JPH02131332U - - Google Patents
Info
- Publication number
- JPH02131332U JPH02131332U JP1989040233U JP4023389U JPH02131332U JP H02131332 U JPH02131332 U JP H02131332U JP 1989040233 U JP1989040233 U JP 1989040233U JP 4023389 U JP4023389 U JP 4023389U JP H02131332 U JPH02131332 U JP H02131332U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- adhesive
- circuit board
- component according
- adhesive member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 125000006850 spacer group Chemical group 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 7
- 230000001070 adhesive effect Effects 0.000 claims 7
- 239000003990 capacitor Substances 0.000 description 4
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
- Details Of Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案に係る電子部品の１例を示した
電解コンデンサの斜視図、第２図はその電解コン
デンサを回路基板へ取付けた状態を示した断面図
、第３図はその電解コンデンサを用いた電子部品
連の正面図。
１０……電解コンデンサ、１２……スペーサ、
１６……回路基板、２２……リード、２６……帯
状部材、２８……テープ。
Fig. 1 is a perspective view of an electrolytic capacitor that is an example of an electronic component according to the present invention, Fig. 2 is a sectional view showing the electrolytic capacitor attached to a circuit board, and Fig. 3 is a perspective view of the electrolytic capacitor. A front view of the electronic component series used. 10... Electrolytic capacitor, 12... Spacer,
16... Circuit board, 22... Lead, 26... Band member, 28... Tape.
Claims (1)
いて、 前記回路基板と接触する部位に粘着部材を配し
たことを特徴とする電子部品。 ２ 前記粘着部材は前記部位に塗布された非硬化
性の粘着剤であることを特徴とする請求項１記載
の電子部品。 ３ 前記粘着部材は、前記部位に固定され、前記
回路板と接触する面に粘着剤が塗布されたスペー
サであることを特徴とする請求項１記載の電子部
品。 ４ 前記粘着剤は非硬化性の粘着剤であることを
特徴とする請求項３記載の電子部品。 ５ 複数の請求項１，２，３もしくは４の電子部
品のリードを、帯状部材へ連続的にテーピングし
てなることを特徴とする電子部品連。[Claims for Utility Model Registration] 1. An electronic component fixed to and wired to a circuit board, characterized in that an adhesive member is disposed at a portion that comes into contact with the circuit board. 2. The electronic component according to claim 1, wherein the adhesive member is a non-curing adhesive applied to the portion. 3. The electronic component according to claim 1, wherein the adhesive member is a spacer fixed to the portion and having an adhesive coated on a surface that contacts the circuit board. 4. The electronic component according to claim 3, wherein the adhesive is a non-curing adhesive. 5. An electronic component series characterized in that a plurality of leads of the electronic components according to claims 1, 2, 3, or 4 are continuously taped to a band-shaped member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989040233U JPH02131332U (en) | 1989-04-05 | 1989-04-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989040233U JPH02131332U (en) | 1989-04-05 | 1989-04-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02131332U true JPH02131332U (en) | 1990-10-31 |
Family
ID=31549847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989040233U Pending JPH02131332U (en) | 1989-04-05 | 1989-04-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02131332U (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS583031B2 (en) * | 1980-10-14 | 1983-01-19 | 工業技術院長 | Method for manufacturing boride coated metal |
| JPS62271414A (en) * | 1987-04-16 | 1987-11-25 | ニチコン株式会社 | Electronic parts chain |
| JPS6489241A (en) * | 1987-09-30 | 1989-04-03 | Sony Corp | Knocking treatment method for cathode-ray tube |
-
1989
- 1989-04-05 JP JP1989040233U patent/JPH02131332U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS583031B2 (en) * | 1980-10-14 | 1983-01-19 | 工業技術院長 | Method for manufacturing boride coated metal |
| JPS62271414A (en) * | 1987-04-16 | 1987-11-25 | ニチコン株式会社 | Electronic parts chain |
| JPS6489241A (en) * | 1987-09-30 | 1989-04-03 | Sony Corp | Knocking treatment method for cathode-ray tube |