JP2014123769A - Ultraviolet irradiation device and ultraviolet irradiation method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an ultraviolet irradiation device capable of preventing the deterioration of the yield, and to provide an ultraviolet irradiation method.SOLUTION: An ultraviolet irradiation device of the invention includes: a holding mechanism which is provided in a chamber so as to move holding a substrate; an ultraviolet irradiation mechanism for irradiating the substrate which is held by the holding mechanism and moves in the chamber with ultraviolet light; a heating mechanism for heating the substrate in the chamber; a moving mechanism which has a driving source provided at the exterior of the chamber and a transmission member which is connected with the holding mechanism and transmits a driving force of the driving source to the holding mechanism; and a stage provided in the chamber and having a mechanism which jets air to the substrate held by the holding mechanism and floats the substrate.

Description

  The present invention relates to an ultraviolet irradiation device and an ultraviolet irradiation method.

  A fine pattern such as a wiring pattern or an electrode pattern is formed on a glass substrate constituting a display panel such as a liquid crystal display. In general, such a pattern is formed by a technique such as photolithography. In the photolithography method, a step of applying a resist film to a glass substrate, a step of exposing the resist film, a step of developing the resist film after exposure, and a step of irradiating the developed resist film with ultraviolet rays are performed.

  In the ultraviolet irradiation process, for example, an ultraviolet irradiation apparatus is used that accommodates the substrate in a chamber and irradiates the substrate with ultraviolet rays while transporting the substrate. The substrate is transferred using, for example, a drive source provided in the chamber. Such an ultraviolet irradiation device is required to have a clean environment with few foreign matters such as dust and dirt in the substrate transfer path in the chamber.

Japanese Patent Laid-Open No. 2004-241702

  However, in a configuration in which a drive source is provided in the chamber, an air flow may be generated in the chamber due to the operation of the drive source, and foreign matter such as dust and dirt in the chamber may be wound up. If the wound foreign matter adheres to the substrate, it may cause a decrease in yield.

  An object of this invention is to provide the ultraviolet irradiation device and ultraviolet irradiation method which can prevent a yield fall.

An ultraviolet irradiation device according to the present invention is provided in the chamber, and is provided with a holding mechanism that is movably provided to hold the substrate, and ultraviolet rays are applied to the substrate that is held by the holding mechanism and moves in the chamber. An ultraviolet irradiation mechanism for irradiating, a heating mechanism for heating the substrate in the chamber, a driving source provided outside the chamber, and a driving force of the driving source connected to the holding mechanism is transmitted to the holding mechanism And a stage having a mechanism provided in the chamber and ejecting air to the substrate held by the holding mechanism to float the substrate. To do.
In the above ultraviolet irradiation device, the ultraviolet irradiation mechanism and the heating mechanism are arranged so as to face each other through a path along which the substrate is conveyed.
In addition, a chamber having a suction mechanism, a holding mechanism provided in the chamber and provided to be movable while holding the substrate, and an ultraviolet ray applied to the substrate held by the holding mechanism and moving in the chamber An ultraviolet irradiation mechanism for irradiating the substrate, a heating mechanism for heating the substrate in the chamber, a driving source provided outside the chamber, and a driving force of the driving source connected to the holding mechanism to the holding mechanism A transfer mechanism for transmitting, and the holding mechanism has a holding member for holding a corner portion of the substrate, the holding member is fixed to a support wire, and the support wire is It is provided through the chamber, and an end portion of the support wire is fixed to the transmission member outside the chamber.

  According to the present invention, since the drive source is provided outside the chamber, it is possible to prevent the dust in the chamber from being rolled up by the drive source. In addition, according to the present invention, since the holding mechanism is moved by transmitting the driving force of the driving source to the holding mechanism by the transmission member, the space used for transporting the substrate can be suppressed, The air current can be prevented from being disturbed. Thereby, since the environment in the chamber can be kept clean, it is possible to suppress foreign matter from adhering to the substrate and to prevent a decrease in yield.

In the above ultraviolet irradiation device, the holding mechanism is arranged on a side portion in the moving direction of the substrate.
According to the present invention, since the holding mechanism is disposed on the side portion in the movement direction of the substrate, the transmission member may be disposed on the side portion in the movement direction of the substrate. Since it is possible to prevent the transmission member from being arranged in the moving direction of the substrate, it is possible to prevent dust from being rolled up in the chamber due to the movement of the transmission member.

In the ultraviolet irradiation apparatus, the holding mechanism includes a holding member that holds a corner portion of the substrate.
According to the present invention, since the holding mechanism has the holding member that holds the corners of the substrate, the substrate can be reliably held.

In the above-described ultraviolet irradiation device, the transmission member is a linear member.
According to the present invention, since the transmission member is a linear member, the movement space of the transmission member can be suppressed. In addition, since the transmission member can be bent and used, for example, the driving force can be transmitted while switching the transmission direction of the driving force.

In the above ultraviolet irradiation device, the transmission member is a belt-like member.
According to the present invention, since the transmission member is a belt-like member, the movement space of the transmission member can be suppressed. In addition, since the transmission member can be bent and used, for example, the driving force can be transmitted while switching the transmission direction of the driving force.

In the above ultraviolet irradiation device, the transmission member is connected to the holding mechanism via a pulley mechanism.
According to the present invention, since the transmission member is connected to the holding mechanism via the pulley mechanism, the driving force can be reliably transmitted to the transmission member.

The ultraviolet irradiation device includes a substrate delivery mechanism that delivers the substrate to and from the holding mechanism, a second drive source provided outside the chamber, and the second drive connected to the substrate delivery mechanism. And a second movement mechanism having a second transmission member for transmitting the driving force of the source to the substrate delivery mechanism.
According to the present invention, the substrate transfer mechanism for transferring the substrate to and from the holding mechanism, the second drive source provided outside the chamber, and the drive force of the second drive source connected to the substrate transfer mechanism to the substrate Since the second movement mechanism having the second transmission member for transmitting to the delivery mechanism is provided, the substrate can be delivered using the drive source and the second drive source outside the chamber. Thereby, the environment in the chamber can be kept clean.

An ultraviolet irradiation method according to the present invention includes an ultraviolet irradiation step of holding a substrate by a holding mechanism, and irradiating the substrate that is held in the holding mechanism and moving in the chamber with ultraviolet rays; And a moving step of causing the substrate to float by blowing air, transmitting a driving force from a driving source provided outside the chamber to the holding mechanism via a transmission member, and moving the holding mechanism. And
The ultraviolet irradiation method is characterized in that, in the ultraviolet irradiation step, the other surface of the substrate is heated while irradiating one surface of the substrate with ultraviolet light.
An ultraviolet irradiation step of irradiating the substrate that is held in the holding mechanism and moves in the chamber while irradiating the substrate with ultraviolet rays while holding the substrate by a holding mechanism, decompressing the space around the substrate, and heating the substrate And a moving step of moving the holding mechanism by transmitting a driving force from a driving source provided outside the chamber to the holding mechanism via a transmission member, and the holding mechanism moves a corner portion of the substrate. Holding the holding member, the holding member is fixed to a support wire, the support wire is provided through the chamber, the end of the support wire is the outside of the chamber It is fixed to the transmission member.

  According to the present invention, since the driving force is transmitted from the driving source provided outside the chamber to the holding mechanism via the transmission member and the holding mechanism is moved, the moving step moves the holding mechanism. Garbage can be prevented from being rolled up. In addition, since the driving force of the driving source is transmitted to the holding mechanism by the transmitting member, the space used for transporting the substrate can be suppressed, and the airflow in the chamber can be prevented from being disturbed. Thereby, the substrate can be irradiated with ultraviolet rays while keeping the environment in the chamber clean.

The ultraviolet irradiation method described above is characterized in that the holding mechanism holds a side portion in the moving direction of the substrate.
According to the present invention, since the holding mechanism holds the side portion in the movement direction of the substrate, it is only necessary to dispose a transmission member on the side portion in the movement direction of the substrate to transmit the driving force. Since it is possible to avoid the transmission member from moving in the moving direction of the substrate, it is possible to prevent dust from being wound up in the chamber due to the movement of the transmission member.

The ultraviolet irradiation method described above is characterized in that the holding mechanism holds a corner portion of the substrate.
According to the present invention, since the holding mechanism holds the corner portion of the substrate, the substrate can be reliably held.

In the above ultraviolet irradiation method, the transmission member is a linear member.
According to the present invention, since the transmission member is a linear member, the movement space of the transmission member is suppressed. In addition, since the transmission member can be bent and used, for example, the driving force can be transmitted while switching the transmission direction of the driving force.

The ultraviolet irradiation method described above is characterized in that the transmission member is a belt-like member.
According to the present invention, since the transmission member is a belt-like member, the movement space of the transmission member is suppressed. In addition, since the transmission member can be bent and used, for example, the driving force can be transmitted while switching the transmission direction of the driving force.

In the above ultraviolet irradiation method, the transmission member is connected to the holding mechanism through a pulley mechanism.
According to the present invention, since the transmission member is connected to the holding mechanism via the pulley mechanism, the driving force can be reliably transmitted.

  A substrate processing apparatus according to the present invention includes a coating apparatus that performs a processing liquid coating process on a substrate, a developing apparatus that performs a developing process of the processing liquid applied to the substrate, and an ultraviolet irradiation that performs an ultraviolet irradiation process on the substrate. An apparatus and a related apparatus for performing a process related to the coating process, the developing process, and the ultraviolet irradiation process, and the substrate is serially connected between the coating apparatus, the developing apparatus, the ultraviolet irradiation apparatus, and the related apparatus. Is a substrate processing apparatus for transporting a substrate, wherein the ultraviolet irradiation apparatus is used as the ultraviolet irradiation apparatus.

  According to the present invention, since the ultraviolet irradiation apparatus capable of keeping the inside of the chamber clean is used, the substrate can be processed in a clean environment. Thereby, the fall of a yield can be suppressed.

The substrate processing apparatus includes a substrate delivery mechanism that delivers the substrate between the ultraviolet irradiation device and the related device, a drive source provided outside the ultraviolet irradiation device, and the substrate delivery mechanism. And a moving mechanism having a transmission member connected to transmit the driving force of the driving source to the substrate transfer mechanism.
According to the present invention, a substrate delivery mechanism for delivering a substrate between the ultraviolet irradiation apparatus and the related apparatus, a drive source provided outside the ultraviolet irradiation apparatus, and driving of the drive source connected to the substrate delivery mechanism Since the moving mechanism having the transmission member for transmitting the force to the substrate delivery mechanism is provided, the substrate can be delivered smoothly outside the ultraviolet irradiation device. Thereby, the environment in the chamber of the ultraviolet irradiation device can be kept clean.

  According to the present invention, yield reduction can be prevented.

It is a top view which shows the structure of the substrate processing apparatus which concerns on this embodiment. It is a figure which shows the structure of a part of ultraviolet irradiation device and preliminary | backup apparatus which concern on this embodiment. It is a figure which shows the structure of a part of ultraviolet irradiation device and preliminary | backup apparatus which concern on this embodiment. It is a figure which shows the structure of a part of ultraviolet irradiation device and preliminary | backup apparatus which concern on this embodiment.

Embodiments of the present invention will be described below with reference to the drawings. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. A predetermined direction in the horizontal plane is defined as an X-axis direction, a direction orthogonal to the X-axis direction in the horizontal plane is defined as a Y-axis direction, and a direction orthogonal to each of the X-axis direction and the Y-axis direction (that is, a vertical direction) is defined as a Z-axis direction. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively.

FIG. 1 is a plan view showing a substrate processing apparatus SPA according to the present embodiment.
The substrate processing apparatus SPA includes, for example, a loader / unloader LU, a coating / development processing unit CD, and an interface unit IF arranged in a line in the X direction. The substrate processing apparatus SPA has a configuration in which a coating / development processing unit CD is disposed between a loader / unloader LU and an interface unit IF.

(Loader / Unloader)
The loader / unloader LU is a part that carries in and out a cassette C that accommodates a plurality of substrates G. The loader / unloader LU includes a cassette standby unit 10 and a transport mechanism 11.

  The cassette standby unit 10 is disposed, for example, at the end of the substrate processing apparatus SPA on the −X side, and accommodates a plurality of cassettes C. The cassettes C accommodated in the cassette standby unit 10 are arranged in the Y direction, for example. The cassette standby section 10 has an opening (not shown) on the −X side, and the cassette C is transferred to and from the outside of the substrate processing apparatus SPA through the opening.

  The transport mechanism 11 is disposed on the + X side of the cassette standby unit 10 and transports the substrate G between the cassette C and the coating and developing processor CD. For example, two transport mechanisms 11 are arranged along the Y direction, and the two transport mechanisms 11 have, for example, the same configuration. The transport mechanism 11a disposed on the −Y side transports the substrate G from the loader / unloader LU to the coating and developing processor CD. The transport mechanism 11b disposed on the + Y side transports the substrate G from the coating / development processing section CD to the loader / unloader LU.

  The transport mechanism 11 has a transport arm 12 (12a, 12b). The transfer arm 12 includes a holding unit that holds the glass substrate, and is provided to be extendable and contractable in one direction, for example. The transfer arm 12 is formed to be rotatable in the θZ direction. The transport arm 12 can be directed in the respective directions of the cassette standby unit 10 and the coating and developing unit CD by rotating in the θZ direction, for example. The transport arm 12 can access each of the cassette standby unit 10 and the coating / development processing unit CD by extending and contracting the transport arm 12.

(Coating and developing section)
The coating / development processing unit CD is a part that performs a series of processes including resist coating and development on the substrate G. The coating and developing unit CD includes a scrubber unit SR, a dehydrating bake unit DH, a coating unit CT, a prebake unit PR, an interface unit IF, a developing unit DV, an ultraviolet irradiation unit UV, and a post bake unit PB.

  The coating / development processing unit CD is divided in the Y direction, and the substrate G from the loader / unloader LU is transported in the + X direction toward the interface unit IF in the −Y side portion. ing. In the + Y side portion, the substrate G from the interface unit IF is transported in the −X direction toward the loader / unloader LU.

  The scrubber unit SR is connected downstream of the loader / unloader LU, and is a unit that cleans the substrate G. The scrubber unit SR has a dry cleaning device 41, a wet cleaning device 42 and an air knife device 43. Conveyor mechanisms CV1 and CV2 are provided on the −X side of the dry cleaning device 41 and the + X side of the air knife device 43, respectively. The conveyor mechanisms CV1 and CV2 are provided with a belt mechanism (not shown) for transporting the substrate G.

  The dry cleaning apparatus 41 removes organic substances on the substrate G by, for example, irradiating the substrate G with ultraviolet rays such as an excimer laser. The wet cleaning device 42 has a scrubbing brush (not shown), for example. The wet cleaning device 42 cleans the substrate G using the cleaning liquid and the scrubbing brush. The air knife device 43 has, for example, an air knife injection mechanism (not shown). The air knife device 43 forms an air knife on the substrate G using an air knife injection mechanism, and removes impurities on the substrate G.

  The dewatering bake unit DH is connected to the downstream side of the scrubber unit SR and is a unit for dewatering the substrate G. The dehydration bake unit DH includes a heating device 44, a HMDS device 46, and a cooling device 45. The heating device 44 and the HMDS device 46 are arranged in a state of being stacked in the Z direction. A conveyor mechanism CV3 is provided at a position overlapping the heating device 44 and the HMDS device 46 as viewed in the Z direction, and a conveyor mechanism CV4 is provided at a position overlapping the cooling device 45 as viewed in the Z direction. A transport mechanism TR <b> 1 that transports the substrate G is provided between the heating device 44 and the HMDS device 46 and the cooling device 45. The transport mechanism TR1 can have the same configuration as the transport mechanism 11 provided in the loader / unloader LU, for example.

  The heating device 44 is configured to have a heater in a chamber that can accommodate the substrate G, for example. For example, the heating device 44 is arranged in a plurality of stages in the Z direction. The heating device 44 heats the substrate G at a predetermined temperature. The HMDS apparatus 46 is an apparatus that improves the adhesion between the resist film applied to the substrate G and the substrate G in the coating unit CT by applying HMDS gas to the substrate G to perform a hydrophobic treatment. The cooling device 45 has a temperature control mechanism in a chamber that can accommodate the substrate G, for example, and cools the substrate G to a predetermined temperature.

  The coating unit CT is connected downstream of the dewatering bake unit DH and forms a resist film in a predetermined region on the substrate G. The coating unit CT includes a coating device 47, a reduced pressure drying device 48, and a peripheral edge removing device 49. The coating device 47 is a device that coats a resist film on the substrate G. As the coating device 47, for example, a rotary coating device, a non-spin coating device, a slit nozzle coating device, or the like is used. These various coating devices may be replaceable. The reduced-pressure drying device 48 dries the surface of the substrate G after the resist film is applied. The peripheral edge removing device 49 is an apparatus for removing the resist film applied to the peripheral edge of the substrate G and adjusting the shape of the resist film.

  The pre-bake unit PR is a unit that is connected downstream of the coating unit CT and performs pre-bake processing on the substrate G. The prebake unit PR has a heating device 50 and a cooling device 51. The heating device 50 and the cooling device 51 are arranged along the Y direction so as to sandwich the transport mechanism TR2.

  The development unit DV is connected to the −X side of the cooling device 51 of the pre-bake unit PR, and performs development processing of the substrate G after exposure. The developing unit DV has a developing device 55, a rinsing device 56, and an air knife device 57. The developing device 55 supplies a developing solution to the substrate G to perform development processing. The rinsing device 56 supplies a rinsing liquid to the developed substrate G and cleans the substrate G. The air knife device 57 forms an air knife on the substrate G, and dries the substrate G. A conveyor mechanism CV9 is provided on the + X side of the developing device 55, and a conveyor mechanism CV10 is provided on the -X side of the air knife device 57.

  The ultraviolet processing unit UV is connected to the downstream side of the developing unit DV, and irradiates the developed substrate G with ultraviolet rays such as i-line.

  The post-bake unit PB is connected to the downstream side of the ultraviolet processing unit UV, and bakes the substrate G after the ultraviolet processing. The post bake unit PB includes a heating device 59 and a cooling device 60. The heating device 59 performs post-baking on the substrate G after development. The cooling device 60 cools the post-baked substrate G.

  The interface unit IF is a part connected to the exposure apparatus EX. The interface unit IF includes a buffer device 52, a transport mechanism TR3, conveyor mechanisms CV7 and CV8, and a peripheral exposure device EE. The buffer device 52 is disposed on the + X side of the transport mechanism TR2 of the prebake unit PR. On the + X side of the buffer device 52, a transport mechanism TR3 is provided.

  The buffer device 52 is a device for temporarily waiting the substrate G. The buffer device 52 includes a chamber (not shown) that accommodates the substrate G, a temperature control device that adjusts the temperature in the chamber, a rotation control device that adjusts the position of the substrate G accommodated in the chamber in the θZ direction, and the like. Is provided. In the chamber of the buffer device 52, the temperature of the substrate G can be maintained at a predetermined temperature. The conveyor mechanisms CV7 and CV8 are arranged so as to sandwich the cooling device 51 of the pre-bake unit PR in the X direction.

(UV irradiation device)
FIG. 2 is a diagram showing a configuration when the ultraviolet processing unit UV is viewed from the + Z side. FIG. 3A and FIG. 3B are diagrams illustrating a configuration when the ultraviolet ray processing unit UV is viewed from the + Y side. 4A is a diagram illustrating a configuration when the ultraviolet processing unit UV is viewed from the −X side, and FIG. 4B is a diagram illustrating a configuration when the ultraviolet processing unit UV is viewed from the + X side. is there. 2 to 4, in order to make it easy to distinguish the drawings, a part of the configuration is omitted.

As shown in these drawings, the ultraviolet processing unit UV has a preliminary device 80 and an ultraviolet processing device 81.
The preliminary device 80 includes a chamber 82, a decompression mechanism 83, and an elevating mechanism 84. The spare device 80 is provided as a spare chamber for temporarily storing the substrate G to be transported to the ultraviolet processing device 81, for example. Of course, it may be used for other purposes. The spare device 80 has a substrate carry-in port 80a on the + Y side, for example. In the preliminary apparatus 80, the substrate G can be accommodated in a state in which the inside of the chamber 82 is decompressed by the decompression mechanism 83. As the decompression mechanism 83, for example, a pump mechanism or the like is used.

  The elevating mechanism 84 is provided so as to be movable in the Z direction. On the + Z side of the lifting mechanism 84, for example, a plurality of support pins 84a are provided. The + Z side ends of the plurality of support pins 84a are provided, for example, in the same plane parallel to the XY plane. For this reason, the board | substrate G is supported in parallel with XY plane by the some support pin 84a. The elevating mechanism 84 is configured to transport the substrate G in the Z direction in the chamber 82 while supporting the substrate G accommodated in the chamber 82.

  The ultraviolet processing apparatus 81 is an apparatus that is connected to the preliminary apparatus 80 and irradiates the substrate G with ultraviolet rays. The ultraviolet treatment device 81 includes a chamber 85, an illumination mechanism 86, a stage 87, a delivery mechanism 88, a transport mechanism 89, a heating mechanism 90, and a suction mechanism 91. The ultraviolet ray processing apparatus 81 has, for example, a substrate carry-in port 81a on the + X side. The substrate carry-in port 81a is connected to the −X side of the spare device 80.

  The chamber 85 accommodates the substrate G on which the ultraviolet irradiation process is performed. The chamber 85 is formed in a rectangular shape in plan view, and is formed, for example, so that one direction is a longitudinal direction. The ceiling 85a of the chamber 85 is provided with an opening 85b for ultraviolet irradiation. The opening 85b is provided at a position corresponding to the illumination mechanism 86 in the chamber 85 in plan view. Further, a lid 85 c is provided on the ceiling 85 a of the chamber 85. The lid portion 85c is provided at a plurality of locations, for example, at three locations along the longitudinal direction of the chamber 85 in plan view. The lid 85 c is provided at a position away from the opening 85 b in the ceiling 85 a of the chamber 85.

  In the chamber 85, a light shielding member 85d is provided at a position sandwiching the opening 85b. The light shielding member 85d is a plate-like member that is attached to the ceiling portion 85a of the chamber 85 and shields the illumination light from the illumination mechanism 86, for example. The light shielding member 85d is formed at a position that divides the chamber 85, for example. Hereinafter, portions of the chamber 85 that are separated by the light shielding member 85d are referred to as a first substrate transport unit 85F, a processing unit 85P, and a second substrate transport unit 85S, respectively. The first substrate transfer unit 85F is a portion of the chamber 85 on the auxiliary device 80 side. The processing portion 85P is a portion where the opening 85b is formed. The second substrate transfer unit 85S is a portion farthest from the spare device 80.

  The illumination mechanism 86 illuminates the ultraviolet rays with which the substrate G is irradiated. The illumination mechanism 86 is attached to the opening 85 b of the chamber 85. The illumination mechanism 86 includes a light source 86a and a light amount adjustment unit 86b. As the light source 86a, a light source that irradiates ultraviolet rays (for example, i-line) is used. The light amount adjusting unit 86b adjusts the amount of ultraviolet light applied to the substrate G. Ultraviolet rays from the light source 86a are irradiated to the processing unit 85P through the opening 85b in a state where the light amount is adjusted by the light amount adjusting unit 86b. The ultraviolet rays irradiated to the processing unit 85P are shielded by the light shielding member 85d. Therefore, the ultraviolet rays from the illumination mechanism 86 are irradiated only to the processing unit 85P without being irradiated to the first substrate transfer unit 85F and the second substrate transfer unit 85S.

  The stage 87 is a plate-like member that is accommodated in the chamber 85 and formed along the longitudinal direction of the chamber 85. The stage 87 is disposed across the first substrate transport unit 85F, the processing unit 85P, and the second substrate transport unit 85S. The stage 87 has a first opening 87a and a second opening 87b. The first opening 87a is formed in a portion arranged in the first substrate transfer unit 85F. The second opening 87 b is formed over almost the entire surface of the stage 87. The second opening 87b is connected to, for example, an air supply mechanism and a suction mechanism (not shown). Therefore, air is ejected from the second opening 87b, and an air layer is formed on the entire surface of the stage 87 by the air. For example, the suction mechanism 91 may be connected as the suction mechanism.

  The delivery mechanism 88 includes a substrate holding member 88a, a transmission member 88b, a drive mechanism 88c, and an elevating mechanism 88d. The delivery mechanism 88 is provided so as to be movable between both the preliminary device 80 and the ultraviolet treatment device 81.

  The substrate holding member 88 a has a comb-like part 100 and a moving part 101. The comb-shaped portion 100 is provided so that the comb portions face each other in the Y direction, for example. The comb-shaped portion 100 holds the substrate G. The root part of the comb-like part 100 is connected to the moving part 101. The moving unit 101 is provided so as to penetrate the + Y side and −Y side walls of the chamber 85. The moving unit 101 has fixing mechanisms 102 on the + Y side and the −Y side of the chamber 85. The moving unit 101 is fixed to the transmission member 88b via the fixing mechanism 102.

  As the transmission member 88b, for example, a linear member such as a wire is used. The transmission member 88b is formed in an annular shape so as to be in contact with at least the + Y side and −Y side sides of the chamber 85. The transmission member 88 b is provided along the X direction on the + Y side and the −Y side of the chamber 85.

  As shown in FIGS. 2 and 4B, the transmission member 88b is routed in the Y direction by pulleys 88f and 88g at the corner of the chamber 85 on the −X side. As illustrated in FIG. 4B, a plurality of pulley portions 88 h are provided on the −X side end surface of the chamber 85. The transmission member 88b is connected to the drive mechanism 88c via the pulley portion 88h on the −X side end surface of the chamber 85. Further, on the + X side of the transmission member 88b, as shown in FIG. 2 and FIG. 3B, the transmission member 88b is hooked on pulleys 88i and 88j provided at corners on the + X side of the chamber 85.

  The drive mechanism 88 c is provided outside the chamber 85 and on the −Z side of the chamber 85. The drive mechanism 88c has a motor (not shown), and is configured to drive the transmission member 88b by rotating the motor. The lifting mechanism 88d is provided on the −Z side of the first substrate transport unit 85F, and is provided so as to be movable in the Z direction by an actuator (not shown). The elevating mechanism 88d has a plurality of support pins 88e. The support pin 88e is disposed at a position overlapping the first opening 87a provided in the stage 87 when viewed in the Z direction. As the elevating mechanism 88d moves in the Z direction, the support pin 88e appears and disappears on the stage 87 with respect to the first opening 87a.

  The delivery mechanism 88 is configured to move the substrate holding member 88a in the X direction via the transmission member 88b by driving the transmission member 88b by a driving mechanism 88c provided outside the chamber 85. In this manner, the substrate holding member 88a inside the chamber 85 can be moved by driving the drive mechanism 88c provided outside the chamber 85. Further, the delivery mechanism 88 can receive the substrate G held by the comb-shaped portion 100 by moving the elevating mechanism 88d in the Z direction.

The transport mechanism 89 includes a substrate holding member 89a, a transmission member 89b, and a drive mechanism 89c. For example, as illustrated in FIG. 4A, the transport mechanism 89 is provided on the −Z side of the delivery mechanism 88.
The substrate holding members 89a are formed in an L shape as viewed in the Z direction, and four substrate holding members 89a are arranged, one at a position corresponding to the corner of the substrate G. The substrate holding member 89a can hold the corners of the substrate G. More specifically, the substrate holding member 89a holds the X-side and Y-side surfaces (side surfaces) and the −Z-side surface (bottom surface) of the corners of the substrate G. The four substrate holding members 89 a are fixed to the support wire 105. The support wire 105 is composed of a total of six wires, two wires provided along the X direction and four wires provided along the Y direction. All the supporting wires 105 are in a state where tension is applied.

  The two wires 105X provided along the X direction connect the substrate holding members 89a arranged along the X direction among the four substrate holding members 89a. The four wires 105Y provided along the Y direction are provided so as to penetrate the chamber 85 in the Y direction. Among the four wires 105 </ b> Y, the most + X side wire 105 </ b> Y is connected to the two + X side substrate holding members 89 a through the support member 106. The most -X side wire 105 </ b> Y is connected to the two −X side substrate holding members 89 a through the support member 107.

  On the + Y side of the chamber 85, two fixing mechanisms 108 that are fixed to the transmission member 89b are provided. The + Y side end of the wire 105Y is connected to the two fixing mechanisms 108, respectively. Two fixing mechanisms 109 fixed to the transmission member 89 b are provided on the −Y side of the chamber 85, and the −Y side end of the wire 105 </ b> Y is connected to the fixing mechanism 109.

  As the transmission member 89b, for example, a linear member such as a wire is used. For example, two transmission members 89b are provided. The two fixing mechanisms 108 and 109 are fixed to each transmission member 89b one by one. Accordingly, one of the two transmission members 89b is connected to the two substrate holding members 89a on the −X side, and the other one of the transmission members 89b is connected to the two substrate holding members 89a on the + X side. .

  Each transmission member 89b is provided along the X direction at the side of the chamber 85, for example. Each transmission member 89b is formed in an annular shape so as to be in contact with at least the + Y side and −Y side sides of the chamber 85. Each transmission member 89 b is provided along the X direction on the + Y side and the −Y side of the chamber 85.

  As shown in FIGS. 2 and 4B, each transmission member 89b is routed in the Y direction by pulleys 89f and 89g at the −X side corner of the chamber 85, respectively. As illustrated in FIG. 4B, a plurality of pulley portions 89 h are provided on the −X side end surface of the chamber 85. Each transmission member 89b is connected to the drive mechanism 89c via the pulley portion 89h on the −X side end surface of the chamber 85. The pulleys 89f, 89g, and 89h can move independently so that the two transmission members 89b do not get entangled.

  In this embodiment, the pulleys 88f, 89f, 88g, 89g, 88h, and 89h are arranged in such a manner that the transmission member 88b and the two transmission members 89b can move independently so as not to be entangled. The arrangement is not limited to that shown, and other arrangements may be used.

  As the transmission member 89b, for example, a linear member such as a wire is used in the same manner as the transmission member 88b. As illustrated in FIG. 3B, the transmission member 89 b provided in the transport mechanism 89 is disposed on the −Z side with respect to the transmission member 88 b provided in the delivery mechanism 88. Further, as shown in FIG. 2 and the like, of the transmission member 88b and the transmission member 89b, for example, respective portions provided along the chamber 85 are arranged so as to overlap in the Z direction view. Therefore, like the transmission member 88b, the transmission member 89b is provided along the X direction at the side of the chamber 85, for example.

  As shown in FIGS. 2 and 4B, each transmission member 89b is routed in the Y direction by pulleys 89f and 89g at the −X side corner of the chamber 85, respectively. As illustrated in FIG. 4B, a plurality of pulley portions 89 h are provided on the −X side end surface of the chamber 85. Each transmission member 89b is connected to the drive mechanism 89c via the pulley portion 89h on the −X side end surface of the chamber 85. Further, on the + X side of each transmission member 89b, as shown in FIG. 2 and FIG. 3B, the transmission members 89b are hooked on pulley portions 89i and 89j provided at corners on the + X side of the chamber 85.

  The drive mechanism 89 c is provided outside the chamber 85 and on the −Z side of the chamber 85. The drive mechanism 89c has a motor (not shown), and is configured to drive each transmission member 89b by rotating the motor. One drive mechanism 89c is provided for each of the two transmission members 89b. For example, by synchronously controlling the drive mechanism 89c, the four substrate holding members 89a can be moved at the same speed.

  The transport mechanism 89 is configured to move the substrate holding member 89a in the X direction via the transmission member 89b by driving the transmission member 89b by the drive mechanism 89c. Thus, the substrate holding member 89a inside the chamber 85 can be moved by driving the drive mechanism 89c provided outside the chamber 85.

  The heating mechanism 90 is provided at the bottom of the processing unit 85P of the chamber 85, for example. The heating mechanism 90 includes a heating unit such as a heating wire and a temperature control unit that adjusts the heating temperature of the heating unit. The suction mechanism 91 sucks the inside of the chamber 85. As the suction mechanism 91, for example, a pump mechanism is used.

(Substrate processing method, UV irradiation method)
A substrate processing method using the substrate processing apparatus SPA configured as described above will be described.
First, the cassette C containing the substrate G is loaded into the cassette standby unit 10 of the loader / unloader LU. The substrate G in the cassette C is transported to the scrubber unit SR via the transport mechanism 11.

  The substrate G transported to the scrubber unit SR is transported to the dry cleaning device 41 via the conveyor mechanism CV1. The substrate G is sequentially processed with the dry cleaning device 41, the wet cleaning device 42, and the air knife device 43. The board | substrate G carried out from the air knife apparatus 43 is conveyed to the spin-drying | dehydration bake unit DH via the conveyor mechanism CV2.

  In the dehydration bake unit DH, first, the substrate G is heated by the heating device 44. The heated substrate G is transported, for example, in the Z direction, and processing with HMDS gas is performed in the HMDS apparatus 46. The substrate G after the HMDS process is transported to the cooling device 45 by the transport mechanism TR1, and the cooling process is performed. The substrate G after the cooling process is transported to the coating unit CT by the conveyor mechanism CV4.

  Thereafter, the substrate G is subjected to a resist film coating process in the coating unit CT. The substrate G after the coating process is transported to the pre-bake unit PR, the pre-bake process is performed in the heating device 50, and the cooling process is performed in the cooling device 51. The substrate G that has been processed in the pre-baking unit PR is transported to the interface unit IF by the transport mechanism TR2.

  In the interface unit IF, for example, temperature adjustment is performed in the buffer device 52, and then peripheral exposure is performed in the peripheral exposure device EE. After the peripheral exposure, the substrate G is transported to the exposure apparatus EX by the transport mechanism TR3, and an exposure process is performed. The substrate G after the exposure processing is transported to the development unit DV after being subjected to heat treatment and cooling processing.

  In the developing unit DV, the substrate G is subjected to a developing process, a rinsing process, and a drying process in order. After the drying process, the substrate G is transported to the ultraviolet processing unit UV by the conveyor mechanism CV10.

  In the ultraviolet processing unit UV, the substrate G is first transported into the chamber 82 of the preliminary apparatus 80. After the substrate G is transferred into the chamber 82, the chamber 82 is sealed and the decompression mechanism 83 is operated to perform decompression processing. After the decompression process, the lifting mechanism 84 is moved to the + Z side, and the substrate G is lifted by the support pins 84a. At this time, the substrate G is lifted to a position higher than the height of the substrate holding member 88a of the delivery mechanism 88 (position on the + Z side).

  After lifting the substrate G, the comb-shaped portion 100 of the substrate holding member 88 a is inserted into the chamber 82, and the comb-shaped portion 100 is disposed on the −Z side of the substrate G. After the comb portion 100 is disposed, the lifting mechanism 84 is moved to the −Z side, and the lifted substrate G is moved to the −Z side. Since the comb-shaped portion 100 is disposed on the −Z side of the substrate G, the substrate G is passed from the support pin 84 a to the comb-shaped portion 100.

  After receiving the substrate G, the substrate holding member 88a is moved to the −X side via the transmission member 88b by driving of the driving mechanism 88c, and the substrate G is carried into the chamber 85. After carrying in the substrate G, the inside of the chamber 85 is sealed, and the suction mechanism 91 is operated to decompress the inside of the chamber 85. Further, the drive mechanism 88c is further driven while the inside of the chamber 85 is decompressed, and the substrate G is disposed so as to overlap the first opening 87a of the first substrate transport unit 85F in the Z direction view.

  After the placement of the substrate G, the lifting mechanism 88d is moved to the + Z side, and the support pin 88e is protruded from the first opening 87a. Since the substrate G is disposed on the + Z side of the support pin 88e, the substrate G is transferred from the substrate holding member 88a to the support pin 88e. After the substrate G is delivered, the drive mechanism 89c is driven to move the substrate holding member 89a to the −Z side of the substrate G. At this time, the drive mechanism 89c is driven so that the four substrate holding members 89a overlap the four corners of the substrate G in the Z direction view.

  After the substrate holding member 89a is disposed, the lifting mechanism 88d is moved to the −Z side, and the substrate G is moved to the −Z side. Since the substrate holding member 89a is disposed on the −Z side of the substrate G, the substrate G is transferred from the support pins 88e to the substrate holding member 89a. When the substrate G is transferred, for example, an air supply unit (not shown) is operated, and air is ejected and sucked at a predetermined ejection amount and suction amount in the second opening 87b, thereby forming an air layer on the stage 87. Keep it. When the substrate G is transferred, since an air layer is formed between the substrate G and the stage 87, the substrate G is held by the air layer and the substrate holding member 89a. For this reason, even if the board | substrate holding member 89a is the structure which hold | maintains only the corner | angular part of the board | substrate G, the board | substrate G will be stably hold | maintained without bending or cracking.

  After the substrate G is held by the substrate holding member 89a, the drive mechanism 89c is driven to transport the substrate G to the processing unit 85P. Since the substrate G is lifted and transported on the air layer, the substrate G can be transported with a small driving force. For this reason, the burden on the transmission member 89b can be reduced. After the substrate G is transferred to the processing unit 85P, the illumination mechanism 86 and the heating mechanism 90 are operated while the substrate P is transferred to the −X side in the processing unit 85P. By this operation, in the processing unit 85P, the surface of the substrate G is irradiated with ultraviolet rays from the illumination mechanism 86 while the substrate P is transported and heated. Since the light shielding member 85d is provided on the + X side and the −X side of the processing unit 85P, the processing is performed without leakage of ultraviolet rays from the processing unit 85P.

  Since the processing unit 85P is irradiated with ultraviolet rays while transporting the substrate G, the substrate G is gradually carried out from the portion where the ultraviolet irradiation has been completed to the second substrate transport unit 85S. When the ultraviolet irradiation is completed for the entire substrate G, the entire substrate G is accommodated in the second substrate transfer unit 85S. After the ultraviolet irradiation is completed, the operation of the illumination mechanism 86 and the heating mechanism 90 is stopped, and the substrate G is transferred to the first substrate transfer unit 85F.

  The substrate G transferred to the first substrate transfer unit 85F is transferred from the transfer mechanism 89 to the substrate transfer mechanism 88, and is transferred from the chamber 85 to the chamber 82 by the substrate transfer mechanism 88. In the chamber 82, the substrate G is transferred from the substrate transfer mechanism 88 to the lifting mechanism 84, and then the substrate G is transferred out of the ultraviolet processing unit UV from the chamber 82 via a transport mechanism (not shown).

  Next, the substrate G is subjected to a post-baking process in the heating device 59 and cooled in the cooling device 60. After the cooling process, the substrate G is accommodated in the cassette C via the transport mechanism 11. In this way, a series of processing of coating processing, exposure processing, and development processing is performed on the substrate G.

  As described above, according to the present embodiment, since the drive mechanisms 88c and 89c are provided outside the chamber 85 in the ultraviolet processing unit UV, it is possible to prevent the drive mechanisms 88c and 89c from winding up dust in the chamber. Can do. In addition, according to the present embodiment, the substrate holding members 88a and 89a are moved by transmitting the driving force of the drive mechanisms 88c and 89c to the substrate holding members 88a and 89a by the transmission members 88b and 89b. The space used for transporting the substrate G can be suppressed, and the airflow in the chamber 85 can be prevented from being disturbed. Thereby, the environment in the chamber 85 can be kept clean, and foreign substances can be prevented from adhering to the substrate G, so that a reduction in throughput can be prevented.

The technical scope of the present invention is not limited to the above-described embodiment, and appropriate modifications can be made without departing from the spirit of the present invention.
For example, in the above-described embodiment, the transmission member 88b, 89b has been described by taking the configuration using a linear member such as a wire as an example. However, the present invention is not limited to this, and a belt-like member such as a belt is used. It does not matter as a configuration. When the routing direction of the transmission members 88b and 89b is changed in the three-dimensional space, for example, the belt-like member can be rotated without being bent by tilting the pulley mechanism by 45 °.

  In the above embodiment, the second opening 87b is arranged in the stage 87, and air is ejected and sucked using the second opening 87b to form an air layer on the stage 87. However, the present invention is not limited to this, and the substrate G may be held without being lifted.

  In the above-described embodiment, the configuration in which the preliminary apparatus 80 of the ultraviolet ray processing apparatus 81 is used as, for example, the decompression chamber of the substrate G has been described as an example. However, the configuration is not limited to this, and other apparatuses are used. It doesn't matter. Examples of the other apparatus include a heating apparatus, a cooling apparatus, and a transfer apparatus for the substrate G, and further, each apparatus that constitutes the substrate processing apparatus SPA.

  In the above embodiment, the substrate carry-in port 80a of the preliminary apparatus 80 is arranged on the + Y side and the substrate carry-in port 81a of the ultraviolet processing apparatus 81 is arranged on the + X side as an example. There is no limitation, and the substrate carry-in port 80a and the substrate carry-in port 81a may be arranged in any direction.

  In the above embodiment, the light shielding member 85d is provided at a position sandwiching the opening 85b. However, the present invention is not limited to this. For example, a flow path of a coolant for cooling the lighting device 86 is provided in the lighting device 86. In the case where they are provided close to each other, the light shielding member 85d may be arranged at a position along the outer diameter of the lighting device 86 (a position inside the opening 85b).

  In addition to the above embodiment, when the substrate G is transported in the ultraviolet ray processing apparatus 81, the pattern shape of the substrate G is adjusted by changing the transport speed when passing through the −Z side of the illumination mechanism 86. You may be the structure to do.

SPA ... Substrate processing device G ... Substrate UV ... Ultraviolet processing unit 80 ... Preliminary device 81 ... Ultraviolet processing device 82, 85 ... Chamber 83 ... Decompression mechanism 84 ... Lifting mechanism 86 ... Illumination mechanism 87 ... Stage 88 ... Delivery mechanism 89 ... Conveyance mechanism 88a, 89a ... Substrate holding member 88b, 89b ... Transmission member 88c, 89c ... Drive mechanism 88d ... Elevating mechanism 88f, 88g, 88h, 88i, 88j ... Pulley part 90 ... Heating mechanism 91 ... Suction mechanism

Claims (4)

A holding mechanism provided in the chamber and provided to be movable while holding the substrate;
An ultraviolet irradiation mechanism that irradiates the substrate that is held in the holding mechanism and moves in the chamber with ultraviolet rays;
A heating mechanism for heating the substrate in the chamber;
A moving mechanism having a driving source provided outside the chamber, and a transmission member connected to the holding mechanism and transmitting a driving force of the driving source to the holding mechanism;
A stage provided in the chamber and having a mechanism for ejecting air to the substrate held by the holding mechanism and floating the substrate;
An ultraviolet irradiation device comprising:   The ultraviolet irradiation device according to claim 1, wherein the ultraviolet irradiation mechanism and the heating mechanism are arranged so as to face each other through a path along which the substrate is conveyed. An ultraviolet irradiation step of holding the substrate by a holding mechanism and irradiating the substrate that is held in the holding mechanism and moving in the chamber with ultraviolet rays;
Air that blows air onto the substrate in the chamber to float the substrate, transmits a driving force from a driving source provided outside the chamber to the holding mechanism via a transmission member, and moves the holding mechanism An ultraviolet irradiation method comprising the steps of:   The ultraviolet irradiation method according to claim 3, wherein in the ultraviolet irradiation step, the other surface of the substrate is heated while irradiating one surface of the substrate with ultraviolet rays.

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