JP2006210393A - Substrate processing apparatus, substrate transfer apparatus and substrate control method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus etc. capable of reducing the weight of the apparatus and cost burden etc. , while maintaining processing accuracy. <P>SOLUTION: The substrate processing apparatus 1 has a processing unit 5, an X-direction moving stage 7, an alignment stage (Y-direction moving stage and θ direction moving stage) 9, an air float unit 11 and a roller 13 etc. The stage 7 has an X-direction slider 7-1 and an X-direction rail 7-2. The widths (Y-direction length) of the X-direction slider 7-1 and the X-direction rail 7-2 are both smaller than the width of a substrate 3 (Y-direction length). The substrate 3 is placed on the top surface of the X-direction slider 7-1, and the X-direction slider 7-1 moves in an X-direction along the X-direction rail 7-2. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a substrate processing apparatus and a substrate transport apparatus that perform processing by transporting a substrate such as a glass substrate.

Conventionally, a substrate processing apparatus places a thin plate-like substrate (work) such as a glass substrate on a stage, performs positioning through the stage, and performs precision patterning on the substrate. When pattern formation is performed on a substrate, considerable accuracy is required, and it is required to accurately place the substrate to be processed at a predetermined position on the surface plate.
In recent years, in the field of displays such as liquid crystal color filters, the G6 generation (1500 mm × 1800 mm), the G7 generation (1870 mm × 2200 mm), etc., tend to increase the size of the glass substrate and increase the device weight, device cost, etc. is there.
In order to reduce the weight of the apparatus and reduce the cost, an air slider type thin plate conveying apparatus has been proposed (see, for example, [Patent Document 1]).

JP 2004-238133 A

However, the conventional substrate processing apparatus has a problem that the equipment cost due to the increase in the size of the apparatus increases.
A stage is required for transporting and processing the substrate, and the moving surface plate of the stone stage is larger than the size of the substrate. In addition, the moving surface plate, the slider and slide rail for running the moving surface plate, and the base that supports these are designed to maintain appropriate rigidity.
Therefore, the size of the device, the weight of the device, the load capacity of the installation location, the device transport cost, etc. increase, and the cost burden required for surface grinding of the large moving surface plate and the accuracy increasing processing by hand lap increases. There is a problem.
In addition, the thin plate conveying device disclosed in [Patent Document 1] does not include an alignment device, and there is a problem that it is difficult to use for precise patterning of a color filter or the like.

Further, for the reasons shown in the following (1) to (3), it is necessary to maintain the relative positional accuracy in the Z direction between the processing unit (processing unit) and the substrate.
The θ axis indicates the vertical rotation axis, and the θ direction indicates the rotation direction. The Y axis indicates the machining width direction, the X axis indicates the machining direction, and the θ axis, the Y axis, and the X axis are perpendicular to each other.
(1) When the processing unit is an inkjet head unit, when the substrate moves relative to the inkjet head in the X direction or the Y direction, if the substrate flutters in the Z direction, the gap between the inkjet head and the substrate Fluctuates and the landing position in the X direction or Y direction shifts.
(2) When the processing unit is a die head unit, when the substrate moves relative to the die head in the X direction or the Y direction, the gap between the die head and the substrate varies when the substrate flutters in the Z direction. As a result, the coating film thickness also varies.
(3) When the processing unit is a laser irradiation head unit, when the substrate moves relative to the laser irradiation head in the X direction or the Y direction, if the substrate flutters in the Z direction, the laser irradiation head and the substrate The focal length also fluctuates due to the gap between them.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a substrate processing apparatus and the like that can reduce the weight and cost of the apparatus while maintaining the processing accuracy. To do.

  In order to achieve the above-mentioned object, a first invention is a substrate processing apparatus comprising: a processing unit that performs processing on a substrate; and a transport unit that transports the substrate to the processing unit. The part has at least one axis, and has a rail part provided in the transport direction and a moving part on which the board is placed and moves on the rail part, and the width of the moving part and the rail part is the board The substrate processing apparatus is characterized by being smaller than the width.

  A substrate processing apparatus according to a first aspect of the present invention includes a processing unit (processing unit) that performs processing on a substrate, a transport unit (X-direction moving stage) that transports the processing unit, and the transport unit includes at least one axis. Yes, it has a rail part (X direction rail) provided in the transport direction and a moving part (X direction slider) on which the board is placed and moves on the rail part. The width of the moving part and the rail part is larger than the width of the board. small.

In addition, it is desirable to provide an air float that controls the relative position between the processed portion and the substrate in the vertical direction by air pressure in the vicinity of the lower portion of the processed portion.
Further, an alignment unit (alignment stage (Y direction, θ direction)) for positioning the substrate may be provided, and the transport unit may transport the substrate from the alignment unit to the processing unit.
In addition, it is desirable to provide a transport substrate support unit that supports the substrate to be transported in a region between the alignment unit and the processing unit and other than the transport unit. In this case, the transport substrate support portion is not particularly limited as long as it supports the substrate, and for example, a roller, an air float, or the like can be used.
Moreover, you may make it provide the ditch | groove for embedding a conveyance part in an alignment part in a conveyance direction. In this case, it is desirable to determine the size of the groove so that the alignment unit and the conveyance unit can move independently within the positioning range.

  The present invention mounts an air float that enables precision patterning on a substrate such as a thin plate while maintaining accuracy, and keeps the relative distance in the Z direction (vertical direction) between the processing unit and the substrate constant. This is related to a precision stage. The feature is that if the substrate transport direction is the X direction and the direction perpendicular to the thin plate transport direction is the Y direction, the width of the moving surface plate in the Y direction is narrower than the substrate, and a function that allows alignment before patterning is provided It is in.

  Therefore, the X-direction moving stage is equipped with the same drive mechanism as before, and the size of the moving surface plate is made smaller in the Y direction than before, thereby maintaining the accuracy in the X direction and the Y direction and reducing the weight. Can be planned. Further, by providing the air float unit in the processing region, it is possible to maintain the relative positional accuracy in the Z direction between the processing unit and the substrate. Therefore, weight reduction and cost reduction can be achieved with a simple structure.

  A second invention includes an alignment unit on which a substrate is placed and positions the substrate, and a transport unit that transports the alignment unit, and the transport unit is at least one axis and is provided in a transport direction. And a moving unit that supports the alignment unit and moves on the rail unit, wherein the width of the moving unit and the rail unit is smaller than the width of the substrate.

  The substrate transport apparatus of the second invention includes an alignment unit, a transport unit, and the like. The width of the moving unit and the rail unit that move the transport unit is smaller than the width of the substrate, and the alignment unit (alignment stage) includes the transport unit ( Mounted on the X-direction moving stage).

  3rd invention is a board | substrate control method in the board | substrate processing apparatus provided with the process part which processes a board | substrate, and the conveyance part which conveys the said board | substrate to the said process part, Comprising: The rail provided in a conveyance direction A partial region surface support step for supporting a partial region of the substrate or a partial region of the alignment unit for positioning the substrate from below by a moving unit that moves on the substrate; and A moving step for moving the alignment unit in the transport direction; and a vertical position control step for controlling the position of the substrate in the vertical direction by air pressure by an air float near the lower part of the processing unit. This is a substrate control method.

  3rd invention is the invention regarding the board | substrate control method in the board | substrate processing apparatus of 1st invention, and the board | substrate conveyance apparatus of 2nd invention.

The “partial region” indicates a predetermined partial region, not the entire lower surface of the substrate or the alignment unit. For example, when the width of the moving unit that supports and moves the substrate and the alignment unit is smaller than the width of the substrate, and the moving unit moves on a uniaxial rail, the “partial region” is the central portion of the lower surface of the substrate or alignment unit. Indicates the area.
Further, outside the partial region, the substrate and the alignment unit may be supported in an auxiliary manner from below by point support, line support, and the like.

  ADVANTAGE OF THE INVENTION According to this invention, the board | substrate processing apparatus etc. which can reduce an apparatus weight, a cost burden, etc. can be provided, maintaining a processing precision.

  Hereinafter, preferred embodiments of a substrate processing apparatus and the like according to the present invention will be described in detail with reference to the accompanying drawings. In the following description and the accompanying drawings, the same reference numerals are given to components having substantially the same functional configuration, and redundant description will be omitted.

Initially, the structure of the substrate processing apparatus 1 which concerns on embodiment of this invention is demonstrated, referring FIG.
FIG. 1 is a schematic perspective view of the substrate processing apparatus 1.
The θ axis indicates the vertical rotation axis, and the θ direction indicates the rotation direction. The Y axis indicates the coating width direction, the X axis indicates the coating direction, and the θ axis, the Y axis, and the X axis are perpendicular to each other.

  A substrate processing apparatus 1 shown in FIG. 1 includes a processing unit 5, an X direction moving stage 7, an alignment stage (Y direction moving stage and θ direction moving stage) 9, an air float unit 11, a roller 13, an alignment camera 15, and the like. The

The substrate processing apparatus 1 is an apparatus for processing a substrate 3 by a processing unit 5 to form a fine pitch pattern such as a color filter or an electronic circuit.
.
The substrate 3 is an object to be processed, and is, for example, a substrate such as a glass substrate, a silicon wafer, or a printed substrate.
The processing unit 5 is a device that performs processing on the substrate 3, and is, for example, an ink jet head unit, a die coat unit, a laser irradiation head unit, or the like. The processing unit 5 moves along a rail 19 provided on the gantry 17 in the Y direction.

The X-direction moving stage 7 is a device that carries the substrate 3 and the like in the X direction and performs positioning in the X direction. The X direction moving stage 7 has an X direction slider 7-1 and an X direction rail 7-2. Both the width (Y direction length) of the X direction slider 7-1 and the X direction rail 7-2 is smaller than the width of the substrate 3 (length in the Y direction). The substrate 3 is placed on the upper surface of the X-direction slider 7-1, and the X-direction slider 7-1 moves in the X direction along the X-direction rail 7-2.
The X direction moving stage 7 is a linear moving stage, and is supported so as to be movable in the X direction by a controllable motor such as a guide using a LM guide or an air slider and a step motor, servo motor, linear motor, or the like. .

The alignment stage (Y direction, θ direction) 9 is a device for positioning the substrate 3 in the Y direction 23 and the θ direction 25. The alignment stage 9 has a Y direction moving stage (not shown) and a θ direction moving stage (not shown).
The Y direction moving stage is a linear moving stage and is supported so as to be movable in the Y direction by a controllable motor such as a step motor, a servo motor, or a linear motor.
The θ-direction moving stage is a rotating stage and is rotatably supported on the θ-direction rotating shaft by a controllable motor such as a step motor or a servo motor.

Further, the alignment stage 9 has a concave groove 21 in the X direction. The concave groove 21 can embed the X-direction moving stage 7. The X-direction moving stage 7 is not fixed to the concave groove 21. The size of the concave groove 21 is determined so that the alignment stage 9 and the X-direction moving stage 7 can operate independently within the positioning range. Even when the X-direction moving stage 7 is embedded in the concave groove 21, the alignment stage 9 can move in the Y direction and θ direction independently of the X-direction moving stage 7 within the movable range.
In addition, the alignment stage may be divided into at least two parts on the left and right sides, and independent driving may be provided for each, and the alignment stage may be operated under synchronous control.

The alignment camera 15 is a camera that images a predetermined portion (such as an alignment mark formed on the substrate) of the substrate 3 in order to detect the θ-direction angle and the XY coordinates of the substrate 3. The captured image of the alignment camera 15 is input to an alignment control unit (not shown) of the substrate processing apparatus 1.
The alignment camera 15 is fixedly supported on a frame (not shown) of the substrate processing apparatus 1.

  An alignment control unit (not shown) controls the substrate 3 to have a predetermined θ-direction angle and a predetermined XY coordinate based on an image captured by the alignment camera 15. An alignment control unit (not shown) extracts the θ direction angle and XY coordinates of the substrate 3 based on the captured image, compares the extracted data with predetermined data, calculates their deviation, and reduces the deviation. Calculate the control amount. An alignment controller (not shown) outputs control amounts to the X-direction moving stage 7 and the alignment stage 9 to control the position of each stage.

A suction table (not shown) may be provided on the upper surface of the X-direction slider 7-1 and the alignment stage 9.
The suction table is a table that sucks and fixes the substrate 3. Adsorption of the substrate 3 is performed, for example, by reducing the pressure of the air to a vacuum. In this case, the suction table is provided with a small hole (not shown) for sucking air, and at the time of suction, air is sucked by a vacuum pump (not shown) or the like through the hole.
Here, when the suction of the upper surface of the alignment stage 9 is stopped and only the upper surface of the X-direction slider 7-1 is sucked and the X-direction slider 7-1 is moved, the height of the upper surface of the suction table of the alignment stage 9 is increased. It is desirable to make the height lower than the height of the X-direction slider 7-1. As a method of changing the height, the height of the alignment stage 9 may be decreased, or the height of the X-direction slider 7-1 may be increased.

The air float unit 11 is a device that supports the substrate 3 in a non-contact manner by air pressure. The air float unit 11 is provided on both sides of the X-direction moving stage 7 in the vicinity of the processing unit 5.
The air float unit 11 maintains the substrate 3 at a certain height (Z-direction position) by being pushed up or sucked by air pressure. For the air float unit 11, for example, a smart nozzle commercially available from Orbotech can be used.

  The roller 13 is a device that supports the substrate 3 transported in the X direction. The rollers 13 are provided on both sides of the X-direction moving stage 7 in a region between the alignment stage 9 and the air float unit 11. An air float unit may be provided in place of the roller 13.

Next, the operation of the substrate processing apparatus 1 according to the embodiment of the present invention will be described with reference to FIGS.
2-4 is a figure which shows the flow of operation | movement of the substrate processing apparatus 1, and shows the figure which notched the upper part of the gantry 17 from the substrate processing apparatus 1, and was seen from upper direction.
2 shows a case where the substrate 3 is in the alignment region 31, FIG. 3 shows a case where the substrate 3 is in the movement region 33, and FIG. 4 shows a case where the substrate 3 is in the processing region 35.
FIG. 5 is a flowchart showing the operation of the substrate processing apparatus 1.

  As shown in FIG. 2, the substrate processing apparatus 1 aligns the substrate 3 in the Y direction 23 and the θ direction 25 with the alignment stage 9 in the alignment region 31 (step 101), and moves the substrate 3 in the X direction. It is placed on the X-direction slider 7-1 of the stage 7 (step 102).

As shown in FIG. 3, the substrate processing apparatus 1 drives the X-direction moving stage 7 and moves the X-direction slider 7-1 along the X-direction rail 7-2 to move the substrate 3 from the alignment region 31 to the processing region. 35 (step 103).
In the moving region 33, the vicinity of the center of the substrate 3 is supported by the X-direction moving stage 7, and both sides of the substrate 3 are supported by the rollers 13.

  As shown in FIG. 4, the substrate processing apparatus 1 causes the substrate 3 to be levitated by the air float unit 11 in the processing region 35, and sets the relative distance in the Z direction (the Z direction distance between the substrate 3 and the processing unit 5). The substrate 3 is kept constant (step 104), and the substrate 3 is processed by the processing unit 5 (step 105).

  Through the above process, the substrate processing apparatus 1 performs alignment in the Y direction and θ direction in the alignment region 31, moves the substrate 3 from the alignment region 31 to the processing region 35 by the X direction moving stage 7, and in the processing region 35. The air float unit 11 keeps the relative distance in the Z direction constant, and the processing unit 5 performs processing on the substrate 3.

  In this way, the substrate processing apparatus performs positioning in the Y direction and θ direction by the alignment stage, transports in the X direction by the X direction moving stage, performs positioning in the Z direction by the air float unit, and processes the substrate. Processing accuracy can be maintained.

  As described above, in the substrate processing apparatus of the present invention, the X-direction moving stage has the same drive mechanism as before, and the size of the moving surface plate (X-direction slider, etc.) is made smaller in the Y direction than before. Thus, it is possible to maintain the accuracy in the X direction and reduce the weight. Further, by providing the air float unit in the processing region, it is possible to maintain the relative positional accuracy in the Z direction between the processing unit and the substrate. Therefore, weight reduction and cost reduction can be achieved with a simple structure.

Note that how much the width of the X-direction moving stage is reduced is not particularly limited, and can be determined based on the weight, shape, size, and the like of the substrate.
Further, the number of axes of the X-direction moving stage may be one axis as described above or a plurality of axes.
Further, as described above, the alignment stage may be made independent of the X direction moving stage, and after alignment in the Y direction and θ direction, the substrate may be transferred to the X direction moving stage, or the alignment stage may be moved in the X direction. You may make it mount on a stage.
Here, when the substrate is transferred to the X-direction moving stage, it is desirable that the height of the alignment stage 9 is lower than the height of the X-direction slider 7-1. As a method of changing the height, the height of the alignment stage 9 may be lowered, or the height of the X-direction slider 7-1 may be raised.

As for the processing area, as described above, the processing unit may be movable in the Y direction along the rail of the gantry, or the processing unit is fixed above the air float unit, and the alignment stage is set to Y. You may make it move to a direction.
As for the moving region not related to alignment and processing, a simple roller or an air float unit may be provided as described above.
In order to improve the relative distance accuracy between the substrate and the processing unit in the processing area, a sensor for measuring the position of the substrate is provided on the processing unit side, and feedback is performed in real time to control the air pressure of the air float unit. You may do it.

  The preferred embodiments of the substrate processing apparatus and the like according to the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to such examples. It will be apparent to those skilled in the art that various changes or modifications can be conceived within the scope of the technical idea disclosed in the present application, and these are naturally within the technical scope of the present invention. Understood.

Schematic perspective view of substrate processing apparatus 1 The figure which shows the flow of operation | movement of the board | substrate processing apparatus 1 (alignment area | region 31). The figure which shows the flow of operation | movement of the board | substrate processing apparatus 1 (movement area | region 33). The figure which shows the flow of operation | movement of the board | substrate processing apparatus 1 (process area | region 35). Flow chart showing the operation of the substrate processing apparatus 1

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ......... Substrate processing apparatus 3 ......... Substrate 5 ......... Processing unit 7 ......... X direction moving stage 7-1 ......... X direction slider 7-2 ......... X direction rail 9 ......... Alignment stage (Y direction, θ direction)
11 ......... Air Float Unit 13 ......... Roller 15 ......... Alignment Camera 17 ......... Gantry 19 ......... Rail 21 ......... Dove Groove 31 ......... Alignment Area 33 ......... Moving Area 35 ......... Processing area

Claims (8)

A substrate processing apparatus comprising: a processing unit that performs processing on a substrate; and a transport unit that transports the substrate to the processing unit,
The transport unit has at least one axis, and includes a rail unit provided in the transport direction and a moving unit on which the substrate is placed and moves on the rail unit, and the width of the moving unit and the rail unit is A substrate processing apparatus having a width smaller than that of the substrate.   The substrate processing apparatus according to claim 1, wherein an air float that controls the position of the substrate in a vertical direction by air pressure is provided near a lower portion of the processing unit.   The substrate processing apparatus according to claim 1, further comprising an alignment unit that positions the substrate, wherein the transport unit transports the substrate from the alignment unit to the processing unit.   4. The substrate processing according to claim 3, further comprising a transport substrate support portion that supports the transported substrate in a region between the alignment unit and the processing unit and other than the transport unit. apparatus.   The substrate processing apparatus according to claim 3, wherein the alignment unit has a concave groove in which the conveyance unit is embedded in the conveyance direction. An alignment unit on which a substrate is placed and positioning the substrate; and a transport unit that transports the alignment unit,
The transport unit has at least one axis, and includes a rail unit provided in the transport direction and a moving unit that supports the alignment unit and moves on the rail unit, and the width of the moving unit and the rail unit is A substrate transfer device having a width smaller than that of the substrate. A substrate control method in a substrate processing apparatus comprising: a processing unit that performs processing on a substrate; and a transport unit that transports the substrate to the processing unit,
A partial region surface support step for supporting the partial region of the substrate or the partial region of the alignment unit for positioning the substrate from below by a moving unit that moves on a rail portion provided in the transport direction;
A moving step of moving the substrate or the alignment unit in the transport direction by the moving unit;
A vertical position control step for controlling the position of the substrate in the vertical direction by air pressure by an air float near the lower part of the processing part;
A substrate control method comprising:   The substrate control method according to claim 7, further comprising an auxiliary support step of supporting the substrate or the alignment unit from below by point support or line support outside the partial region.

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