |
| JP2018518844A (en) * | 2015-06-11 | 2018-07-12 | フラウンホッファー−ゲゼルシャフト ツァ フェルダールング デァ アンゲヴァンテン フォアシュンク エー．ファオ | Apparatus having a film for electrostatically coupling a substrate to a substrate carrier |
| JP2018206804A (en) * | 2017-05-30 | 2018-12-27 | 東京エレクトロン株式会社 | Electrostatic chuck and plasma processing apparatus |
| JP2018206803A (en) * | 2017-05-30 | 2018-12-27 | 東京エレクトロン株式会社 | Method of operating electrostatic chuck of plasma processing apparatus |
| WO2024004039A1 (en) * | 2022-06-28 | 2024-01-04 | 日本碍子株式会社 | Wafer placement table |
-
1989
- 1989-04-17 JP JP4469689U patent/JPH0746437Y2/en not_active Expired - Lifetime
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001189378A (en) * | 1990-12-25 | 2001-07-10 | Ngk Insulators Ltd | Wafer-chucking heating apparatus |
| JP2003347396A (en) * | 1990-12-25 | 2003-12-05 | Ngk Insulators Ltd | Wafer chucking heating apparatus and wafer chucking apparatus |
| JPH04300138A (en) * | 1991-03-28 | 1992-10-23 | Shin Etsu Chem Co Ltd | Electrostatic chuck |
| JPH05198663A (en) * | 1992-01-21 | 1993-08-06 | Hitachi Ltd | Sample conveying holder |
| JPH09162272A (en) * | 1995-12-04 | 1997-06-20 | Sony Corp | Electrostatic chuck, thin board holding device, semiconductor manufacturing device, and transfer method |
| JPH11111829A (en) * | 1997-10-06 | 1999-04-23 | Ulvac Corp | Electrostatic sucking hot plate vacuum-treatment apparatus and method for vacuum treatment |
| JP2000288868A (en) * | 1999-04-02 | 2000-10-17 | Honda Motor Co Ltd | Work fixing device with cooling mechanism |
| JP2001144167A (en) * | 1999-11-12 | 2001-05-25 | Ngk Insulators Ltd | Semiconductor holder |
| JP4698097B2 (en) * | 2001-09-26 | 2011-06-08 | 京セラ株式会社 | Wafer support member |
| JP2003100856A (en) * | 2001-09-26 | 2003-04-04 | Kyocera Corp | Wafer supporting member |
| JP2006344955A (en) * | 2005-06-09 | 2006-12-21 | Ngk Insulators Ltd | Electrostatic chuck |
| WO2011001978A1 (en) * | 2009-07-02 | 2011-01-06 | 株式会社クリエイティブ テクノロジー | Electrostatic attracting structure and fabricating method therefor |
| WO2015111616A1 (en) * | 2014-01-22 | 2015-07-30 | 株式会社アルバック | Plasma treatment device and wafer transportation tray |
| JP6088670B2 (en) * | 2014-01-22 | 2017-03-01 | 株式会社アルバック | Plasma processing apparatus and wafer transfer tray |
| JPWO2015111616A1 (en) * | 2014-01-22 | 2017-03-23 | 株式会社アルバック | Plasma processing apparatus and wafer transfer tray |
| JP2016136552A (en) * | 2015-01-23 | 2016-07-28 | 株式会社日立ハイテクノロジーズ | Plasma processing apparatus |
| JP2018518844A (en) * | 2015-06-11 | 2018-07-12 | フラウンホッファー−ゲゼルシャフト ツァ フェルダールング デァ アンゲヴァンテン フォアシュンク エー．ファオ | Apparatus having a film for electrostatically coupling a substrate to a substrate carrier |
| US10304714B2 (en) | 2015-06-11 | 2019-05-28 | Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. | Device comprising film for electrostatic coupling of a substrate to a substrate carrier |
| JP2018206804A (en) * | 2017-05-30 | 2018-12-27 | 東京エレクトロン株式会社 | Electrostatic chuck and plasma processing apparatus |
| JP2018206803A (en) * | 2017-05-30 | 2018-12-27 | 東京エレクトロン株式会社 | Method of operating electrostatic chuck of plasma processing apparatus |
| WO2024004039A1 (en) * | 2022-06-28 | 2024-01-04 | 日本碍子株式会社 | Wafer placement table |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0746437Y2 (en) | 1995-10-25 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |