JPH02129323A - Electrical conductivity material - Google Patents
Electrical conductivity materialInfo
- Publication number
- JPH02129323A JPH02129323A JP28031888A JP28031888A JPH02129323A JP H02129323 A JPH02129323 A JP H02129323A JP 28031888 A JP28031888 A JP 28031888A JP 28031888 A JP28031888 A JP 28031888A JP H02129323 A JPH02129323 A JP H02129323A
- Authority
- JP
- Japan
- Prior art keywords
- weight
- less
- alloy
- electrical conductivity
- migration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 17
- 229910052787 antimony Inorganic materials 0.000 claims abstract description 4
- 229910052785 arsenic Inorganic materials 0.000 claims abstract description 4
- 229910052790 beryllium Inorganic materials 0.000 claims abstract description 4
- 229910052796 boron Inorganic materials 0.000 claims abstract description 4
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 4
- 229910052738 indium Inorganic materials 0.000 claims abstract description 4
- 229910052745 lead Inorganic materials 0.000 claims abstract description 4
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 4
- 229910052748 manganese Inorganic materials 0.000 claims abstract description 4
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 4
- 229910052709 silver Inorganic materials 0.000 claims abstract description 4
- 229910052718 tin Inorganic materials 0.000 claims abstract description 4
- 229910052726 zirconium Inorganic materials 0.000 claims abstract description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000012535 impurity Substances 0.000 claims description 4
- 230000005012 migration Effects 0.000 abstract description 20
- 238000013508 migration Methods 0.000 abstract description 20
- 229910000881 Cu alloy Inorganic materials 0.000 abstract description 7
- 229910052742 iron Inorganic materials 0.000 abstract description 4
- 229910052710 silicon Inorganic materials 0.000 abstract description 3
- 229910052725 zinc Inorganic materials 0.000 abstract description 3
- 229910052719 titanium Inorganic materials 0.000 abstract description 2
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 description 18
- 239000000956 alloy Substances 0.000 description 18
- 239000010949 copper Substances 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000008399 tap water Substances 0.000 description 4
- 235000020679 tap water Nutrition 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 101100052669 Schizosaccharomyces pombe (strain 972 / ATCC 24843) N118 gene Proteins 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000003487 electrochemical reaction Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 229910001651 emery Inorganic materials 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Conductive Materials (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、端子、コネクター、バスバー（ブスバーとも
いう）間でのマイグレーションの発生を押えた電気部品
材料用の通電材料に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a current-carrying material for electrical component materials that suppresses migration between terminals, connectors, and bus bars (also referred to as bus bars).
近年、電子、電気機器等の小型軽量化が進み、使用され
るコネクター等の部品も小型化するとともに、部品間の
距離も著しく短くなる傾向にある。BACKGROUND ART In recent years, electronic and electrical equipment, etc. have become smaller and lighter, and the parts used, such as connectors, have also become smaller, and the distance between parts has also tended to become significantly shorter.
また１回路はますます集積化される傾向にある。Also, there is a tendency for circuits to become more and more integrated.
すなわち、従来、個々の電子部品はリード線により接続
されて回路が形成されていたが、部品数が増すに従い回
路が複雑となるので、これらを集積化することにより回
路の小型化が進められている。In other words, in the past, individual electronic components were connected by lead wires to form a circuit, but as the number of components increases, circuits become more complex, so circuits are becoming smaller by integrating them. There is.
従来の小型化、集積化された回路において、異る回路ま
たは配線が小型化のためにわずかな間隔をおいて隔てら
れているが、この間隔内に水などの電解質が介在すると
電気化学的反応が生じ、高電位側の通電部の材料となっ
ている銅合金から溶解した銅イオンが低電位側で析出し
、さらにその量が増すと短絡する現象が生じる。この現
象をマイグレーションといい、このようなマイグレーシ
ョンが起ると、回路が正常に機能しなくなる。従って、
近年では高い強度と高い導電率を有し、かつマイグレー
ションの発生しない材料が強く望まれてた。In conventional miniaturized and integrated circuits, different circuits or wiring are separated by small spaces for miniaturization, but if an electrolyte such as water is present within this space, an electrochemical reaction can occur. occurs, and copper ions dissolved from the copper alloy that is the material of the current-carrying part on the high-potential side precipitate on the low-potential side, and when the amount increases further, a short circuit occurs. This phenomenon is called migration, and when such migration occurs, the circuit no longer functions properly. Therefore,
In recent years, there has been a strong desire for materials that have high strength, high electrical conductivity, and do not cause migration.
本発明者は、上記の問題点に鑑み、マイグレーションの
研究を進め、陽極側に接続される端子、コネクター、バ
スバー等の通電材料として適した銅合金を開発したもの
である。すなわち本発明は、Ｆｅ ０．２重量％以上、
４．０重量％以下、Ｃｏ０．２重量％以上、２．５重量
％以下、Ｐ ０．０１重量％以上、０．５重量％以下、
Ｚｎ ０．０５重量％以上、５．０重量％以下を含み、
残部Ｃｕおよび不可避的不純物からなることを特徴とす
る通電材料及びＦｅ ０．２重量％以上、４．０重量％
以下、Ｃｏ ０．２重量％以上、２．５重量％以下、
Ｐ ０．０１重量％以上、０．５重量％以下、Ｚｎ ０
．０５重量％以上、５．０重量％以下を含み、 さらに
副成分としてＮｉ、 Ｓｉ、 Ｓｎ、 Ａｓ、Ｃｒ、Ｍ
ｇ、Ｍｎ、 Ｓｂ、Ｉｎ。In view of the above-mentioned problems, the present inventor has conducted migration research and has developed a copper alloy suitable as a conductive material for terminals, connectors, bus bars, etc. connected to the anode side. That is, the present invention includes Fe 0.2% by weight or more,
4.0% by weight or less, Co 0.2% by weight or more and 2.5% by weight or less, P 0.01% by weight or more and 0.5% by weight or less,
Contains Zn 0.05% by weight or more and 5.0% by weight or less,
A current-carrying material characterized in that the remainder consists of Cu and unavoidable impurities, and Fe 0.2% by weight or more, 4.0% by weight
Below, Co 0.2% by weight or more and 2.5% by weight or less,
P 0.01% by weight or more, 0.5% by weight or less, Zn 0
．． 05% by weight or more and 5.0% by weight or less, and further contains Ni, Si, Sn, As, Cr, M as subcomponents.
g, Mn, Sb, In.
Ａ１、Ｔｊ、 Ｚｒ、 Ｂｅ、 Ａｇ、 Ｐｂ、Ｂから
なる群より選択された１種または２種以上を総量で０．
００１〜３．０重量％含み、残部Ｃｕおよび不可避的不
純物からなることを特徴とする通電材料に関する。One or more selected from the group consisting of A1, Tj, Zr, Be, Ag, Pb, and B in a total amount of 0.
001 to 3.0% by weight, with the remainder consisting of Cu and unavoidable impurities.
次に合金成分の限定理由について説明する。 Next, the reason for limiting the alloy components will be explained.
Ｆｅ、 ＣｏおよびＰは同時に含有されることによって
、母相中に析出物を形成して強化に寄与するもので、Ｆ
ｅの含有量を０．２重量％以上、４．０重量％以下とす
る理由は、０．２重量％未満では強度の向上が十分では
なく、４．０重量％を超えると導電率および加工性が劣
化するためである。Ｃｏの含有量を０．２重量％以上、
２．５重量％以下とする理由は、０゜２重量％未満では
強度の向上が十分ではなく、２．５重社％を超えると導
電率および加工性が劣化するためである。また、Ｐの含
有量を０．０１重量％以上、０．５重量％以下とする理
由は、０．０１重量％未満では強度の向上は認められず
、０．５重量％を超えると析出物を形成しない余剰のＰ
が母相に固溶して導電率が著しく劣化するためである。When Fe, Co and P are contained at the same time, they form precipitates in the matrix and contribute to strengthening.
The reason for setting the content of e to 0.2% by weight or more and 4.0% by weight or less is that if it is less than 0.2% by weight, the strength will not be improved sufficiently, and if it exceeds 4.0% by weight, the conductivity and processing will be reduced. This is because the quality deteriorates. Co content of 0.2% by weight or more,
The reason for setting the content to 2.5% by weight or less is that if it is less than 0.2% by weight, the strength will not be improved sufficiently, and if it exceeds 2.5% by weight, the electrical conductivity and workability will deteriorate. In addition, the reason why the P content is set to 0.01% by weight or more and 0.5% by weight or less is that if it is less than 0.01% by weight, no improvement in strength will be observed, and if it exceeds 0.5% by weight, precipitation will occur. The surplus P that does not form
This is because the conductivity is significantly deteriorated due to solid solution in the matrix phase.
また、Ｚｎは銅や銅合金に含有することにより。In addition, Zn is contained in copper or copper alloy.
銅および銅合金のマイグレーションを防止する効果があ
る。そのマイグレーションを防止する機構は明確ではな
いが、Ｚｎの存在によりＣｕイオンの溶解量が減少し、
さらに、Ｚｎの化合物の生成により、析出したＣｕ粒子
を介する通電が妨害されることによって、電極間のマイ
グレーション現象が抑制されると推察される。Ｚｎを０
．０５重量％以上、５．０重量％以下とする理由は、Ｚ
ｎ含有量が０．０５重量％未満ではマイグレーション現
象を抑制する効果が少なく、５．０重量％を超えるとマ
イグレーション現象の抑制効果はあるが、導電率が低下
し、通電時の発熱量が大きくなり、熱放散性も低くなる
ためである。It has the effect of preventing migration of copper and copper alloys. Although the mechanism that prevents this migration is not clear, the presence of Zn reduces the amount of dissolved Cu ions,
Furthermore, it is presumed that the generation of the Zn compound impedes the conduction of electricity through the deposited Cu particles, thereby suppressing the migration phenomenon between the electrodes. Zn 0
．． The reason for setting it to 05% by weight or more and 5.0% by weight or less is
If the n content is less than 0.05% by weight, there is little effect of suppressing the migration phenomenon, and if it exceeds 5.0% by weight, there is an effect of suppressing the migration phenomenon, but the conductivity decreases and the amount of heat generated when energized increases. This is because the heat dissipation property becomes low.
さらに副成分としてＮｉ、 Ｓｉ、 Ｓｎ、 Ａｓ、
Ｃｒ、 Ｍｇ、Ｍｎ、 Ｓｂ、Ｉｎ、 Ａ１． Ｔｉ、
Ｚｒ、 Ｂｅ、 Ａｇ、 Ｐｂ、 Ｂからなる１種ま
たは２種以上を総量で０．００１〜３．０重量％添加す
るのは、強度向上のためであるが、０．００１重量％未
満ではその効果がなく、３．０重量％を超えると導電率
の低下が著しいためである。Furthermore, as subcomponents Ni, Si, Sn, As,
Cr, Mg, Mn, Sb, In, A1. Ti,
The purpose of adding one or more of Zr, Be, Ag, Pb, and B in a total amount of 0.001 to 3.0% by weight is to improve strength, but if it is less than 0.001% by weight, the This is because there is no effect, and if it exceeds 3.0% by weight, the conductivity decreases significantly.
次に本発明合金の実施例について説明する。Next, examples of the alloy of the present invention will be described.
第１表に示す組成の合金を大気中あるいは不活性雰囲気
中で溶解鋳造し、面前後熱間圧延し、その後冷間圧延と
焼鈍酸洗をくり返し、最終的に加工度６０％で冷間圧延
した０、８ｍｍの厚さの板を得た。An alloy having the composition shown in Table 1 is melted and cast in air or an inert atmosphere, hot rolled on the front and back sides, then cold rolled, annealed and pickled repeatedly, and finally cold rolled with a workability of 60%. A plate with a thickness of 0.8 mm was obtained.
さらに、この板を４００〜５００℃の温度で時効処理を
行った。また、比較合金Ｎα１６〜１７については最終
圧延後４００〜５００℃で歪取り焼鈍を行った。これら
Ｎα１〜１７について＃１２００エメリー紙にて表面を
研磨し、スケールを除去した。Furthermore, this plate was subjected to aging treatment at a temperature of 400 to 500°C. Further, for comparison alloys Nα16 to 17, strain relief annealing was performed at 400 to 500°C after final rolling. The surfaces of these Nα1 to Nα17 were polished with #1200 emery paper to remove scale.
これらの供試材について、引張強さ、伸び、導電率、耐
マイグレーション性を評価した。耐マイグレーション性
の評価は供試材を１０ｎｎ＋Ｘ１００ｍａ＋に切断し、
２枚１組として、第１図並びに第２図に示すようにして
１両端を水道水中に浸漬した濾紙上に固定した。すなわ
ち、水道水１を入れた容器２に樹脂板３をさし渡し、こ
れに両端を水道水１中に浸漬した濾紙４をかけ、その濾
紙４の上に２枚の供試材５．５を載置して、両端部を樹
脂板３上に耐酸テープ６で固定した。次にこの２枚の供
試材５．５に１４Ｖの直流電圧を加え、経過時間に対す
る電流値の変化を記録計７にて測定した。この結果の代
表例を第３図に示す。また、各供試材における電流値が
０．５Ａになるまでの時間（図中矢印で示す）を第１表
に示す。These test materials were evaluated for tensile strength, elongation, electrical conductivity, and migration resistance. For evaluation of migration resistance, the sample material was cut into 10 nn + x 100 ma +.
A set of two sheets was fixed at both ends onto a filter paper soaked in tap water as shown in FIGS. 1 and 2. That is, a resin plate 3 is placed in a container 2 containing tap water 1, a filter paper 4 with both ends soaked in tap water 1 is placed over the resin plate 3, and two test materials 5.5 are placed on top of the filter paper 4. was placed, and both ends were fixed onto the resin plate 3 with acid-resistant tape 6. Next, a DC voltage of 14 V was applied to these two test materials 5.5, and the change in current value with respect to elapsed time was measured using a recorder 7. A typical example of this result is shown in FIG. Table 1 also shows the time required for the current value to reach 0.5 A (indicated by an arrow in the figure) for each sample material.
第１表から明らかなように、本発明合金Ｎα５は、比較
合金ＮＱ１２、Ｎｎ１３と同濃度のＦｅ、 Ｍｇ、 Ｐ
を含有し、さらに主成分としてＣｏとＺｎを、副成分と
してＴｉを添加した合金である。本発明合金Ｈａ ５は
、比較合金ＮＱ１２、Ｎα１３に比べて、Ｚｎの添加に
より耐マイグレーション性が、ｃｏ、Ｔｉの添加により
引張強さが改善されていることがわかる。同様のことが
本発明合金Ｎα６、Ｎ１１８と、比較合金Ｎα１４との
比較においてもいえ、本発明合金ｈ６、Ｎａ ８は、耐
マイグレーション性と強度に優れている。また１本発明
合金Ｎα３、Ｎα４は、比較合金Ｎ１１１５に比べて耐
マイグレーション性が優れている。一方、比較合金Ｎｎ
１６の丹銅、胤１７の黄銅は、第１表において最も優れ
た耐マイグレーション性を有する合金であるが、強度、
導電率が不十分でバスバー等の通電材料には不適である
。これに対し本発明合金は、通電材料としてバランスの
とれた良好な強度、導電率、耐マイグレーション性を有
している。As is clear from Table 1, the alloy Nα5 of the present invention has the same concentrations of Fe, Mg, and P as the comparative alloys NQ12 and Nn13.
It is an alloy containing Co and Zn as main components and Ti as a subcomponent. It can be seen that the present invention alloy Ha 5 has improved migration resistance due to the addition of Zn and improved tensile strength due to the addition of Co and Ti, compared to the comparative alloys NQ12 and Nα13. The same can be said of the comparison between the alloys Nα6 and N118 of the present invention and the comparative alloy Nα14, with the alloys h6 and Na8 of the present invention having excellent migration resistance and strength. In addition, alloys Nα3 and Nα4 of the present invention have better migration resistance than comparative alloy N1115. On the other hand, comparative alloy Nn
Red bronze No. 16 and brass No. 17 are the alloys with the best migration resistance in Table 1, but the strength and
It has insufficient electrical conductivity and is unsuitable for current-carrying materials such as bus bars. In contrast, the alloy of the present invention has well-balanced strength, electrical conductivity, and migration resistance as a current-carrying material.
本発明合金は強度が高く、導電率も良好で、優れた耐マ
イグレーション性を有する通電材料であり、コネクター
、端子、バスバーなどに用いて有用である。The alloy of the present invention is a conductive material having high strength, good conductivity, and excellent migration resistance, and is useful for connectors, terminals, bus bars, etc.
第１図は本発明の試験に用いる装置の平面図、第２図は
第１図のＡ−Ａ断面図、第３図は試験結果を示すグラフ
である。
１・・・・・・水道水 ２・・・・・・容器３・・
・・・・樹脂板 ４・・・・・・濾紙５・・・・・
・供試材 ６・・・・・・耐酸テープ７・・・・・
・記録計FIG. 1 is a plan view of the apparatus used in the test of the present invention, FIG. 2 is a sectional view taken along the line AA in FIG. 1, and FIG. 3 is a graph showing the test results. 1... Tap water 2... Container 3...
... Resin plate 4 ... Filter paper 5 ...
・Test material 6... Acid-resistant tape 7...
・Recorder
Claims (2)
０．２重量％以上、２．５重量％以下、Ｐ０．０１重量
％以上、０．５重量％以下、Ｚｎ０．０５重量％以上、
５．０重量％以下を含み、残部Ｃｕおよび不可避的不純
物からなることを特徴とする通電材料。(1) Fe: 0.2% by weight or more, 4.0% by weight or less, Co
0.2 wt% or more, 2.5 wt% or less, P0.01 wt% or more, 0.5 wt% or less, Zn0.05 wt% or more,
A current-carrying material comprising 5.0% by weight or less of Cu, with the remainder consisting of Cu and unavoidable impurities.
０．２重量％以上、２．５重量％以下、Ｐ０．０１重量
％以上、０．５重量％以下、Ｚｎ０．０５重量％以上、
５．０重量％以下を含み、さらに副成分としてＮｉ、Ｓ
ｉ、Ｓｎ、Ａｓ、Ｃｒ、Ｍｇ、Ｍｎ、Ｓｂ、Ｉｎ、Ａｌ
、Ｔｉ、Ｚｒ、Ｂｅ、Ａｇ、Ｐｂ、Ｂからなる群より選
択された１種または２種以上を総量で０．００１〜３．
０重量％含み、残部Ｃｕおよび不可避的不純物からなる
ことを特徴とする通電材料。(2) Fe0.2% by weight or more and 4.0% by weight or less, Co
0.2 wt% or more, 2.5 wt% or less, P0.01 wt% or more, 0.5 wt% or less, Zn0.05 wt% or more,
Contains 5.0% by weight or less, and further contains Ni and S as subcomponents.
i, Sn, As, Cr, Mg, Mn, Sb, In, Al
, Ti, Zr, Be, Ag, Pb, and B in a total amount of 0.001 to 3.
A current-carrying material characterized in that it contains 0% by weight of Cu, and the remainder consists of Cu and unavoidable impurities.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28031888A JPH02129323A (en) | 1988-11-08 | 1988-11-08 | Electrical conductivity material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28031888A JPH02129323A (en) | 1988-11-08 | 1988-11-08 | Electrical conductivity material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02129323A true JPH02129323A (en) | 1990-05-17 |
Family
ID=17623325
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28031888A Pending JPH02129323A (en) | 1988-11-08 | 1988-11-08 | Electrical conductivity material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02129323A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007023357A (en) * | 2005-07-19 | 2007-02-01 | Kobe Steel Ltd | Copper alloy plate to be electrically connected through wire |
-
1988
- 1988-11-08 JP JP28031888A patent/JPH02129323A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007023357A (en) * | 2005-07-19 | 2007-02-01 | Kobe Steel Ltd | Copper alloy plate to be electrically connected through wire |
| JP4566082B2 (en) * | 2005-07-19 | 2010-10-20 | 株式会社神戸製鋼所 | Copper alloy plate for pre-plated electrical wiring connection |
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