JPH1041691A - Substrate transfer device and substrate positioning device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize a substrate transfer device which is capable of lessening the bearing area of a substrate against a belt and stably transferring the substrates when the substrates are transferred by the use of a belt, by a method wherein a step is provided to the belt, so as to mount the substrate at a position higher than a groove cut for making the belt pass at a right angle with a guide plane. SOLUTION: A substrate 1 is placed on a belt 5, and a stepped part is provided to the surface of the belt 5 which the board 1 bears against so as to set a tread 9 of the stepped part higher than the rest of the belt surface which passes in a groove 8. The substrate 1 is placed on the tread 9 of the stepped part in transit, so that it hardly gets into the groove 8 and is stably transferred as guided by a pair of guide walls which are separated from each other by a certain distance conforming to the width of the substrate 1 and fronting each other. By this setup, substrates can be stably transferred by ensuring their rear side of a space large enough for mounting parts without, getting into a groove.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a substrate transport device for transporting a printed circuit board mounted on a belt by moving the belt and a substrate positioning device for positioning a substrate on the belt.

[0002]

2. Description of the Related Art As a device for transporting a printed circuit board of this kind, there has been proposed a device having a cross section shown in FIG.

In this type of apparatus, a flat belt 101 is provided so that the substrate 100 can be stably transported without the belt coming off.
Is used. However, when the substrate is transported by the flat belt 101 having a certain width, the flat belt 101
Since electronic components cannot be mounted on the back surface of the portion placed above, there is a problem that the space of the substrate 100 cannot be effectively used. When the substrate end face is not just the guide in its substrate width, the width direction of the position of the substrate is not stable, that all of the absolutely flat belt 101 because there is a risk that falls from the belt 101 must hit the rear surface of the substrate 100 It is.

In order to reduce the area of the flat belt 101 to the substrate 100 as much as possible, as shown in FIG. 5, a groove 103 is formed under the guide wall 102 and the groove 103 is formed. It is conceivable to pass the belt 101 through the belt.

[0005]

However, according to the prior art, when a thin substrate 100 is conveyed, the substrate 1 is not used.
00 may be shifted in the width direction on the belt 101 and may enter the groove 103, so that there is a problem in that it is stuck and cannot be stably conveyed.

SUMMARY OF THE INVENTION It is an object of the present invention to reduce the contact area of a substrate with a belt when the substrate is transported by using a belt, and to enable stable transport.

[0007]

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a board transfer apparatus for transferring a printed board placed on a belt by moving the belt, wherein a guide wall for regulating a side end face in a transfer direction of the printed board is provided. A groove formed under the guide wall so as to allow the belt to enter at right angles to the guide surface, and a cross-sectional shape perpendicular to a conveying direction of the belt is mounted on the belt. A step is provided so that the printed board is placed at a position higher than the groove position.

[0008] With this configuration, the conveyance of the belt is stabilized, the area where the belt abuts on the back surface of the substrate is reduced, and the substrate side end surface is reliably guided at a position higher than the groove, and the substrate enters the groove. To ensure stable transport.

Further, according to the present invention, in the substrate transfer apparatus according to the first aspect, a substrate contact member provided at a predetermined position on the belt, and the belt and the substrate contact member are relatively close to each other. And a contact / separation drive unit for fixing the substrate.

[0010] With this configuration, positioning can be easily performed while being conveyed by the belt.
In claim 2, the contact / separation driving member is configured to move up and down a belt attaching portion to which the belt is attached.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below in detail with reference to the drawings.

In FIG. 2, a printed circuit board 1 conveyed from an upstream device is supplied and conveyed to a positioning unit 3 by a supply conveyor 2, and a substrate 1 of the positioning unit 3 is discharged and conveyed to a downstream device by a discharge conveyor 4.

The printed circuit board 1 positioned by the positioning unit 3 is subjected to a predetermined operation of mounting electronic components taken out of a component supply unit (not shown) by a mounting head (not shown) that moves horizontally and vertically. Alternatively, an adhesive for temporarily fixing the electronic component may be applied to a position where the electronic component is to be mounted before mounting the component. The application of the adhesive is performed by, for example, discharging a predetermined amount of the adhesive from the tip of the nozzle by an application nozzle that moves horizontally and vertically.

A mechanism for transporting the substrate 1 of the supply conveyor 2 will be described with reference to FIG. This mechanism has the same structure in the discharge conveyor 4.

A belt 5 on which the substrate 1 is placed is hung around a pulley (not shown) and is rotatably attached to a pair of chute walls 6. A guide wall 7 is provided upright on the chute wall 6, and a pair of guide walls 7 is provided to guide the side end surface of the substrate 1 conveyed by the belt 5.
Is slightly larger than the width of the substrate 1. When the substrate 1 is changed and the width of the substrate 1 is changed,
The space between the chute walls 6 can be changed by a width changing mechanism (not shown).

As shown in FIG. 3, a groove 8 is formed in the lower part of the guide wall 7 from the inside to the outside of the guide wall 7, and the belt 5 is inserted and arranged in the groove 8.

The width of the belt 5 is set to be sufficiently stable without moving off the running surface of the chute wall 6, but the distance from the guide wall 7 to the end, ie, the substrate 1 The length of the portion on which is mounted is made as small as possible. Therefore, the depth of the groove 8 (with respect to the width direction of the substrate, that is, the direction perpendicular to the substrate transport direction) is sufficiently large so that the belt 5 can be arranged.

A step 9 is formed so that the surface of the belt 5 on which the substrate 1 is placed, that is, the surface on which the back surface of the substrate 1 contacts, is higher than a portion passing through the groove 8. Substrate 1
Is sufficiently high from the position of the groove 8 to be reliably restricted by the guide wall 7.

That is, the belt 5 is a stepped flat belt,
This is a shape in which a step 9 is formed on a flat belt.

The width of the step 9 can be the minimum width required for the substrate 1 to be placed and transported, and the area where the back surface of the substrate 1 contacts the belt 5 can be minimized. Thus, a sufficient space for mounting components on the substrate 1 can be secured.

Next, the positioning section 3 will be described.
The mechanism by which the substrate 1 is transported is the same, and the same reference numerals are used in FIGS.

The chute wall 11 of the positioning section 3 is movable up and down by an elevating mechanism (not shown) such as a cylinder, for example, and is fixed by the positioning section 3 so as not to move in the vertical direction. As shown in FIG. 1, the upper surface of the substrate 1 is brought into contact with the substrate pressing piece 12, and the substrate 1 is sandwiched between the belt 5 and the substrate 1 is positioned and fixed.

As shown in FIGS. 3 and 4, a backup pin 15 is provided on the positioning portion 3 and is detachably provided on the base 14. The backup pin 15 is raised by a lifting mechanism (not shown) as the chute wall 11 is raised. The lower surface of the substrate 1 is supported and prevented from lowering when an electronic component is mounted by the mounting head.

When the substrate 1 is being conveyed, the upper surface of the backup pin 15 is separated from the substrate 1 to some extent. For this reason, the raising and lowering of the base and the raising and lowering of the chute wall 11 are preferably performed by different mechanisms. Alternatively, the same driving source may have any structure as long as the lower end position of the base 14 can be lower than the lower end position of the chute wall 11.

Alternatively, in supporting the substrate 1, the chute wall 11 and the base 14 are fixed if there is no need for the backup pins 15 to be in contact with the lower surface of the substrate 1 and a gap that can be prevented from being caught during transportation can be secured. Alternatively, the height positional relationship may not be changed, and a single elevating mechanism may be used to move up and down.

Alternatively, instead of raising and lowering the chute wall 11, the substrate holding piece 12 may be lowered to fix the substrate 1 therebetween.

The operation of the above configuration will be described below.

First, when the printed circuit board 1 is transferred from the upstream device to the supply conveyor 2, the belt 5 is rotated by a drive motor (not shown) around which the belt 5 (not shown) is rotated. To rotate. Therefore, the printed circuit board 1 on the belt 5 is transported as the belt 5 moves. During the transfer, as shown in FIG.
Is placed on the step 9 of the belt 5 and does not enter the groove 8, but is guided stably by the pair of opposing guide walls 7 at an interval corresponding to the width of the substrate 1, and is stably conveyed. You. Even if there is no guide member that regulates the belt 5 itself so as not to move inward perpendicular to the transport direction, the belt 5 has a sufficient width so that the belt 5 does not come off inward and can run stably. Will be

Next, the substrate 1 is transferred from the supply conveyor 2 to the positioning section 3 and is conveyed by the movement of the belt 5 having the same structure as that of the supply conveyor 2 provided on the positioning section 3 and is moved to a position where the substrate is to be positioned. Stopped. This stop can be performed by bringing a stopper (not shown) into contact with the substrate 1, or may be stopped simply by stopping the travel of the belt 5.

Next, the chute wall 11 of the substrate 1 is pushed up by a cylinder or the like, and the step 9 of the belt 5 and the substrate holding piece 1
The substrate 1 is fixed and positioned by being clamped between the substrate 1 and the substrate 2. Since the belt 5 has elasticity, the contact with the back surface of the substrate 1 can be absorbed within the range of the elasticity.

On the other hand, the base 14 on which the backup pins 15 are erected also rises, and the upper end of the backup pins 15 is located at a position that can be regulated when the back surface of the substrate 1 is lowered.

Next, work such as mounting of electronic components by a mounting head (not shown) is performed on the substrate 1, and when the work is completed, the chute wall 11 and the base 14 are lowered, and Clamping (clipping) is eliminated.

Next, the substrate 1 is placed on the belt 5 of the positioning section 3.
Is transported by the start of rotation of the discharge conveyor 4 and is transferred to the discharge conveyor 4, further transferred by rotation of the belt 5 of the discharge conveyor 4, and transferred to the downstream device.

The next substrate 1 is conveyed to the positioning portion and is positioned to perform a predetermined operation.

[0035]

As described above, according to the present invention, since the belt is provided with the step portion and the printed board is conveyed at a position higher than the groove position, the substrate is not caught in the groove and the back surface of the substrate Sufficient space for mounting the components can be secured and stable conveyance can be performed.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a substrate transfer mechanism and a mechanism for fixing a substrate at a positioning unit, as viewed from a substrate transfer direction.

FIG. 2 is an overall plan view of the substrate transfer device and the positioning device.

FIG. 3 is a cross-sectional view illustrating a substrate transfer mechanism on a supply conveyor, as viewed from a substrate transfer direction.

FIG. 4 is a cross-sectional view showing a substrate transport mechanism and a mechanism for fixing the substrate at a positioning unit, as viewed from the substrate transport direction.

FIG. 5 is a cross-sectional view showing a substrate transfer mechanism according to a conventional technique, viewed from a substrate transfer direction.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Printed circuit board 2 Supply conveyor 5 Belt 7 Guide wall 8 Groove 9 Step part 11 Chute wall 12 Board holding piece (board contact member)

Claims (3)

[Claims] 1. A board transfer device for transferring a printed circuit board mounted on a belt by moving the belt, wherein the guide wall regulates a side end surface in a transfer direction of the printed circuit board, and the guide wall is provided below the guide wall. A groove formed so that the belt can enter at right angles to the printed circuit board mounted on the belt so that a cross-sectional shape orthogonal to the conveying direction of the belt is higher than the groove position. A substrate transfer device having a step portion so as to be placed thereon. 2. The substrate transfer device according to claim 1, wherein the substrate contact member provided at a predetermined position on the belt, and the belt and the substrate contact member are relatively moved closer to each other. A substrate positioning device, comprising: a contact / separation drive unit for performing fixing. 3. The substrate positioning device according to claim 2, wherein the contact / separation driving member moves up and down a belt attaching portion to which the belt is attached.