JPH025293U - - Google Patents
Info
- Publication number
- JPH025293U JPH025293U JP8310288U JP8310288U JPH025293U JP H025293 U JPH025293 U JP H025293U JP 8310288 U JP8310288 U JP 8310288U JP 8310288 U JP8310288 U JP 8310288U JP H025293 U JPH025293 U JP H025293U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- substrate
- leads
- upper lid
- lid portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 4
- 238000000926 separation method Methods 0.000 claims description 3
- 238000002788 crimping Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Connecting Device With Holders (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Description
第１図は本考案の実施例を示す半導体装置用ソ
ケツトを示す図、第２図は本考案における分離部
の部分図、第３図は従来の半導体装置用ソケツト
を示す図である。
１……基板部、２……上蓋部、３……分離部、
４……分離板、５……端子部。
FIG. 1 is a diagram showing a socket for a semiconductor device according to an embodiment of the present invention, FIG. 2 is a partial view of a separating section in the present invention, and FIG. 3 is a diagram showing a conventional socket for a semiconductor device. 1...Substrate part, 2...Top lid part, 3...Separation part,
4... Separation plate, 5... Terminal section.
Claims (1)
部を有する基板と、該基板の端子部に前記リード
を圧着する上蓋部と、前記基板と上蓋部の間に、
前記半導体装置の隣接するリード間の接触を防止
するための分離部とを有することを特徴とする半
導体装置用ソケツト。 a substrate having a terminal portion that provides electrical continuity to the leads of the semiconductor device; an upper lid portion for crimping the leads to the terminal portions of the substrate; and between the substrate and the upper lid portion;
1. A socket for a semiconductor device, comprising a separation part for preventing contact between adjacent leads of the semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8310288U JPH025293U (en) | 1988-06-22 | 1988-06-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8310288U JPH025293U (en) | 1988-06-22 | 1988-06-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH025293U true JPH025293U (en) | 1990-01-12 |
Family
ID=31307826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8310288U Pending JPH025293U (en) | 1988-06-22 | 1988-06-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH025293U (en) |
-
1988
- 1988-06-22 JP JP8310288U patent/JPH025293U/ja active Pending