JPH02130849A - Conveyor - Google Patents

Conveyor

Info

Publication number
JPH02130849A
JPH02130849A JP63283652A JP28365288A JPH02130849A JP H02130849 A JPH02130849 A JP H02130849A JP 63283652 A JP63283652 A JP 63283652A JP 28365288 A JP28365288 A JP 28365288A JP H02130849 A JPH02130849 A JP H02130849A
Authority
JP
Japan
Prior art keywords
article
conveyance
pins
conveying
drive device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63283652A
Other languages
Japanese (ja)
Inventor
Toshifumi Koike
敏文 小池
Hiromitsu Tokimatsu
裕充 時末
Nobuo Tsumaki
妻木 伸夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP63283652A priority Critical patent/JPH02130849A/en
Publication of JPH02130849A publication Critical patent/JPH02130849A/en
Pending legal-status Critical Current

Links

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Pusher Or Impeller Conveyors (AREA)
  • Specific Conveyance Elements (AREA)

Abstract

PURPOSE:To provide a conveyor for cleanly conveying an article of an arbitrary shape with its lower face being planar and effectively controlling its speed by laterally splitting one side of a conveying face or the conveying face, and providing its center with a driver for applying a conveying direction force to the article in contact with one side of the article. CONSTITUTION:A semiconductor wafer 1 is floated and supported on a conveying face 3 by injected gas from first gas injection holes 4, and pressed to a driver 6 side by the injected gas from second gas injection holes 5. That is, the part of the outer surface of the wafer 1 is brought into contact with two pins 7, and the wafer 1 is held in the shape interposed between the pins 7. Then, when an actuator 8 of the driver 6 is driven to move the pins 7, the wafer 1 is conveyed together with the pins 7. In this case, since the interval L of the two pins 7 of the driver 6 is sufficiently wide, the wafer 1 is stably held by the pins 7. The start, acceleration, deceleration, stop and positioning of the wafer 1 can be facilitated by the speed control of the driver 6.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は物品の搬送装置に係り、特にクリーン度を要求
される半導体ウェハ、液晶用ガラス基板。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to an article conveyance device, and particularly to semiconductor wafers and liquid crystal glass substrates that require high cleanliness.

磁気ディスク等の搬送に好適な搬送装置に関する。The present invention relates to a transport device suitable for transporting magnetic disks and the like.

(従来の技術〕 従来の装置は、特開昭61−279149号公報に記載
のように、搬送面を重力方向に対し傾斜配置し。
(Prior Art) In a conventional device, as described in Japanese Unexamined Patent Publication No. 61-279149, the conveyance surface is arranged at an angle with respect to the direction of gravity.

半導体ウェハ外周部に設けられたオリエンテーションフ
ラット部を搬送ベルトに接触させて、搬送ベルトを駆動
することにより半導体ウェハを搬送する構成となってい
た。
The semiconductor wafer is conveyed by bringing an orientation flat portion provided on the outer periphery of the semiconductor wafer into contact with the conveyor belt and driving the conveyor belt.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上記の従来技術は、搬送の駆動力を搬送ベルトにより半
導体ウェハの外周部に作業させるため、半導体ウェハを
回転させようとする力が発生する。
In the above-mentioned conventional technology, the driving force for conveyance is applied to the outer peripheral portion of the semiconductor wafer using a conveyor belt, so that a force that attempts to rotate the semiconductor wafer is generated.

このため、大きな加速度が発生する搬送の始動。Therefore, the start of conveyance generates a large acceleration.

加速、減速、停止時に、半導体ウェハが回転を始めオリ
エンテーションフラット部が搬送ベルトから離れ、半導
体ウェハへ安定した駆動力を作用させることができず、
安定な搬送が不能となる問題があった。また、被搬送物
である物品の外縁部に直線部が設けられていないと安定
な搬送は行えず、例えば磁気ディスクのように完全に円
形の物品の搬送は不可能である。
When accelerating, decelerating, or stopping, the semiconductor wafer begins to rotate and the orientation flat section separates from the conveyor belt, making it impossible to apply a stable driving force to the semiconductor wafer.
There was a problem that stable transportation was impossible. Further, unless a straight line portion is provided on the outer edge of the article to be conveyed, stable conveyance cannot be performed, and for example, it is impossible to convey a completely circular article such as a magnetic disk.

本発明の目的は、下面が平面である任意形状の物品をク
リーンに搬送すると共に、速度制御すなわち、始動、加
速、減速、停止2位置決めを確実に行える信頼性の高い
搬送装置を提供することにある。
An object of the present invention is to provide a highly reliable conveying device that can cleanly convey articles of any shape with a flat bottom surface and can reliably perform speed control, that is, starting, accelerating, decelerating, stopping, and positioning. be.

〔課題を解決するための手段〕[Means to solve the problem]

上記目的を達成するために、物品の下面を支える水平に
設置した搬送面と、この搬送面に設けられ物品の下面に
向って気体を噴出する複数の噴出孔とを備える移送装置
において、前記搬送面の一方側、または前記搬送面を左
右に2分割しその中央部に、物品の一側面に接触して物
品に搬送方向力を付与する駆動装置を設けたものである
。さらに、確実な搬送を行うために、前記駆動装置の物
品との接触部は、物品を安定して搬送できるように配置
した複数のピンとし、このピンに物品を押し付けるため
の押し付け力を付与する手段を設けたものである。
In order to achieve the above object, in a transfer device comprising a horizontally installed conveying surface that supports the lower surface of the article, and a plurality of ejection holes provided on this conveying surface and ejecting gas toward the lower surface of the article, the conveyor A drive device is provided on one side of the surface, or in the center of the transport surface divided into left and right halves, for contacting one side of the article and applying a force in the conveyance direction to the article. Furthermore, in order to carry out reliable conveyance, the contact portion of the drive device with the article has a plurality of pins arranged so as to be able to stably convey the article, and a pressing force for pressing the article is applied to the pins. This means that a means has been established.

〔作用〕[Effect]

物品は、搬送面に設けた噴出孔からの噴出気体によって
搬送面上に浮上支持されると共に、物品の一側面が駆動
装置に接触する。そして、この駆動装置の駆動により物
品は駆動装置の移動と共に移動する。また、物品と接触
するピンは、物品を安定して駆動できるように物品の形
状に合すせて配置されており、さらに物品に安定した搬
送方向力を付与するように物品を駆動装置側へ押し付け
るための手段を設けである。これにより、物品と駆動装
置との摺動によるごみの発生を抑えることができる。ま
た、駆動装置の速度制御により、物品の始動;加速、減
速、停止2位置決めを安定に行うことができる。
The article is floated and supported on the conveyance surface by gas ejected from the jet holes provided on the conveyance surface, and one side of the article comes into contact with the drive device. By driving the drive device, the article moves along with the movement of the drive device. In addition, the pins that come into contact with the article are arranged to match the shape of the article so that the article can be driven stably, and the article is moved toward the drive device so as to apply a stable conveyance direction force to the article. A means for pressing is provided. Thereby, generation of dust due to sliding between the article and the drive device can be suppressed. Further, by controlling the speed of the drive device, starting, accelerating, decelerating, stopping, and positioning of the article can be performed stably.

〔実施例〕〔Example〕

以下本発明の実施例を図面を参照して説明する。 Embodiments of the present invention will be described below with reference to the drawings.

第1図、第2図は本発明の装置の一実施例を示すもので
、これらの図において1は被搬送物である物品で、この
例では円形状の物品、例えば半導体ウェハを示しである
。2は搬送路、3は搬送路2に形成された水平平面の搬
送面、4は搬送面3に設けられた第1の気体噴出孔で、
この気体噴出孔4は搬送面3に対して直角に設けられて
いる。
FIGS. 1 and 2 show an embodiment of the apparatus of the present invention, and in these figures, reference numeral 1 indicates an article to be transported, and in this example, a circular article such as a semiconductor wafer is shown. . 2 is a conveyance path, 3 is a horizontal flat conveyance surface formed in the conveyance path 2, 4 is a first gas ejection hole provided in the conveyance surface 3,
This gas ejection hole 4 is provided at right angles to the conveying surface 3.

5は搬送面3に設けられた第2の気体噴出孔で。5 is a second gas ejection hole provided on the conveyance surface 3;

この気体噴出孔5は搬送面3に対し斜めに設けられてい
る。6は搬送面3の一方側に接近して設けられた駆動装
置で、この駆動装置6は搬送面3よりわずかに上部に突
出した2本のピン7とこのピン7を駆動するアクチエー
タ8とで構成されている。この駆動装置6におけるピン
7には半導体ウェハ1の外周部が接触し、ピン7の間隔
りは本実施例で示した円形物品1例えば半導体ウェハ1
の場合は0.6D<L<0.8D程度に設定するのが好
ましい、また、駆動装[6のアクチエータ8はリニアモ
ータ、エアシリンダ、ボールねじ等速度制御が可能なア
クチエータで構成すればよい。
This gas ejection hole 5 is provided diagonally with respect to the conveying surface 3. Reference numeral 6 denotes a drive device provided close to one side of the conveyance surface 3, and this drive device 6 consists of two pins 7 projecting slightly above the conveyance surface 3 and an actuator 8 that drives the pins 7. It is configured. The outer periphery of the semiconductor wafer 1 comes into contact with the pins 7 in this driving device 6, and the intervals between the pins 7 are determined by the diameter of the circular article 1, for example, the semiconductor wafer 1 shown in this embodiment.
In this case, it is preferable to set the value to about 0.6D<L<0.8D, and the actuator 8 of the drive device [6 may be composed of a linear motor, an air cylinder, or an actuator that can control the constant speed of a ball screw. .

次に、上述した本発明の装置の一実施例の動作を説明す
る。
Next, the operation of one embodiment of the above-mentioned apparatus of the present invention will be explained.

半導体ウェハ1は、第1の気体噴出孔4からの噴出気体
により搬送面3上に浮上支持されると共に、第2の気体
噴出孔5からの噴出気体により駆動装置6側に押し付け
られる。すなわち、半導体ウェハ1の外周部の一部が2
本のピン7に接触し、半導体ウェハ1はピン7にはさま
れた形で保持される。次に、駆動装!!!6におけるア
クチエータ8を駆動し、ピン7を移動させれば、このピ
ン7と共に半導体ウェハ1は搬送される。このとき、駆
動装置6の2本のピン7の間隔りは十分に広いので、半
導体ウェハ1はピン7に安定に保持される。
The semiconductor wafer 1 is floated and supported on the transfer surface 3 by the gas ejected from the first gas ejection hole 4, and is pressed against the driving device 6 by the ejected gas from the second gas ejection hole 5. That is, a part of the outer circumference of the semiconductor wafer 1 is
The semiconductor wafer 1 is held in contact with the pins 7 of the book and is held between the pins 7. Next, the drive gear! ! ! When the actuator 8 at 6 is driven to move the pin 7, the semiconductor wafer 1 is transported together with the pin 7. At this time, since the distance between the two pins 7 of the drive device 6 is sufficiently wide, the semiconductor wafer 1 is stably held by the pins 7.

また、駆動装置6の速度制御により、半導体ウェハ1の
始動、加速、減速、停止1位置決めを容易に行うことが
できる。
Further, by controlling the speed of the drive device 6, starting, accelerating, decelerating, stopping, and positioning of the semiconductor wafer 1 can be easily performed.

このような構成したことにより、半導体ウェハ1の移送
時、半導体ウェハ1は第2の気体噴出孔5からの噴出気
体により発生する軽微な力で駆動装置6に設けたピン7
に押し付けられた状態でピン7と共に移動するので、半
導体ウェハ1をクリーンな状態でかつ、チッピング等の
ダメージを与えることなく搬送することができると共に
、その搬送速度制御も確実に行うことができる。また、
駆動袋w6が搬送面3より下部に設置されるので、これ
らの要素から出る塵埃がウェハ面に付着する可能性を小
さくすることができる。
With this configuration, when the semiconductor wafer 1 is transferred, the semiconductor wafer 1 is moved by the pins 7 provided in the drive device 6 with a slight force generated by the gas ejected from the second gas ejection hole 5.
Since the semiconductor wafer 1 moves together with the pins 7 while being pressed against it, the semiconductor wafer 1 can be transported in a clean state without damage such as chipping, and the transport speed can also be controlled reliably. Also,
Since the drive bag w6 is installed below the transport surface 3, it is possible to reduce the possibility that dust from these elements will adhere to the wafer surface.

第3図は、本発明の装置の他の実施例を示すもので、こ
の図において第1図と同符号のものは同一部分である。
FIG. 3 shows another embodiment of the apparatus of the present invention, in which the same reference numerals as in FIG. 1 indicate the same parts.

9は、被搬送物である矩形状の物品で、例えば液晶表示
装置用のガラス基板である。
Reference numeral 9 denotes a rectangular article to be transported, such as a glass substrate for a liquid crystal display device.

この実施例は、搬送面3の一方側に接近して設けられた
駆動袋M6に、ガラス基板9の一辺9aに接触して物品
を保持する保持ピン7aと、ガラス基板9の搬送方向に
対し前後の辺9bに接触して搬送方向力を付与する駆動
ピン7btI:IRけたものである。この実施例によれ
ば、搬送方向力が駆動ピン7bによりガラス基板9に作
用するため、搬送速度制御を確実に行うことができる。
In this embodiment, a driving bag M6 provided close to one side of the conveying surface 3 has a holding pin 7a that contacts one side 9a of the glass substrate 9 to hold the article, and a holding pin 7a that holds the article in contact with one side 9a of the glass substrate 9, and The drive pin 7btI is an IR-shaped drive pin that contacts the front and rear sides 9b and applies a force in the conveying direction. According to this embodiment, since the force in the transport direction is applied to the glass substrate 9 by the drive pin 7b, the transport speed can be controlled reliably.

第4WIは本発明の装置の他の実施例を示すもので、こ
の図において第1図と同符号のものは同一部分である。
No. 4 WI shows another embodiment of the apparatus of the present invention, and in this figure, the same reference numerals as in FIG. 1 are the same parts.

この実施例は、搬送面3を物品の搬送方向に対し左右2
分割した搬送面3日と3bで形成し、左右の搬送面3a
、3bの中央部3cに物品に搬送方向力を付与する駆動
袋516を設け。
In this embodiment, the conveyance surface 3 is arranged on the left and right sides with respect to the conveyance direction of the article.
It is formed by divided transport surfaces 3 and 3b, and the left and right transport surfaces 3a
, 3b is provided with a driving bag 516 in the central portion 3c for applying a force in the conveying direction to the article.

ドーナツ状の被搬送物、例えば磁気ディスク10の内周
面10aを駆動装置6の2本のピン7に接触させるよう
にしたものである。この実施例によれば、磁気ディスク
10の内周面にピン7が接触しているため、磁気ディス
ク10が搬送面3から脱落する可能性が皆無となり、よ
り信頼性の高い搬送が行える。さらに、駆動装置6のピ
ン7を第5図で示すように制御可能な可動機構を有する
可動部材11で支持することにより、磁気ディスク10
の内周面10aへのピン7の接触力を制御することがで
き、磁気ディスク10の内周面10aヘダメージを与え
ることなく磁気ディスク10の搬送が可能となると共に
、可動部材11を破線の如く動かすことにより、磁気デ
ィスク10の搬送面3上へのロード、アンロードを容易
に行うことができる。可動部材11は、制御可能なバイ
モルフ形圧電素子、形状記憶合金、バイメタル等で構成
すれば良い。
The inner circumferential surface 10a of a donut-shaped object to be transported, for example, a magnetic disk 10, is brought into contact with two pins 7 of a drive device 6. According to this embodiment, since the pins 7 are in contact with the inner peripheral surface of the magnetic disk 10, there is no possibility that the magnetic disk 10 will fall off the conveyance surface 3, and more reliable conveyance can be achieved. Further, by supporting the pin 7 of the drive device 6 with a movable member 11 having a controllable movable mechanism as shown in FIG.
The contact force of the pin 7 to the inner circumferential surface 10a of the magnetic disk 10 can be controlled, and the magnetic disk 10 can be transported without damaging the inner circumferential surface 10a of the magnetic disk 10. By moving the magnetic disk 10, it is possible to easily load and unload the magnetic disk 10 onto and from the transport surface 3. The movable member 11 may be made of a controllable bimorph piezoelectric element, a shape memory alloy, a bimetal, or the like.

第5図、第6図は本発明の装置の他の実施例を示すもの
で、この図において第1図と同符号のものは同一部分で
ある。水平平面に形成された搬送面3の一方側に接近し
て駆動装置6が設けられており、搬送面3のもう一方側
には駆動装置6に対向して押し付け装置!13が設けら
れている。この押し付け装置13は可動機構15を有す
る押し付けピン12とこの押し付けピン12を駆動装置
6と同一速度同一方向へ動作させるための駆動機構14
とて構成されている。押し付け装置L13における押し
付けピン12は半導体ウェハ1の外周部に接触して、半
導体ウェハ1を駆動袋w6のピン7に押し付ける。押し
付けピン12の押し付け力は可動機構15の7クチユエ
ータ15aにより制御され半導体ウェハの外周部にチッ
ピング等のダメージを与すないようになっている0本実
施例によれば、被搬送物である半導体ウェハ1をピン7
と押し付けピン12とで確実に保持した状態で搬送を行
うので、第1図の実施例で示した噴出気体により押し付
け力を作用させる場合よりもさらに信頼性の高い確実な
搬送制御が実現できる。また。
5 and 6 show other embodiments of the apparatus of the present invention, and in these figures, the same reference numerals as in FIG. 1 are the same parts. A driving device 6 is provided close to one side of the conveying surface 3 formed in a horizontal plane, and a pressing device is provided opposite to the driving device 6 on the other side of the conveying surface 3! 13 are provided. This pressing device 13 includes a pressing pin 12 having a movable mechanism 15 and a driving mechanism 14 for moving this pressing pin 12 at the same speed and in the same direction as the driving device 6.
It is made up of. The pressing pins 12 in the pressing device L13 contact the outer peripheral portion of the semiconductor wafer 1 and press the semiconductor wafer 1 against the pins 7 of the driving bag w6. The pressing force of the pressing pins 12 is controlled by the cutter 15a of the movable mechanism 15 so as not to cause damage such as chipping to the outer periphery of the semiconductor wafer. wafer 1 to pin 7
Since the conveyance is carried out while being securely held by the pressing pins 12, more reliable and reliable conveyance control can be realized than when the pressing force is applied by the ejected gas as shown in the embodiment of FIG. Also.

上述のように押し付ピン12は軽微な力で半導体ウェハ
1を押しているので、被搬送物にダメージを与えずクリ
ーンな搬送を行うことができる。なお、可動機構15は
第5図で示した可動部材11にしアクチュエータ15a
は省略した構成にすることも可能である。
As described above, the pressing pins 12 press the semiconductor wafer 1 with a slight force, so that the object to be transported can be transported cleanly without being damaged. Note that the movable mechanism 15 is the movable member 11 shown in FIG.
It is also possible to have a configuration in which is omitted.

上述した実施例においては、被搬送物の形状を円形また
は矩形に限定して説明したが、駆動装置のピンを適切に
配置することにより、底面が平面の任意形状の物品のク
リーンで確実な搬送行うことができる。
In the above embodiments, the shape of the transported object was limited to a circular or rectangular shape, but by appropriately arranging the pins of the drive device, it is possible to cleanly and reliably transport objects of any shape with a flat bottom surface. It can be carried out.

〔発明の効果〕〔Effect of the invention〕

以上述べたように1本発明によれば、物品を搬送面上に
浮上支持し、かつ物品の側面の一部のみを駆動装置に接
触させて搬送することができるので、駆動装置の制御に
より物品の搬送制御すなわち、始動、加速、減速、停止
9位置決めを安定に行うことができると共に、クリーン
な搬送を実現できる。
As described above, according to one aspect of the present invention, it is possible to float and support an article on a conveyance surface and convey it with only a part of the side surface of the article in contact with the drive device, so that the article can be conveyed by controlling the drive device. Transport control, that is, starting, acceleration, deceleration, and stop positioning, can be performed stably, and clean transport can be achieved.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の装置の一実施例を一部断面にして示す
斜視図、第2図は第1図の平面図、第3図は本発明の装
置の他の実施例を示す平面図、第4図は本発明の装置の
他の実施例を示す平面図、第5図は第4図の1−1断面
図、第6図は本発明の他の実施例を示す平面図、第7図
は第6図の■−■断面図である。 1・・・半導体ウェハ、2・・・搬送路、3・・・搬送
面、4・・・第1の気体噴出孔、5・・・第2の気体噴
出孔、6・・・駆動装置、7−′−ピン、8・・・アク
チュエータ、9・・・ガラス基板、10・・・磁気ディ
スク、12・・・押し付けピン、13・・・押し付け装
w1゜図 79−、イ保ネ(トご2・ 7b・−・馬ト勧ごン q・・・ケ欣基板
FIG. 1 is a partially sectional perspective view of one embodiment of the device of the present invention, FIG. 2 is a plan view of FIG. 1, and FIG. 3 is a plan view of another embodiment of the device of the present invention. , FIG. 4 is a plan view showing another embodiment of the device of the present invention, FIG. 5 is a sectional view taken along line 1-1 of FIG. 4, and FIG. FIG. 7 is a sectional view taken along the line ■-■ in FIG. 6. DESCRIPTION OF SYMBOLS 1... Semiconductor wafer, 2... Conveyance path, 3... Conveyance surface, 4... First gas ejection hole, 5... Second gas ejection hole, 6... Drive device, 7-'-pin, 8... actuator, 9... glass substrate, 10... magnetic disk, 12... pressing pin, 13... pressing device w1゜Fig. 2. 7b --- Mato Kangonq... Keshin board

Claims (1)

【特許請求の範囲】 1、物品の下面を支える搬送面と、この搬送面に設けら
れ物品の下面に向つて気体を噴出する複数の噴出孔とを
備える搬送装置において、前記搬送面の一方側に、物品
の一側面に接触して物品に搬送方向力を付与する駆動装
置を搬送面より下部に設けたことを特徴とする搬送装置
。 2、前記搬送面を、物品の搬送方向に対し左右2分割に
形成し、左右の搬送面の中央部に物品の一側面に接触し
て物品に搬送方向力を付与する駆動装置を設けたことを
特徴とする請求項の2記載の搬送装置。 3、前記搬送面を水平平面に形成し、この水平平面の搬
送面に、物品を駆動装置側へ押し付ける力を発生する複
数の気体噴出孔を設けたことを特徴とする請求項3記載
の搬送装置。 4、前記搬送面を水平に形成し、前記駆動装置に対向し
た前記搬送面の一方側に、前記駆動装置と同一速度で同
一方向へ動き、物品を駆動装置へ押し付けるための押し
付け装置を設けたことを特徴とする請求項2記載の搬送
装置。 5、駆動装置は、前記搬送面よりわずかに上部へ突出し
て設けられ、物品に接触する複数のピンと、このピンを
支持し駆動するアクチエータとで構成したことを特徴と
する請求項3または4記載の搬送装置。
[Claims] 1. In a conveyance device comprising a conveyance surface supporting the lower surface of the article and a plurality of ejection holes provided on the conveyance surface and ejecting gas toward the lower surface of the article, one side of the conveyance surface A conveyance device characterized in that a drive device is provided below the conveyance surface for contacting one side of the article and applying a force in the conveyance direction to the article. 2. The conveyance surface is formed into left and right halves with respect to the conveyance direction of the article, and a drive device is provided in the center of the left and right conveyance surfaces for contacting one side of the article and applying a force in the conveyance direction to the article. The conveying device according to claim 2, characterized in that: 3. The conveying device according to claim 3, wherein the conveying surface is formed as a horizontal plane, and a plurality of gas jet holes are provided on the horizontal plane conveying surface to generate a force that presses the article toward the drive device. Device. 4. The conveyance surface is formed horizontally, and a pressing device is provided on one side of the conveyance surface facing the drive device to move in the same direction at the same speed as the drive device and press the article against the drive device. The conveying device according to claim 2, characterized in that: 5. Claim 3 or 4, characterized in that the drive device is constructed of a plurality of pins that are provided to protrude slightly above the conveyance surface and come into contact with the article, and an actuator that supports and drives the pins. conveyance device.
JP63283652A 1988-11-11 1988-11-11 Conveyor Pending JPH02130849A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63283652A JPH02130849A (en) 1988-11-11 1988-11-11 Conveyor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63283652A JPH02130849A (en) 1988-11-11 1988-11-11 Conveyor

Publications (1)

Publication Number Publication Date
JPH02130849A true JPH02130849A (en) 1990-05-18

Family

ID=17668298

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63283652A Pending JPH02130849A (en) 1988-11-11 1988-11-11 Conveyor

Country Status (1)

Country Link
JP (1) JPH02130849A (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000012416A1 (en) * 1998-08-31 2000-03-09 Kabushiki Kaisha Watanabe Shoko Float transport device and float transport system
EP1109206A1 (en) * 1999-12-16 2001-06-20 Infineon Technologies AG Apparatus and process for mounting of lead frames
JP2004168496A (en) * 2002-11-20 2004-06-17 Kawaju Plant Kk Vertical type conveyance apparatus for plate-shaped material
JP2006210393A (en) * 2005-01-25 2006-08-10 Dainippon Printing Co Ltd Substrate processing apparatus, substrate transfer apparatus and substrate control method
JPWO2005074020A1 (en) * 2004-01-30 2007-09-13 シャープ株式会社 Semiconductor manufacturing apparatus and semiconductor manufacturing method using the same
JP2007246287A (en) * 2007-05-28 2007-09-27 Kawasaki Plant Systems Ltd Vertical conveyance apparatus for plate material
JP2008195541A (en) * 2008-03-31 2008-08-28 Watanabe Shoko:Kk Floatation transport device and floatation transport system
JP2008273672A (en) * 2007-04-27 2008-11-13 Airtech Japan Ltd Device for braking article to be conveyed in floating conveyor
US7645111B2 (en) * 2002-11-05 2010-01-12 Central Glass Company, Limited System for putting glass plates to target positions
WO2010145787A1 (en) * 2009-06-19 2010-12-23 Rena Gmbh Process module for the inline-treatment of substrates
KR101341208B1 (en) * 2011-02-15 2013-12-12 박봉선 Pneumatic Apparatus For Floating And Translating Plates
JP2014123769A (en) * 2014-03-06 2014-07-03 Tokyo Ohka Kogyo Co Ltd Ultraviolet irradiation device and ultraviolet irradiation method

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000012416A1 (en) * 1998-08-31 2000-03-09 Kabushiki Kaisha Watanabe Shoko Float transport device and float transport system
EP1109206A1 (en) * 1999-12-16 2001-06-20 Infineon Technologies AG Apparatus and process for mounting of lead frames
US7645111B2 (en) * 2002-11-05 2010-01-12 Central Glass Company, Limited System for putting glass plates to target positions
JP2004168496A (en) * 2002-11-20 2004-06-17 Kawaju Plant Kk Vertical type conveyance apparatus for plate-shaped material
JPWO2005074020A1 (en) * 2004-01-30 2007-09-13 シャープ株式会社 Semiconductor manufacturing apparatus and semiconductor manufacturing method using the same
US7918939B2 (en) 2004-01-30 2011-04-05 Sharp Kabushiki Kaisha Semiconductor manufacturing apparatus and semiconductor manufacturing method using the same
JP4542043B2 (en) * 2004-01-30 2010-09-08 シャープ株式会社 Semiconductor manufacturing apparatus and semiconductor manufacturing method using the same
JP2006210393A (en) * 2005-01-25 2006-08-10 Dainippon Printing Co Ltd Substrate processing apparatus, substrate transfer apparatus and substrate control method
JP2008273672A (en) * 2007-04-27 2008-11-13 Airtech Japan Ltd Device for braking article to be conveyed in floating conveyor
JP4623443B2 (en) * 2007-04-27 2011-02-02 日本エアーテック株式会社 Conveyed object braking device in levitation conveying device
JP4590570B2 (en) * 2007-05-28 2010-12-01 カワサキプラントシステムズ株式会社 Vertical conveying device for plate material
JP2007246287A (en) * 2007-05-28 2007-09-27 Kawasaki Plant Systems Ltd Vertical conveyance apparatus for plate material
JP2008195541A (en) * 2008-03-31 2008-08-28 Watanabe Shoko:Kk Floatation transport device and floatation transport system
WO2010145787A1 (en) * 2009-06-19 2010-12-23 Rena Gmbh Process module for the inline-treatment of substrates
CN102804331A (en) * 2009-06-19 2012-11-28 睿纳有限责任公司 Process Module For The Inline-treatment Of Substrates
TWI494978B (en) * 2009-06-19 2015-08-01 Rena Gmbh Processing module for single-row processing substrate
KR101341208B1 (en) * 2011-02-15 2013-12-12 박봉선 Pneumatic Apparatus For Floating And Translating Plates
JP2014123769A (en) * 2014-03-06 2014-07-03 Tokyo Ohka Kogyo Co Ltd Ultraviolet irradiation device and ultraviolet irradiation method

Similar Documents

Publication Publication Date Title
JPH02130849A (en) Conveyor
TWI328265B (en)
TWI393205B (en) Substrate transmission apparatus and substrate transmission method
JP2001196438A (en) Apparatus for conveying thin plate-like material
JP2004083180A (en) Transporting method and device for sheet-form base board
JP2001233452A (en) Constant point carrying device for thin plate
JP2008162783A (en) Sucking/holding device and sucking/holding method
WO2000003428A1 (en) Substrate transfer device and operating method thereof
JP4032778B2 (en) Plate member conveying device
JPH08236597A (en) Transfer device
US7192242B2 (en) Work attracting apparatus and work attracting method
JPS6374816A (en) Transportation device
JPH09278179A (en) Carrying device
JPH06340333A (en) Conveying device by gas flow
JP4307653B2 (en) Substrate support device and substrate transfer mechanism
JP3976170B2 (en) Thin article positioning device
JPH07176595A (en) Board conveyer
JP2001087973A (en) Transporting pallet, transporting device equipped with pallet, and work fixing method
KR102304578B1 (en) Scribing appatus
JP6831035B1 (en) Individual piece manufacturing method and individual piece manufacturing equipment
JP2001326272A (en) Tray for conveying base plate
JPS6127830A (en) Inversion of carrying direction of substrate and device thereof
JPH10152225A (en) Carrying device for semi-conductor device
JPH1041691A (en) Substrate transfer device and substrate positioning device
JP2000038218A (en) Moving device and moving method for article