JP2007067375A - Heating/cooling device, substrate processing device and substrate processing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heating/cooling device in which a footprint of a thermal treatment unit is prevented, and which deals with upsizing of an FPD substrate without using a carrying robot. <P>SOLUTION: In the heating/cooling device with a substrate G mounted, a palette P mounted with the substrate G is raised at a specified speed in a heating process chamber 38 by a belt driving mechanism of an elevator. The substrate G is heated by spending a specified time in a process for rising in the heating process chamber 38. When the palette P reaches the top of the heating process chamber 38, the palette is carried from the palette support of the elevator through an upper opening 80a of a partitioning wall 80 to a palette support at the uppermost level of the belt driving mechanism of the elevator of a cooling process chamber 39. Then the palette is cooled while coming down at a predetermined speed in the cooling process chamber 39 by the belt driving mechanism of the elevator. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a heating / cooling processing apparatus, a substrate processing apparatus, and a substrate processing method. For example, a resist coating is applied to a substrate to be processed such as a glass substrate for an FPD (flat panel display) represented by a liquid crystal display (LCD). The present invention relates to a heating / cooling processing apparatus, a substrate processing apparatus, and a substrate processing method for performing a heating process and a cooling process after development processing after exposure.

  In an FPD manufacturing process typified by a liquid crystal display device (LCD), a predetermined film is formed on an FPD substrate, which is a substrate to be processed, and then a photoresist solution is applied to form a resist film. A circuit pattern is formed by a so-called photolithography technique in which a resist film is exposed in accordance with a pattern and developed. In this photolithographic technique, the main process for an FPD substrate, which is a substrate to be processed, is cleaning processing → dehydration baking → adhesion (hydrophobization) processing → resist coating → prebaking → cooling → exposure → development → postbaking → cooling A series of processing is performed, and a predetermined circuit pattern is formed on the resist layer.

  Conventionally, in such a process, processing units for performing each process are arranged on both sides of the transport path in consideration of the process flow, and an FPD substrate is carried into and out of each processing unit by a central transport apparatus that can travel on the transport path. Has been performed by a processing system in which one or a plurality of process blocks are arranged. In such a processing system, for example, heat treatment and cooling processing after resist coating, and heat treatment and cooling processing after development are performed in a thermal processing unit in which heating processing units and cooling processing units are stacked one above the other. (For example, Patent Document 1). And delivery of the FPD board | substrate in the laminated | stacked thermal processing unit has been performed by what is called a conveyance robot.

Further, as described above, in the stacked thermal processing unit, the heat processing unit and the cooling processing unit are each configured to independently process the FPD substrates one by one (for example, patents) Literature 2, Patent Literature 3).
Japanese Patent Application Laid-Open No. 2002-334918 (FIGS. 1, 4, 5, etc.) JP 2001-196299 A (FIG. 6 etc.) JP-A-10-229037 (FIG. 2 etc.)

  Laminating thermal processing units as in Patent Document 1 has a great merit in reducing the footprint especially in the situation where the size of the FPD substrate is increasing. Automatic processing unit is adopted. However, from the viewpoint of improving throughput, the transfer device moves large substrates in the horizontal direction at high speed and with high accuracy, and in addition to this, the transfer robot can also be moved in the vertical direction at high speed and with high accuracy. Has its limits. Further, in recent years, the size of the FPD substrate has been increased, and for example, the length of the long side has exceeded 2 m, and there has been a problem that handling of the FPD substrate by the transfer robot is becoming increasingly difficult.

  Accordingly, an object of the present invention is to provide a heating / cooling processing apparatus that can suppress the footprint of a thermal processing unit and can cope with an increase in size of an FPD substrate without using a transfer robot. It is.

In order to solve the above-described problem, a first aspect of the present invention is a heating / cooling processing apparatus that performs a heating process and a cooling process on a substrate to be processed.
A heat treatment chamber provided with a heating means for heating the substrate to be processed;
An elevating device for raising and / or lowering a plurality of substrates to be treated in the heat treatment chamber;
A cooling treatment chamber provided adjacent to the heat treatment chamber for cooling the substrate to be processed after the heat treatment;
An elevating device for raising and / or lowering a plurality of substrates to be treated in the cooling treatment chamber;
An opening formed between the heat treatment chamber and the cooling treatment chamber and delivering a substrate to be treated;
A heating / cooling processing apparatus is provided.

  According to the heating / cooling processing apparatus, the lifting / lowering device for raising and / or lowering the plurality of substrates to be processed is provided in the heating processing chamber and the cooling processing chamber, so that the plurality of substrates to be processed is raised or lowered at a predetermined speed. Heat treatment and cooling treatment can be performed continuously. Accordingly, the substrate to be processed is superimposed in the heat treatment chamber and the cooling treatment chamber, and the footprint of the apparatus for the heating / cooling treatment can be reduced. In addition, since the opening for delivering the substrate to be processed is provided between the heat treatment chamber and the cooling treatment chamber, the transition from the heat treatment to the cooling treatment is smoothly performed, and the heat treatment to the substrate to be treated and The cooling process can be performed continuously.

  In addition, since a transfer robot is not used, the substrate to be processed can be increased in size. Furthermore, since the substrate to be processed can be continuously heated and cooled in a series of processing flows, a sufficient throughput can be maintained.

  In the first aspect, the lifting device is preferably raised and / or lowered while the substrate to be processed is placed on the pallet. As a result, it is possible to prevent the substrate to be processed from being damaged and to move it up and down reliably.

  The lifting device includes a pair of belt drive mechanisms that are disposed opposite to each other on both sides of the transport path of the substrate to be processed, and that circulate and displace a plurality of pallet support portions that engage with and support the pallet. Is preferred. With such a belt drive mechanism, the pallet on which the substrate to be processed is placed can be raised and lowered continuously and reliably.

  The pallet support part is provided with a plurality of rollers, and the opening of the pallet support part roller of the elevating apparatus of the heat treatment chamber and the roller of the pallet support part of the elevating apparatus of the cooling process chamber are arranged in the opening. It is preferable to provide a transport mechanism for transporting the substrate to be processed from the heat treatment chamber to the cooling treatment chamber in a state where the substrate to be processed is placed on the pallet by being linked via the unit. Thereby, the transition from the heat treatment to the cooling treatment can be performed smoothly and continuously.

  Moreover, it is preferable to provide a pallet circulation mechanism that circulates and conveys the pallet between the heat treatment chamber and the cooling treatment chamber. Thereby, the pallet with the substrate to be processed and the empty pallet can be used by circulating between the heat treatment chamber and the cooling treatment chamber.

  Moreover, it is preferable that the pallet is provided with a support roller that abuts on and supports the back surface of the substrate to be processed and that horizontally rotates the substrate to be processed by rotation. In this case, it is preferable that a suction hole for drawing the substrate to be processed is provided around the support roller. Moreover, it is preferable that the said pallet is provided with the gas blowing hole which blows gas toward the back surface side of a to-be-processed substrate. By these mechanisms, the substrate to be processed can be reliably held and transported to the pallet.

  Further, the heating / cooling processing apparatus according to the first aspect performs thermal treatment associated with the plurality of liquid treatments in the substrate processing apparatus that performs a series of treatments including a plurality of liquid treatments on the substrate to be processed. It is preferable to be incorporated as a thermal processing unit. Thereby, in the flow of a series of processes including a plurality of liquid processes, the accompanying thermal process can be performed without stopping the flow of the substrate to be processed.

  According to a second aspect of the present invention, there is provided a substrate processing apparatus for performing a series of processes including a plurality of liquid processes on a substrate to be processed, including the heating / cooling processing apparatus according to the first aspect. A substrate processing apparatus is provided.

A third aspect of the present invention is a substrate processing method for performing heat treatment and cooling processing on a substrate to be processed in a substrate processing apparatus,
A heat treatment step of heating while raising and / or lowering the substrate to be treated in a heat treatment chamber provided with a heating means;
A transporting step of transporting the substrate to be processed after the heat treatment step into a cooling processing chamber provided with a cooling means;
A cooling process step of cooling the substrate to be processed while being raised and / or lowered in the cooling treatment chamber;
A substrate processing method is provided.

  In the substrate processing method according to the third aspect, it is preferable that the heat treatment step and the cooling treatment step are performed in a state where the substrate to be processed is placed on a pallet.

  Moreover, it is preferable to circulate and use the pallet between the heat treatment chamber and the cooling treatment chamber.

  According to a fourth aspect of the present invention, there is provided a control program which operates on a computer and controls the substrate processing apparatus so that the substrate processing method according to the third aspect is performed at the time of execution. provide.

  According to a fifth aspect of the present invention, there is provided a computer storage medium storing a control program that operates on a computer, and the control program performs the substrate processing method according to the third aspect at the time of execution. Further, a computer storage medium is provided for controlling the substrate processing apparatus.

  According to the heating / cooling processing apparatus of the present invention, the heating process and the cooling process are performed while sequentially raising and lowering the plurality of substrates to be processed, so that the footprint of the apparatus for these thermal processes can be reduced. In addition, since a transfer robot is not used, the substrate to be processed can be increased in size. Furthermore, since the substrate can be continuously heated and cooled without stopping the substrate to be processed in a series of processing flows, sufficient throughput can be maintained.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Here, the case where the present invention is applied to an apparatus and a method for forming a resist film on the surface of an LCD glass substrate (hereinafter simply referred to as “substrate”) G will be described. FIG. 1 is a plan view showing a resist coating and developing apparatus 100 according to an embodiment of the substrate processing apparatus of the present invention.

  The resist coating and developing apparatus 100 includes a cassette station (carrying-in / out unit) 1 on which a cassette C that accommodates a plurality of substrates G is placed, and a plurality of processes for performing a series of processes including resist coating and development on the substrate G. Controls a processing station (processing unit) 2 having a processing unit, an interface station (interface unit) 3 for transferring the substrate G between the exposure apparatus 4, and each component of the resist coating and developing processing apparatus 100. A cassette station 1 and an interface station 3 are arranged at both ends of the processing station 2, respectively. In FIG. 1, the longitudinal direction of the resist coating and developing apparatus 100 is defined as the X direction, and the direction orthogonal to the X direction on the plane is defined as the Y direction.

  The cassette station 1 includes a transfer device 11 for loading and unloading the substrate G between the cassette C and the processing station 2. In the cassette station 1, the cassette C is loaded into and unloaded from the outside. Further, the transfer device 11 has a transfer arm 11a and can move on a transfer path 10 provided along the Y direction which is the arrangement direction of the cassettes C. The transfer arm 11a allows the cassette C and the processing station 2 to move. The substrate G is carried in and out.

  The processing station 2 basically has two parallel rows of transfer lines A and B for transferring the substrate G extending in the X direction. From the cassette station 1 side toward the interface station 3 along the transfer line A. A scrub cleaning unit (SCR) 21, a first thermal processing unit section 26, a resist processing unit 23, and a second thermal processing unit section 27 are arranged. In addition, the second thermal processing unit section 27, the development processing unit (DEV) 24, the i-ray UV irradiation unit (i-UV) 25, and the second one from the interface station 3 side toward the cassette station 1 along the transfer line B. Three thermal processing units 28 are arranged. An excimer UV irradiation unit (e-UV) 22 is provided on a part of the scrub cleaning unit (SCR) 21. An excimer UV irradiation unit (e-UV) 22 is provided to remove organic substances on the substrate G prior to scrubber cleaning, and an i-line UV irradiation unit (i-UV) 25 is used to perform a decoloring process for development. Provided.

  The scrub cleaning unit (SCR) 21 performs the cleaning process and the drying process while the substrate G is transported substantially horizontally without being rotated in the conventional manner. The development processing unit (DEV) 24 also performs the application of the developer, the developer cleaning after the development, and the drying process while being transported substantially horizontally without the substrate G being rotated. In the scrub cleaning processing unit (SCR) 21 and the development processing unit (DEV) 24, the substrate G is transported by, for example, roller transport or belt transport, and the transport inlet and transport outlet of the substrate G are short sides opposite to each other. Is provided. Further, the transport of the substrate G to the i-line UV irradiation unit (i-UV) 25 is continuously performed by a mechanism similar to the transport mechanism of the development processing unit (DEV) 24.

  As shown in a plan view of the interior of FIG. 2, the resist processing unit 23 applies a resist coating processing apparatus (not shown) by dropping a resist solution from a nozzle (not shown) while rotating the substrate G by a spin chuck 51 in the cup 50. CT) 23a, a reduced pressure drying device (VD) 23b for drying the resist film formed on the substrate G in the reduced pressure container 52 under reduced pressure, and a solvent discharge head 53 capable of scanning four sides of the substrate G placed on the stage 54. The peripheral resist removing device (ER) 23c for removing excess resist adhering to the peripheral edge of the substrate G is disposed in that order, and the substrate G is interposed between the pair of sub-arms 56 guided and moved by the guide rail 55. Is transported substantially horizontally. The resist processing unit 23 is provided with a carry-in port 57 and a carry-out port 58 for the substrate G on opposite short sides. The guide rail 55 extends outward from the carry-in port 57 and the carry-out port 58, and the substrate is extended by the sub arm 56. Delivery of G is possible.

  The first thermal processing unit section 26 includes two thermal processing unit blocks (TB) 31 and 32 configured by stacking thermal processing units for performing thermal processing on the substrate G, The thermal processing unit block (TB) 31 is provided on the scrub cleaning processing unit (SCR) 21 side, and the thermal processing unit block (TB) 32 is provided on the resist processing unit 23 side. A first transfer device 33 is provided between the two thermal processing unit blocks (TB) 31 and 32. As shown in the side view of FIG. 3, the thermal processing unit block (TB) 31 includes a pass unit (PASS) 61 that transfers the substrate G in order from the bottom, and two dehydration processes that perform a dehydration baking process on the substrate G. Bake units (DHP) 62 and 63, and an adhesion processing unit (AD) 64 for subjecting the substrate G to a hydrophobic treatment are stacked in four stages, and the thermal processing unit block (TB) 32 includes The pass unit (PASS) 65 for transferring the substrate G in order, the two cooling units (COL) 66 and 67 for cooling the substrate G, and the adhesion processing unit (AD) 68 for performing the hydrophobic treatment on the substrate G are four. It is configured by stacking in stages. The first transfer device 33 receives the substrate G from the scrub cleaning processing unit (SCR) 21 through the pass unit (PASS) 61, carries in and out the substrate G between the thermal processing units, and the pass unit ( The substrate G is transferred to the resist processing unit 23 via the PASS) 65.

  The first transport device 33 includes a guide rail 91 that extends vertically, a lifting member 92 that moves up and down along the guide rail, a base member 93 that is pivotable on the lifting member 92, and moves forward on the base member 93. A substrate holding arm 94 that is provided so as to be retractable and holds the substrate G is provided. The elevating member 92 is moved up and down by the motor 95, the base member 93 is turned by the motor 96, and the substrate holding arm 94 is moved back and forth by the motor 97. Since the first transfer device 33 is provided so as to be able to move up and down, move back and forth, and turn as described above, it can access any of the thermal processing unit blocks (TB) 31 and 32.

  The second thermal processing unit section 27 includes two thermal processing unit blocks (TB) 34 and 35 configured by stacking thermal processing units that perform thermal processing on the substrate G, and The thermal processing unit block (TB) 34 is provided on the resist processing unit 23 side, and the thermal processing unit block (TB) 35 is provided on the development processing unit (DEV) 24 side. A second transport device 36 is provided between the two thermal processing unit blocks (TB) 34 and 35. As shown in the side view of FIG. 4, the thermal processing unit block (TB) 34 includes a pass unit (PASS) 69 that transfers the substrate G in order from the bottom, and three prebaking units that perform prebaking processing on the substrate G. (PREBAKE) 70, 71 and 72 are stacked in four stages, and the thermal processing unit block (TB) 35 includes a pass unit (PASS) 73 for transferring the substrate G in order from the bottom, and a substrate G. A cooling unit (COL) 74 for cooling and two pre-bake units (PREBAKE) 75 and 76 for performing pre-bake processing on the substrate G are stacked in four stages. The second transfer device 36 receives the substrate G from the resist processing unit 23 via the pass unit (PASS) 69, carries in / out the substrate G between the thermal processing units, and passes through the pass unit (PASS) 73. The substrate G is transferred to all the development processing units (DEV) 24, and the substrate G is transferred to and received from an extension / cooling stage (EXT / COL) 44, which is a substrate transfer portion of the interface station 3 to be described later. The second transfer device 36 has the same structure as the first transfer device 33 and can access any of the thermal processing unit blocks (TB) 34 and 35.

  As shown in FIG. 5, the third thermal processing unit section 28 includes a heating / cooling processing unit (POBAKE / COL) 37 in which a heating processing chamber 38 and a cooling processing chamber 39 are disposed adjacent to each other. . The heat treatment chamber 38 and the cooling treatment chamber 39 are partitioned by a partition wall 80. The partition wall 80 is provided with an upper opening 80a and a lower opening 80b. The heating / cooling processing unit (POBAKE / COL) 37 is provided with a carry-in port 83 for carrying in the substrate G and a carry-out port 84 for carrying out the substrate G on short sides facing each other.

  The heat treatment chamber 38 is provided with a heat generating portion 77 as heating means and an elevating device (not shown in FIG. 5) that raises the substrate G while being placed on the pallet P. The configuration of the lifting device will be described in detail later with reference to FIGS.

  In the cooling processing chamber 39, a blower 78 as a cooling means, an exhaust device 79 that exhausts the cold air from the blower 78, and an elevating device that lowers the substrate G on the pallet P (in FIG. 5, (Not shown) is provided. As shown in the figure, the exhaust device 79 is disposed at a position substantially opposite to the air blower 78, so that a one-way flow from the air blower 78 to the exhaust device 79 is alternately performed in the cooling processing chamber 39, and It is formed in multiple stages (six stages in FIG. 5). With the arrangement of the blower 78 and the exhaust device 79 as described above, the heat-treated substrate G can be efficiently cooled while being lowered.

  FIG. 6 is a perspective view of a main part of the lifting device 81 provided in the heat treatment chamber 38 and the lifting device 82 provided in the cooling processing chamber 39. In FIG. 6, the belt driving device 101a of the lifting / lowering device 81 provided on one side of the substrate transfer path 85 in the heat treatment chamber 38 and the lifting / lowering device 82 provided on one side of the substrate transfer path 85 in the cooling processing chamber 39 are illustrated. Only the belt driving device 101c is illustrated. 7 is a side view of the lifting device 81 provided in the heat treatment chamber 38, and FIG. 8 is a side view of the lifting device 82 provided in the cooling processing chamber 39.

As shown in FIG. 7, the lifting / lowering device 81 of the heat treatment chamber 38 includes a pair of belt driving devices 101a and 101b arranged so as to face each other with the substrate transport path 85 interposed therebetween. The belt driving devices 101a and 101b have a symmetrical structure with the substrate transport path 85 as the center.
The belt driving devices 101a and 101b have two belts 106 and 106 stretched around four rotating shafts 102, 103, 104, and 105, respectively. These rotating shafts 102 to 105 are connected to a driving device (not shown), and rotate the belt 106 at a predetermined speed in a direction indicated by an arrow in FIG. 7, for example.

  On the outer circumferences of the two belts 106, pallet support portions 107 that support the pallet P are projected evenly at 17 locations. Here, as shown in FIG. 9, the pallet P is a rectangular frame, and the substrate G is placed so as to be fitted into the frame. The substrate G is supported by a support portion 131 provided on the pallet P. In this state, the substrate G moves along with the pallet P in the heating / cooling processing unit (POBAKE / COL) 37.

  As shown in an enlarged view in FIG. 7B, a plurality of pallet rollers 108 are provided in a row on the pallet mounting surface of each pallet support portion 107 projecting from the belt 106. Is in contact with the pallet P, which is a rectangular frame, so that the pallet P can be supported. Each pallet roller 108 provided on one pallet support portion 107 is connected by a belt 112 (see FIG. 10), and is configured to be driven to rotate in one direction. The pallet roller 108 is fixed in a non-rotating state when ascending / descending, but when the pallet P is raised to the uppermost position, the pallet roller 108 is rotated by the drive of the motor 109 (see FIG. 10), and the The pallet P is delivered from the lifting device 81 to the lifting device 82 in cooperation with the uppermost pallet support portion 107 of the belt driving device 101 c of the lifting device 82. A pallet delivery mechanism between the lifting devices 81 and 82 will be described later.

  As shown in FIG. 7, in the lifting device 81, the pallet rollers 108 of the pallet support portions 107 on both sides of the pallet P are attached to the frame portions of the pallet P as the belts 106 of the belt drive devices 101 a and 101 b arranged opposite to each other rotate. Comes in contact with the bottom and scoops up the pallet P with the substrate G placed thereon. When one pallet P is lifted, the next pallet P is transferred to the substrate transfer path 85 below the lifting device 81, receives the substrate G transferred from the opposite side of the pallet P, and receives the next pallet support 107. To scoop from both sides. In this way, the pallet P rises one after another.

  As shown in FIG. 8, the elevating device 82 of the cooling processing chamber 39 is configured by a pair of belt driving devices 101c and 101d arranged to face each other with the substrate transport path 85 interposed therebetween. This lifting device 82 is basically the same as the lifting device 81 except that the belts 106 and 106 rotate in the opposite direction to the lifting device 81 in the heat treatment chamber 38 and lower the pallet P on which the substrate G is placed. Since it is the same structure, about the same structure as the raising / lowering apparatus 81, the same code | symbol is attached | subjected and description is abbreviate | omitted.

  Next, the delivery mechanism of the pallet P performed between the lifting device 81 and the lifting device 82 will be described with reference to FIGS. 10 and 11. FIG. 10 shows only the pallet support 107 on the uppermost side of the elevating device 81 and the elevating device 82 (that is, on the belt drive mechanisms 101a and 101c side). The internal structure is shown. FIG. 11 is an enlarged view of a main part of FIG.

  As described above, the upper opening 80a is formed in the partition wall 80 between the heat treatment chamber 38 and the cooling treatment chamber 39, and the substrate G placed on the pallet P is delivered through the upper opening 80a. Is done. A motor 109 and a magnetic coupler 110 connected to the motor 109 are disposed in the vicinity of the upper opening 80a on the heat treatment chamber 38 side. A magnetic coupler 111 is also connected to the pallet roller 108 at the end of each pallet support 107. For example, as shown in FIG. 11, these magnetic couplers 110 and 111 are members in which N poles and S poles of a permanent magnet are alternately arranged on the peripheral surface of a cylindrical body. A belt 112 is connected to the pallet roller 108 of the pallet support part 107, and each pallet roller 108 on the pallet support part 107 is configured to rotate synchronously in the same direction.

  In the cooling processing chamber 39, a similar drive mechanism, that is, a motor 109 and a magnetic coupler 110 connected to the motor 109 are arranged on the side opposite to the partition wall 80. The magnetic coupler 111 is also connected to the pallet roller 108 at the end of each pallet support 107 in the lifting device 82. A belt 112 is connected to each pallet roller 108 disposed on the pallet support portion 107, and each pallet roller 108 on the pallet support portion 107 is configured to rotate in synchronization in the same direction.

  In the lifting / lowering device 81 of the heat treatment chamber 38, the arbitrary pallet support portion 107 is positioned at the uppermost delivery position, and in the lifting / lowering device 82 of the other cooling processing chamber 39, the arbitrary pallet support portion 107 is similarly set. Is positioned at the uppermost delivery position, the magnetic couplers 110 and 110 connected to the motors 109 and 109 and the magnetic coupler 111 connected to the pallet roller 108 at the end of the pallet support 107. , 111 are close to each other.

  When the motors 109 and 109 are operated in the state where the magnetic couplers 110 and 111 are close to each other in the heat processing chamber 38 and the cooling processing chamber 39, the magnetic couplers 110 and 110 connected to the motors 109 and 109 rotate, and the magnetic force is increased. As a result, the magnetic couplers 111 and 111 on the pallet supporting portion 107 side are also rotated. As a result, the belts 112 and 112 rotate, and each pallet roller 108 of the uppermost pallet support portion 107 of the elevating device 81 of the heat treatment chamber 38 and the uppermost pallet support portion of the elevating device 82 of the cooling processing chamber 39. 107 pallet rollers 108 rotate in one direction, that is, in a direction from the heat treatment chamber 38 toward the cooling treatment chamber 39. By this rotation, the pallet P on which the substrate G supported by the uppermost pallet support portion 107 of the lifting device 81 of the heat treatment chamber 38 passes through the upper opening 80a and moves up and down the cooling processing chamber 39. It is delivered to the uppermost pallet support part 107 of the apparatus 82 and the substrate G is transported together with the pallet P. With such a configuration, it is possible to operate the pallet roller 108 of the pallet support unit 107 that has reached a predetermined position by one motor 109, and one motor is provided for each pallet support unit 107. Compared to the case, the structure of the apparatus can be simplified, and the operational reliability of the apparatus can be improved.

  Referring again to FIGS. 5 to 8, a pallet circulation device 120 that includes a plurality of rollers 120 a and transports the pallet P horizontally is provided below the heat treatment chamber 38 and the cooling treatment chamber 39. Accordingly, the empty pallet P is circulated from the cooling processing chamber 39 toward the heat processing chamber 38 through the lower opening 80b. In addition, as shown in FIG. 12, the pallet circulation device 120 includes a magnetic coupler 128 connected to a motor 127 and a roller side interlocked with the magnetic coupler 128 in a heat treatment chamber 38 and a cooling treatment chamber 39, respectively. A magnetic coupler 129, an end roller 120a coupled to the roller-side magnetic coupler 129, and a roller driving belt 130 for simultaneously driving the plurality of rollers 120a. The delivery mechanism in the pallet circulation device 120 is the same mechanism as the delivery mechanism (see FIGS. 10 and 11) that delivers the pallet P from the lifting device 81 to the lifting device 82 via the upper opening 80a, and thus the description thereof is omitted. To do.

In addition, a roller transport device 121 as a transport unit that transports the substrate G is provided below the heat treatment chamber 38. The roller transport device 121 includes a pallet push-up unit 123 that contacts and pushes up the frame portion of the pallet P, and a plurality of rollers 122. By rotating these rollers 122, the substrate G is transferred to the i-ray UV irradiation unit ( i-UV) Receive from 25 side.
The plurality of rollers 122 arranged in the roller transport device 121 can adjust the vertical protrusion amount with respect to the pallet push-up unit 123 by an axial center displacement mechanism (not shown). In addition, the roller transport device 121 is configured to be moved up and down as a whole by a lifting mechanism (not shown).

Similarly, below the cooling processing chamber 39, a roller transfer device 124 is provided as a transfer means for transferring the substrate G. The roller transport device 124 includes a pallet contact portion 126 that contacts and supports the frame portion of the pallet P, and a plurality of rollers 125, and the substrate G is transported to the cassette station 1 by the rotation of the rollers 125. Deliver to device 11.
The plurality of rollers 125 arranged in the roller conveying device 124 can adjust the vertical protrusion amount with respect to the pallet contact portion 126 by an axial center displacement mechanism (not shown). In addition, the roller transport device 124 is configured to be moved up and down as a whole by a lifting mechanism (not shown).

FIG. 13 shows a procedure for delivering the substrate G to the lifting / lowering device 81 in the heat treatment chamber 38 in the heating / cooling treatment unit (POBAKE / COL) 37 having the above-described configuration.
First, as shown in FIG. 13A, the empty pallet P is conveyed from the cooling processing chamber 39 to the heat processing chamber 38 through the lower opening 80b by the rotation of the roller 120a of the pallet circulation device 120. Next, as shown in FIG. 13 (b), the roller transport device 121 provided with a lifting mechanism (not shown) is lifted, and the pallet push-up portion 123 extended in the lateral direction is placed on the frame portion of the pallet P from below. Abut. At this time, the roller 122 of the roller conveying device 121 is inserted into the frame of the pallet P, and the upper portion of the roller 122 is set to be slightly higher than the pallet P.

  Next, as shown in FIG. 13C, when the substrate G is carried into the heat treatment chamber 38 from the i-line UV irradiation unit (i-UV) 25 side through the carry-in port 83, the roller transport device 121 is moved. The roller 122 rotates to receive the substrate G. Then, when only the roller 122 is lowered as shown by an arrow in FIG. 13C with respect to the pallet pushing-up portion 123 by the shaft center displacement mechanism (not shown) provided in the roller conveying device 121, the roller 122 is supported on the roller 122. The substrate G that has been lowered is lowered and placed on the support portion 131 (see FIG. 9) in the frame of the pallet P as shown in FIG.

  Next, as shown in FIG. 13 (e), the roller transport device 121 is lifted by a lifting mechanism (not shown), whereby the pallet P on which the substrate G is placed is transferred to the belt driving devices 101a and 101b of the lifting device 81. Raise to the position of the lowest pallet support 107. Then, the pallet P on which the substrate G is placed is delivered to the lowest pallet support portion 107.

  As described above, the pallet P on which the substrate G is placed is transferred to the elevating device 81 and moves up in the heat treatment chamber 38 at a predetermined speed. Referring again to FIG. 5, the heat generating portion 77 is provided in the heat treatment chamber 38 as described above, and the pallet P is heated over a predetermined time in the ascending process. When the pallet P on which the substrate G is placed reaches the upper portion of the heat treatment chamber 38, the delivery mechanism (see FIGS. 10 and 11) causes the pallet support portion 107 of the belt drive mechanisms 101a and 101b of the elevating device 81 to be moved. Then, it is conveyed through the upper opening 80a of the partition wall 80 to the uppermost pallet support portion 107 of the belt driving mechanisms 101c and 101d of the lifting device 82 of the cooling processing chamber 39. Then, the pallet P on which the substrate G is placed is lowered at a predetermined speed in the cooling processing chamber 39 while being supported by the belt driving mechanisms 101c and 101d of the elevating device 82.

  In this way, by performing the heat treatment and the cooling treatment one after another while moving the plurality of substrates G in the vertical direction, the space required for the heat treatment and the cooling treatment can be reduced, and the conventional stacked thermal treatment unit can be realized. Compared to this, the footprint can be further reduced. In addition, since the substrate G can be continuously processed without the need for a transfer robot, high throughput can be maintained.

  When the pallet P on which the substrate G is placed reaches the lower part of the belt driving mechanisms 101c and 101d of the lifting device 82 in the cooling processing chamber 39, the roller transport device 124 is lifted and lowered by the lifting mechanism (not shown). The belt driving devices 101c and 101d are moved up to the position of the lowest pallet support portion 107, and the pallet P on which the substrate G is placed is supported and received by the pallet contact portion 126. Next, when the roller transport device 124 is lowered to a predetermined position (substrate transport position), the roller 125 is lifted relative to the pallet contact portion 126 by the shaft center displacement mechanism. As a result, the substrate G is lifted by the roller 125 and is lifted from the pallet P. By rotating the roller 125 in this state, the substrate G is directed to the transfer device 11 of the cassette station 1 via the carry-out port 84. Can be carried out.

  On the other hand, the empty pallet P that has released the substrate G is returned to the heat treatment chamber 38 by the pallet circulation device 120 through the lower opening 80 b of the partition wall 80. In this manner, the pallet P circulates in the heat treatment chamber 38 and the cooling treatment chamber 39 while alternately taking the state where the substrate G is placed and the empty state where the substrate G is not placed. By using the pallet P, the substrate G can be moved up and down while being stably supported, and the substrate G can be prevented from being damaged.

  1 to 4 again, the substrate G is carried into the scrub cleaning unit (SCR) 21 and the excimer UV irradiation unit (e-UV) 22 by the transport device 11 of the cassette station 1. Further, as described above, the substrate G of the scrub cleaning processing unit (SCR) 21 is carried out to the pass unit (PASS) 61 of the thermal processing unit block (TB) 31 by, for example, roller conveyance, and a pin (not shown) protrudes there. The substrate G thus lifted is transported by the first transport device 33.

  Further, the substrate G is carried into the resist processing unit 23 after the substrate G is transferred to the pass unit (PASS) 65 by the first transfer device 33 and then from the carry-in port 57 by the pair of sub arms 56. In the resist processing unit 23, the substrate G is transported by the sub arm 56 through the carry-out port 58 to the pass unit (PASS) 69 of the thermal processing unit block (TB) 34, and on a pin (not shown) protruding there. The substrate G is unloaded. The loading of the substrate G into the development processing unit (DEV) 24 is performed by lowering the substrate G from a state where the substrate G is raised by protruding a pin (not shown) in the pass unit (PASS) 73 of the thermal processing unit block (TB) 35. Thus, for example, the roller transport mechanism extended to the pass unit (PASS) 73 is operated. The substrate G of the i-line UV irradiation unit (i-UV) 25 is delivered to a heating / cooling processing unit (POBAKE / COL) 37 by roller conveyance, for example. Further, the substrate G after the completion of all the processes is roller-transferred from the cooling processing chamber 39 of the heating / cooling processing unit (POBAKE / COL) 37 and transferred to the transfer device 11 of the cassette station 1.

  In the processing station 2, the processing units and the transfer devices are arranged so as to form the two rows of transfer lines A and B as described above, and basically in the order of processing. A space 40 is provided between B.

  The interface station 3 includes a transfer device 42 that loads and unloads the substrate G between the processing station 2 and the exposure device 4, a buffer stage (BUF) 43 on which a buffer cassette is disposed, and a substrate having a cooling function. An extension / cooling stage (EXT / COL) 44 serving as a delivery unit is provided, and an external device block 45 in which a titler (TITLER) and a peripheral exposure device (EE) are stacked vertically is adjacent to the transport device 42. Is provided. The transfer device 42 includes a transfer arm 42 a, and the transfer arm 42 a carries in and out the substrate G between the processing station 2 and the exposure device 4.

  Each component of the resist coating and developing apparatus 100 is controlled by the control unit 201. The control unit 201 includes a controller 202 having a CPU. The controller 202 includes a keyboard on which a process manager manages command input to manage the resist coating and developing apparatus 100, a resist coating and developing process, and the like. A user interface 203 including a display for visualizing and displaying the operating status of the processing apparatus 100 is connected.

  The controller 202 records a control program (software), processing condition data, and the like for realizing various processes such as a heating process and a cooling process executed by the resist coating and developing apparatus 100 under the control of the controller 202. A storage unit 204 in which the recipe is stored is connected.

  Then, if necessary, an arbitrary recipe is called from the storage unit 204 by an instruction from the user interface 203 and the controller 202 executes the recipe, and the resist coating and developing apparatus 100 performs a desired operation under the control of the controller 202. Processing is performed. In addition, recipes such as the control program and processing condition data may be stored in a computer-readable storage medium such as a CD-ROM, a hard disk, a flexible disk, a flash memory, or other recipes. It is also possible to transmit the data from the device at any time via, for example, a dedicated line and use it online.

  In the resist coating and developing apparatus 100 configured as described above, first, the substrate G in the cassette C disposed in the cassette station 1 is transferred to the excimer UV irradiation unit (e-UV) 22 of the processing station 2 by the transport apparatus 11. The scrub is pre-processed. Next, the transport mechanism 11 carries the substrate G into a scrub cleaning unit (SCR) 21 disposed under the excimer UV irradiation unit (e-UV) 22 for scrub cleaning. In this scrub cleaning, the cleaning process and the drying process are performed while the substrate G is transported substantially horizontally without being rotated. After the scrub cleaning process, the substrate G is carried out to the pass unit (PASS) 61 of the thermal processing unit block (TB) 31 belonging to the first thermal processing unit section 26 by, for example, roller conveyance.

  The substrate G arranged in the pass unit (PASS) 61 is lifted by protruding a pin (not shown), and is transported to the first thermal processing unit section 26 to be subjected to the following series of processes. That is, it is first transported to one of the dehydration bake units (DHP) 62, 63 of the thermal processing unit block (TB) 31 and subjected to heat treatment, and then the cooling unit (COL) of the thermal processing unit block (TB) 32. ) After being transported to either of 66 and 67 and cooled, the adhesion processing unit (AD) 64 of the thermal processing unit block (TB) 31 and the thermal processing unit block (TB) in order to improve the fixability of the resist. ) Conveyed to one of 32 adhesion processing units (AD) 68, where it is subjected to adhesion treatment (hydrophobization treatment) by HMDS, and then conveyed to one of the cooling units (COL) 66, 67 to be cooled, Furthermore, the pass unit (PASS) of the thermal processing unit block (TB) 32 It is conveyed to the 65. At this time, all the conveyance processing is performed by the first conveyance device 33. In some cases, the adhesion process is not performed. In this case, the substrate G is immediately transferred to the pass unit (PASS) 65 after dehydration baking and cooling.

  Thereafter, the substrate G placed in the pass unit (PASS) 65 is carried into the resist processing unit 23 by the sub arm 56 of the resist processing unit 23. Then, the substrate G is first transported to the resist coating processing device (CT) 23a therein, where the resist solution is spin-coated on the substrate G, and then transported to the vacuum drying device (VD) 23b by the sub-arm 56 to reduce the pressure. The substrate is dried, and further conveyed to the peripheral resist removing device (ER) 23c by the sub-arm 56 to remove excess resist on the peripheral edge of the substrate G. After the peripheral resist removal is completed, the substrate G is unloaded from the resist processing unit 23 by the sub arm 56. As described above, the decompression drying device (VD) 23b is provided after the resist coating processing device (CT) 23a. If this is not provided, the substrate G coated with the resist is prebaked or after the development processing. After the post-bake treatment, the shapes of lift pins, fixing pins, etc. may be transferred to the substrate G. In this way, the solvent in the resist can be obtained by performing vacuum drying without heating by a vacuum drying apparatus (VD). Is released gradually and does not cause rapid drying as in the case of drying by heating, can accelerate the drying of the resist without adversely affecting the resist, and effectively prevents transfer on the substrate. Because it can be done.

  After the coating process is completed in this way, the substrate G carried out of the resist processing unit 23 by the sub arm 56 is transferred to the pass unit (PASS) of the thermal processing unit block (TB) 34 belonging to the second thermal processing unit section 27. ) Passed to 69. The substrate G placed in the pass unit (PASS) 69 is pre-baked (PREBAKE) 70, 71, 72 of the thermal processing unit block (TB) 34 and the thermal processing unit block (TB) by the second transfer device 36. ) It is transported to one of 35 pre-baking units (PREBAKE) 75 and 76 and pre-baked, and then transported to a cooling unit (COL) 74 of the thermal processing unit block (TB) 35 to be cooled to a predetermined temperature. Then, it is further transported by the second transport device 36 to the pass unit (PASS) 73 of the thermal processing unit block (TB) 35.

  Thereafter, the substrate G is transferred to the extension / cooling stage (EXT / COL) 44 of the interface station 3 by the second transfer device 36, and transferred to the peripheral exposure device (EE) of the external device block 45 by the transfer device 42 of the interface station 3. Then, exposure is performed to remove the peripheral resist, and then the wafer is transferred to the exposure device 4 by the transfer device 42 where the resist film on the substrate G is exposed to form a predetermined pattern. In some cases, the substrate G is accommodated in a buffer cassette on the buffer stage (BUF) 43 and then transferred to the exposure apparatus 4.

  After the exposure is completed, the substrate G is loaded into the upper titler (TITLER) of the external device block 45 by the transfer device 42 of the interface station 3 and predetermined information is written on the substrate G, and then the extension cooling stage (EXT / COL). ) 44, and is carried into the processing station 2 again from there. That is, the substrate G is transported by the second transport device 36 to the pass unit (PASS) 73 of the thermal processing unit block (TB) 35 belonging to the second thermal processing unit section 27. Further, for example, a roller transport mechanism extended from the development processing unit (DEV) 24 to the pass unit (PASS) 73 by causing the pins to protrude in the pass unit (PASS) 73 and lowering the substrate G from the raised state. The substrate G is carried into the development processing unit (DEV) 24 and subjected to development processing. In this development processing, the substrate G is not rotated as in the prior art, and for example, the developer application, the developer removal after development, and the drying treatment are performed while being transported substantially horizontally by roller transport. As a result, the same processing capability as conventionally using three rotation type development processing units can be realized in a smaller space.

  After the development processing is completed, the substrate G is transported from the development processing unit (DEV) 24 to the i-line UV irradiation unit (i-UV) 25 by a continuous transport mechanism, for example, roller transport, and the substrate G is subjected to decolorization processing. The Thereafter, the substrate G is transferred to the heating / cooling processing unit (POBAKE / COL) 37 of the third thermal processing unit section 28 by a transfer mechanism in the i-ray UV irradiation unit (i-UV) 25, for example, roller transfer. .

  The substrate G transferred to the heating / cooling processing unit (POBAKE / COL) 37 is post-baked in the heating processing chamber 38 as described above, and then cooled to a predetermined temperature in the cooling processing chamber 39.

  At this time, the amount of heat generated by the heat generating portion 77 provided in the heat treatment chamber 38, the amount of air blown by the blower 78 in the cooling processing chamber 39, the amount of exhaust by the exhaust device 79, and the lifting and lowering of the lifting device 81 and the lifting device 82 The speed and the like are controlled to a predetermined condition by the controller 202 of the control unit 201. These controls are executed by, for example, reading a recipe stored in the storage unit 204 by the controller 202 and sending a control signal from the controller 202 to each component of the heating / cooling processing unit (POBAKE / COL) 37. The The operating status of each component of the heating / cooling processing unit (POBAKE / COL) 37 is monitored via the controller 202 and displayed on a display device such as a display in the user interface 203.

  After the heating and cooling processing in the heating / cooling processing unit (POBAKE / COL) 37 is completed, the substrate G is accommodated in a predetermined cassette C arranged in the cassette station 1 by the transfer device 11 of the cassette station 1. The

  As described above, in the heating / cooling processing unit (POBAKE / COL) 37 of the third thermal processing unit section 28 of the resist coating / development processing apparatus 100 of this embodiment, the substrate G is raised in the heating processing chamber 38. In the cooling processing chamber 39, the substrate G is lowered and cooled for a predetermined time so that uniform heating / cooling processing can be performed between the substrates. Since the substrate G can be successively heated and cooled while being moved in the vertical direction, the space can be saved correspondingly, and the footprint can be reduced.

  Further, in the heating / cooling processing unit (POBAKE / COL) 37, by using the pallet P, the substrate G can be moved up and down while being stably supported, and a large heat change is applied to the substrate G. In the heating / cooling processing unit (POBAKE / COL) 37, damage to the substrate G can be reliably prevented. Moreover, the pallet P has a simple structure and can be used in a circulating manner.

  Further, since the thermal processing can be performed in the processing flow of the substrate G without transporting the substrate G by the transport robot, high throughput can be maintained.

FIG. 14A is a perspective view showing another aspect of the pallet that can be used in the heating / cooling processing unit (POBAKE / COL) 37, and FIG. 14B shows an enlarged part thereof. . The pallet P ₁ is a box shape with a rectangular, by blowing on the surface, for example, toward a gas such as air to the rear surface of the substrate G, a large number of gas blowing holes 140 for floating the substrate G is provided It has been. These gases blowing holes 140 is communicated with the connection port 140a provided on the side of the pallet P _1, the connection port 140a is configured to be detachably connected to the gas supply mechanism (not shown) .

Further, the both edges of the long sides of the pallet P _1, (in the present embodiment seven on each side) a plurality in the support roller 142 about 100mm pitch are serially arranged. When holding the substrate G on the pallet P ₁ , each support roller 142 abuts on and supports the lower surface of the substrate G and rotates by a roller driving mechanism 143 configured to be detachable from the pallet P _1. It is moved in the horizontal direction of the substrate G Te, from the pallet P ₁ to another member, or for transferring the substrate G into the pallet P ₁ from other members.

Further, as shown in FIG. 14B, the support rollers 142 on both edges of the back surface of the substrate G are disposed around the support rollers 142 so that the substrate G is reliably conveyed by the support rollers 142. abutment suction hole 144 for attracting ambient in the vacuum substrate G to the pallet P ₁ side is provided for example by six. Each suction hole 144 is communicated with the connection port 144a provided on the side of the pallet P _1, the connection port 144a is configured to be detachably connected to a suction mechanism such as a vacuum pump (not shown) Yes.

Figure 15 (a) ~ (e) uses a pallet _{P 1} shown in FIG. 14 shows the procedure when to transfer the substrate G to the lifting device 81 of the heat treatment chamber 38. In the present embodiment, by using the pallet P ₁ having the support roller 142, the lifting devices 81 and 82 similar to those shown in FIGS. 5 to 8 except that the roller 122 of the roller transport device 121 is unnecessary. The substrate G can be pallet transported.

First, as in FIG. 15 (a), the pallet _{P 1} is conveyed from the cooling processing chamber 39 by the rotation of the roller 120a of the pallet circulation system 120 to the heating chamber 38 through the lower opening 80b. Next, as shown in FIG. 15B, when the pallet P ₁ reaches the receiving position of the substrate G, the substrate G is floated with the roller driving mechanism 143 including a motor for driving the support roller 142. For this purpose, a gas supply mechanism (not shown) for ejecting gas from the gas blowing holes 140 on the surface of the pallet P ₁ and a substrate through the suction holes 144 around the support roller 142 to securely contact the substrate G with the support roller 142. suction mechanism (not shown) for sucking G are connected to each pallet P _1.

Next, as shown in FIG. 15C, when the substrate G is carried into the heat treatment chamber 38 from the i-line UV unit (i-UV) 25 side through the carry-in port 83, the gas blowing holes 140 are formed. The substrate G is received by blowing and rotating the support roller 142 while sucking the edge of the back surface of the substrate G through the suction hole 144 while blowing the gas from the substrate and floating the substrate G. Then, as shown in FIG. 15D, when the pallet P ₁ receives the substrate G and the substrate G is supported by the pallet P ₁ , the rotation of the support roller 142 is stopped, and the gas from the gas blowing hole 140 is removed. The suction and suction from the suction hole 144 are stopped. The roller drive mechanism for driving the support roller 142, remove the gas supply mechanism and the suction mechanism from the pallet P _1.

Next, as shown in FIG. 15 (e), by raising the pallet push-up member 150 by an elevator mechanism (not shown) lifts the pallet P ₁ from below. The pallet lifting member 150 is a member corresponding to the pallet lifting portion 123 in the roller transport device 121 according to the embodiment shown in FIGS. Then, the pallet lifting member 150 is further raised, and the pallet P ₁ on which the substrate G is placed is raised to the position of the lowest pallet support portion 107 of the belt driving mechanisms 101 a and 101 b of the lifting device 81. In this way, the pallet P ₁ on which the substrate G is placed is delivered to the lowest pallet support unit 107.

Pallet P ₁ in a state of mounting the substrate G is delivery to the lifting device 81, it rises the heat treatment chamber 38 at a predetermined speed. Thereafter, similarly to the case where the pallet P is used, the pallet of the substrate G is transported in the heat processing chamber 38 and the cooling processing chamber 39.
That is, the substrate G placed on the pallet P ₁ is heated over a predetermined time, the rise process. When the pallet P ₁ on which the substrate G is placed reaches the upper part of the heat treatment chamber 38, the pallet support portions of the belt drive mechanisms 101a and 101b of the elevating device 81 are moved by the delivery mechanism (see FIGS. 10 and 11). From 107, it is conveyed through the upper opening 80a of the partition wall 80 to the uppermost pallet support part 107 of the belt drive mechanisms 101c, 101d of the lifting device 82 of the cooling processing chamber 39. Then, the pallet P ₁ on which the substrate G is placed is lowered at a predetermined speed in the cooling processing chamber 39 while being supported by the belt driving mechanisms 101c and 101d of the elevating device 82.

  As mentioned above, although embodiment of this invention has been described, this invention is not limited to such a form. For example, in the above description, a resist film is taken up as a coating film. However, the coating film is not limited to this, and an insulating film such as an antireflection film or a non-photosensitive organic film, or for a color filter. The color resist film may be used.

  Further, the present invention is not limited to the processing of a glass substrate for LCD, but for example, a light emitting diode (LED) display, an electroluminescence (EL) display, a fluorescent display tube (VFD), a plasma display panel. The present invention can be similarly applied to the case where a coating film is formed on various FPD substrates used for (PDP) or the like.

  Further, in the above embodiment, the elevating type heating / cooling processing unit (POBAKE / COL) 37 is provided in the third thermal processing unit section 28 to perform post-baking processing and cooling processing after the development processing. However, the heating / cooling process is not limited to the third thermal processing unit section 28. For example, the dehydration baking process in the first thermal processing unit section and the subsequent cooling process or the second thermal process are performed. It can also be applied to the pre-baking process in the unit section and the subsequent cooling process.

  INDUSTRIAL APPLICABILITY The present invention can be suitably used when a thermal treatment is performed after a coating film such as a resist film is formed or developed on a large substrate such as an FPD substrate.

1 is a schematic plan view of a resist coating and developing treatment apparatus including a resist coating apparatus that is an embodiment of the present invention. The top view which shows the inside of a resist processing unit. The side view which shows the 1st thermal processing unit section of the resist coating and developing processing apparatus shown in FIG. The side view which shows the 2nd thermal processing unit section of the resist coating and developing processing apparatus shown in FIG. The schematic diagram which shows schematic structure of a heating / cooling processing apparatus. The principal part perspective view with which it uses for description of a raising / lowering apparatus. The side view with which it uses for description of the raising / lowering apparatus in a heat processing apparatus. The side view with which it uses for description of the raising / lowering apparatus in a cooling processing apparatus. The perspective view with which it uses for description of a pallet. The figure which uses for description of the delivery mechanism of the board | substrate from the heat processing chamber to a cooling processing chamber performed through upper opening. The principal part enlarged view with which it uses for description of a delivery mechanism. The figure which uses for description of the delivery mechanism of the pallet from the cooling process chamber to a heat processing chamber performed via a lower opening. The schematic diagram with which it uses for operation | movement description of a roller conveyance apparatus. It is drawing used for description of the pallet of another aspect, (a) is a whole perspective view, (b) is a principal part enlarged view. The schematic diagram with which it uses for operation | movement description of the roller conveying apparatus concerning another embodiment.

Explanation of symbols

1 …… Cassette station 2 …… Processing station 3 …… Interface station 21 …… Scrub cleaning unit (liquid processing unit)
23 …… Resist processing unit (liquid processing unit)
24 …… Development processing unit (liquid processing unit)
26... First thermal processing unit section 27... Second thermal processing unit section 28... Third thermal processing unit section 31, 32, 34, 35. First transport device 36... Second transport device 37... Heating / cooling processing unit (POBAKE / COL)
38 ... Heat treatment chamber 39 ... Cooling treatment chamber 40 ... Space 77 ... Heat generating part 78 ... Blower 79 ... Exhaust device 80 ... Partition wall 81, 82 ... Lifting device 100 ... Resist coating and developing process Equipment (processing equipment)
101a, 101b, 101c, 101d ... belt drive mechanism 201 ... control unit 202 ... controller 203 ... user interface 204 ... storage unit G ... substrate P ... pallet

Claims (15)

A heating / cooling processing apparatus for performing a heating process and a cooling process on a substrate to be processed,
A heat treatment chamber provided with a heating means for heating the substrate to be processed;
An elevating device for raising and / or lowering a plurality of substrates to be treated in the heat treatment chamber;
A cooling treatment chamber provided adjacent to the heat treatment chamber for cooling the substrate to be processed after the heat treatment;
An elevating device for raising and / or lowering a plurality of substrates to be treated in the cooling treatment chamber;
An opening formed between the heat treatment chamber and the cooling treatment chamber and delivering a substrate to be treated;
A heating / cooling processing apparatus, comprising:   The heating / cooling processing apparatus according to claim 1, wherein the elevating device raises and / or lowers the substrate to be processed on a pallet.   The lifting device includes a pair of belt drive mechanisms that are disposed opposite to each other on both sides of a transport path of a substrate to be processed, and that circulate and displace a plurality of pallet support portions that engage with and support the pallet. The heating / cooling processing apparatus according to claim 2.   The pallet support portion is provided with a plurality of rollers, and the pallet support portion roller of the elevating device of the heat treatment chamber and the pallet support portion roller of the elevating device of the cooling treatment chamber are connected to the opening portion. 4. The heating according to claim 3, further comprising a transfer mechanism that transfers the substrate to be processed from the heat treatment chamber to the cooling treatment chamber in a state where the substrate is placed on the pallet. -Cooling processing equipment.   The heating / cooling processing apparatus according to claim 4, further comprising a pallet circulation mechanism that circulates and conveys the pallet between the heat treatment chamber and the cooling treatment chamber.   The pallet is provided with a support roller that abuts on and supports the back surface of the substrate to be processed and that rotates and horizontally moves the substrate to be processed. The heating / cooling processing apparatus according to any one of claims 2 to 5.   7. The heating / cooling processing apparatus according to claim 2, wherein a suction hole for drawing a substrate to be processed is provided around the support roller.   The heating / cooling process according to any one of claims 2 to 7, wherein the pallet is provided with a gas blowing hole for blowing gas toward a back surface side of the substrate to be processed. apparatus.   The substrate processing apparatus for performing a series of processes including a plurality of liquid processes on a substrate to be processed is incorporated as a thermal processing unit for performing a thermal process associated with the plurality of liquid processes. The heating / cooling processing apparatus according to any one of claims 1 to 8.   A substrate processing apparatus for performing a series of processes including a plurality of liquid processes on a substrate to be processed, comprising the heating / cooling processing apparatus according to any one of claims 1 to 8. A substrate processing apparatus. In a substrate processing apparatus, a substrate processing method for performing heat treatment and cooling processing on a substrate to be processed,
A heat treatment step of heating while raising and / or lowering the substrate to be treated in a heat treatment chamber provided with a heating means;
A transporting step of transporting the substrate to be processed after the heat treatment step into a cooling processing chamber provided with a cooling means;
A cooling process step of cooling the substrate to be processed while being raised and / or lowered in the cooling treatment chamber;
A substrate processing method comprising:   The substrate processing method according to claim 11, wherein the heat treatment step and the cooling treatment step are performed in a state where a substrate to be processed is placed on a pallet.   The substrate processing method according to claim 11, wherein the pallet is circulated between the heat treatment chamber and the cooling treatment chamber.   A control program that operates on a computer and controls the substrate processing apparatus so that the substrate processing method according to any one of claims 11 to 13 is performed at the time of execution.   A computer storage medium storing a control program that runs on a computer, wherein the control program is executed so that the substrate processing method according to any one of claims 11 to 13 is performed. A computer storage medium for controlling the substrate processing apparatus.

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