JPH01129817U - - Google Patents

Info

Publication number
JPH01129817U
JPH01129817U JP2469688U JP2469688U JPH01129817U JP H01129817 U JPH01129817 U JP H01129817U JP 2469688 U JP2469688 U JP 2469688U JP 2469688 U JP2469688 U JP 2469688U JP H01129817 U JPH01129817 U JP H01129817U
Authority
JP
Japan
Prior art keywords
external electrodes
solder
adhere
edge
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2469688U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2469688U priority Critical patent/JPH01129817U/ja
Publication of JPH01129817U publication Critical patent/JPH01129817U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Details Of Resistors (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例を示す斜視図、第２
図は同上の断面図、第３図は従来例の斜視図であ
る。 １……電子部品素子、２……外部電極、２ａ…
…縁部、３……はんだの付着しない塗膜。 Fig. 1 is a perspective view showing one embodiment of the present invention;
The figure is a sectional view of the same as above, and FIG. 3 is a perspective view of the conventional example. 1...Electronic component element, 2...External electrode, 2a...
...Edge, 3... Paint film to which solder does not adhere.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電子部品素子の表面に複数個の外部電極を形成
し、このうち少なくとも１つの外部電極の他の外
部電極と隣り合つている縁部をはんだの付着しな
い塗膜により被覆して成ることを特徴とするチツ
プ型電子部品。 A plurality of external electrodes are formed on the surface of an electronic component element, and an edge of at least one of the external electrodes adjacent to another external electrode is coated with a coating film to which solder does not adhere. Chip-type electronic components.
JP2469688U 1988-02-25 1988-02-25 Pending JPH01129817U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2469688U JPH01129817U (en) 1988-02-25 1988-02-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2469688U JPH01129817U (en) 1988-02-25 1988-02-25

Publications (1)

Publication Number Publication Date
JPH01129817U true JPH01129817U (en) 1989-09-04

Family

ID=31244770

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2469688U Pending JPH01129817U (en) 1988-02-25 1988-02-25

Country Status (1)

Country Link
JP (1) JPH01129817U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11168001A (en) * 1997-12-04 1999-06-22 Hitachi Ltd Electronic component and electronic device
JP2018056505A (en) * 2016-09-30 2018-04-05 太陽誘電株式会社 Surface-mounting type coil component

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01164012A (en) * 1987-12-21 1989-06-28 Tdk Corp Structure of external terminal electrode of lamination application component

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01164012A (en) * 1987-12-21 1989-06-28 Tdk Corp Structure of external terminal electrode of lamination application component

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11168001A (en) * 1997-12-04 1999-06-22 Hitachi Ltd Electronic component and electronic device
JP2018056505A (en) * 2016-09-30 2018-04-05 太陽誘電株式会社 Surface-mounting type coil component
US10672555B2 (en) 2016-09-30 2020-06-02 Taiyo Yuden Co., Ltd. Surface-mountable coil element

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