JPH01161331U - - Google Patents
Info
- Publication number
- JPH01161331U JPH01161331U JP5754588U JP5754588U JPH01161331U JP H01161331 U JPH01161331 U JP H01161331U JP 5754588 U JP5754588 U JP 5754588U JP 5754588 U JP5754588 U JP 5754588U JP H01161331 U JPH01161331 U JP H01161331U
- Authority
- JP
- Japan
- Prior art keywords
- bump electrodes
- chip
- circuit device
- semiconductor circuit
- long side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
Description
第１図は、本考案の半導体回路装置上面図。第
２図は、第１図に於けるＸ―Ｘ′の断面図。第３
図は、従来の半導体回路装置上面図。第４図は、
第３図に於けるＹ―Ｙ′の断面図。
１……チツプ、２……チツプ上バンプ電極、３
……基板、４……基板上電極。
FIG. 1 is a top view of the semiconductor circuit device of the present invention. FIG. 2 is a sectional view taken along line X-X' in FIG. Third
The figure is a top view of a conventional semiconductor circuit device. Figure 4 shows
A sectional view taken along YY' in FIG. 3. 1... Chip, 2... Bump electrode on chip, 3
... Substrate, 4... Electrode on the substrate.
Claims (1)
チツプの前記バンプ電極長手配列方向を、対向す
る長方形基板の長辺に対し垂直な方向に配置接続
することを特徴とする半導体回路装置。 1. A semiconductor circuit device characterized in that a chip having bump electrodes arranged longer in one direction than the other is arranged and connected so that the longitudinal arrangement direction of the bump electrodes is perpendicular to the long side of an opposing rectangular substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5754588U JPH01161331U (en) | 1988-04-28 | 1988-04-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5754588U JPH01161331U (en) | 1988-04-28 | 1988-04-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01161331U true JPH01161331U (en) | 1989-11-09 |
Family
ID=31283395
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5754588U Pending JPH01161331U (en) | 1988-04-28 | 1988-04-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01161331U (en) |
-
1988
- 1988-04-28 JP JP5754588U patent/JPH01161331U/ja active Pending