JPS61149345U - - Google Patents
Info
- Publication number
- JPS61149345U JPS61149345U JP3208585U JP3208585U JPS61149345U JP S61149345 U JPS61149345 U JP S61149345U JP 3208585 U JP3208585 U JP 3208585U JP 3208585 U JP3208585 U JP 3208585U JP S61149345 U JPS61149345 U JP S61149345U
- Authority
- JP
- Japan
- Prior art keywords
- conductive terminal
- semiconductor device
- insulating base
- package
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000013459 approach Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本発明の一実施例の上面図、第２図は
従来のパツケージの上面図、第３図は第２図にお
ける―断面図、第４図は第１図における―
断面図である。
１……絶縁基体、２，３，４……導電端子、５
……半導体装置、７……凹部。
Fig. 1 is a top view of an embodiment of the present invention, Fig. 2 is a top view of a conventional package, Fig. 3 is a sectional view of Fig. 2, and Fig. 4 is a sectional view of Fig. 1.
FIG. 1... Insulating base, 2, 3, 4... Conductive terminal, 5
...Semiconductor device, 7...Recess.
Claims (1)
た第１の導電端子と、この第１の導電端子とは離
間して前記絶縁基体の上に固着された第２の導電
端子とを含み、前記第１の導電端子の上に半導体
装置が固着される半導体装置のパツケージにおい
て、 前記第１の導電端子と前記第２の導電端子とが
対向する部分の前記絶縁基体材料が、削除されて
いることを特徴とする半導体装置のパツケージ。 (2) 前記第１の導電端子および前記第２の導電
端子のうち、少なくともどちらか一方の導電端子
の端部は、他方の導電端子に近づくにつれて、端
子幅が小さくなるように形成されていることを特
徴とする実用新案登録請求の範囲第１項記載の半
導体装置のパツケージ。[Claims for Utility Model Registration] (1) An insulating base, a first conductive terminal fixed on the insulating base, and a first conductive terminal fixed on the insulating base at a distance from each other. A package of a semiconductor device including a second conductive terminal and a semiconductor device fixed onto the first conductive terminal, wherein the first conductive terminal and the second conductive terminal face each other. A package for a semiconductor device, wherein the insulating base material is removed. (2) An end of at least one of the first conductive terminal and the second conductive terminal is formed such that the width of the terminal becomes smaller as it approaches the other conductive terminal. A semiconductor device package according to claim 1, characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3208585U JPS61149345U (en) | 1985-03-06 | 1985-03-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3208585U JPS61149345U (en) | 1985-03-06 | 1985-03-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61149345U true JPS61149345U (en) | 1986-09-16 |
Family
ID=30533272
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3208585U Pending JPS61149345U (en) | 1985-03-06 | 1985-03-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61149345U (en) |
-
1985
- 1985-03-06 JP JP3208585U patent/JPS61149345U/ja active Pending