JPH0499837A - Conductive material - Google Patents

Conductive material

Info

Publication number
JPH0499837A
JPH0499837A JP21375490A JP21375490A JPH0499837A JP H0499837 A JPH0499837 A JP H0499837A JP 21375490 A JP21375490 A JP 21375490A JP 21375490 A JP21375490 A JP 21375490A JP H0499837 A JPH0499837 A JP H0499837A
Authority
JP
Japan
Prior art keywords
migration
conductivity
conductive material
copper
content
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21375490A
Other languages
Japanese (ja)
Inventor
Takatsugu Hatano
隆紹 波多野
Tamio Toe
東江 民夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eneos Corp
Original Assignee
Nippon Mining Co Ltd
Nikko Kyodo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co Ltd, Nikko Kyodo Co Ltd filed Critical Nippon Mining Co Ltd
Priority to JP21375490A priority Critical patent/JPH0499837A/en
Publication of JPH0499837A publication Critical patent/JPH0499837A/en
Pending legal-status Critical Current

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  • Conductive Materials (AREA)

Abstract

PURPOSE:To obtain a conductive material having high conductivity and excellent in migration resistance by specifying a compsn. constituted of Zr, Zn and Cu. CONSTITUTION:This is a conductive material contg., by weight, 0.05 to 1.0% Zr and 0.1 to 5.0% Zn, or furthermore contg., as auxiliary components, total 0.01 to 3.0% of one or >= two kinds among As, Al, Ag, P, Sn, Mg, Mn, Sb, Co, Pb, B, Si and Fe and the balance Cu with inevitable impurities. The material has high conductivity and is free from the generation of migration.

Description

【発明の詳細な説明】 [産業上の利用分野] 本発明は、端子、コネクター、バスバー(ブスバーとも
いう)間でのマイグレーションの発生を押えた電気部品
材料用の通電材料に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a current-carrying material for electrical component materials that suppresses the occurrence of migration between terminals, connectors, and bus bars (also referred to as bus bars).

[従来の技術] 近年、電子、電気機器等の小型軽量化が進み、使用され
るコネクター等の部品も小型化するとともに、部品間の
距離も著しく短くなる傾向にある。又、回路はますます
集積化される傾向にある。すなわち、従来、個々の電子
部品はリード線により接続されて回路が形成されていた
が、部品数が増すに従い回路が複雑となるので、これら
を集積化することにより回路の小型化が進められている
[Prior Art] In recent years, electronic and electrical equipment, etc. have become smaller and lighter, and the parts used, such as connectors, have also become smaller, and the distance between parts has also tended to become significantly shorter. Also, circuits are becoming increasingly integrated. In other words, in the past, individual electronic components were connected by lead wires to form a circuit, but as the number of components increases, circuits become more complex, so circuits are becoming smaller by integrating them. There is.

[発明が解決しようとする課題] 従来の小型化、集積化された回路において、異なる回路
又は配線が小型化のためにわずかな間隔をおいて隔てら
れているが、この間隔内に水などの電解質が介在すると
電気化学的反応が生じ、高電位側の通電部の材料となっ
ている銅合金から溶解した銅イオンが低電位側で析出し
、更にその量が増すと短絡する現象が生じる。この現象
をマイグレーションといい、このようなマイグレーショ
ンが起ると、回路が正常に機能しなくなる。したがって
、近年では高い導電率を有し、かつ、マイグレーション
の発生しない材料が強く望まれていた。
[Problem to be solved by the invention] In conventional miniaturized and integrated circuits, different circuits or wiring are separated by a small interval for miniaturization. When an electrolyte is present, an electrochemical reaction occurs, and copper ions dissolved from the copper alloy that is the material of the current-carrying part on the high-potential side are deposited on the low-potential side, and when the amount increases further, a short circuit occurs. This phenomenon is called migration, and when such migration occurs, the circuit no longer functions properly. Therefore, in recent years, there has been a strong desire for materials that have high electrical conductivity and do not cause migration.

[課題を解決するための手段〕 本発明者らは上記の問題点に鑑み、マイグレーションの
研究を進め、陽極側に接続された端子、コネクター、バ
スバー等の通電材料として、Z r  0.05〜10
wt%、Z n  0.1〜5.0wt%を含み、或い
は更に副成分としてASSAl。
[Means for Solving the Problems] In view of the above-mentioned problems, the present inventors have proceeded with research on migration, and have developed materials with Z r 0.05 to 10
wt%, Z n 0.1 to 5.0 wt%, or further contains ASSAl as a subcomponent.

AgSPSSnSMg、Mn、Sb、Co。AgSPSSnSMg, Mn, Sb, Co.

P b s B SS l % F eからなる1種又
は2種以上を総量で0.O1〜30wt%含み、残部C
u及び不可避的不純物からなることを特徴とするもので
ある。
One or more types consisting of P b s B SS l % Fe in a total amount of 0. Contains 1 to 30 wt% O, balance C
It is characterized by consisting of u and inevitable impurities.

本発明にしたがってCuに添加される元素のそれぞれの
添加量は次のことを考慮して定められる。すなわち、ま
ず、Zrは銅及び銅合金に含有されることにより、銅及
び銅合金のマイグレーション性を抑制する効果を有する
元素である。又、Znは銅及び銅合金にZrと同時に含
有されることにより、銅及び銅合金のマイグレーション
現象をZrのみが含有する場合に比較して抑制する効果
を有する元素である。
According to the present invention, the amount of each element added to Cu is determined in consideration of the following. That is, first, Zr is an element that has the effect of suppressing the migration property of copper and copper alloys by being contained in copper and copper alloys. Moreover, when Zn is contained simultaneously with Zr in copper and copper alloys, it is an element that has the effect of suppressing the migration phenomenon of copper and copper alloys compared to when only Zr is contained.

マイグレーション現象を抑制する機構は明確ではないが
、zr及びZn特にZrの存在によりCuイオンの溶出
量が減少し、Zr及びZnの化合物の生成により、析出
したCu粒子を介する通電が妨害されることによって電
極間のマイグレーション現象が抑制されると推察される
Although the mechanism for suppressing the migration phenomenon is not clear, the presence of Zr and Zn, especially Zr, reduces the amount of Cu ion elution, and the generation of compounds of Zr and Zn impedes the conduction of electricity through the precipitated Cu particles. It is presumed that the migration phenomenon between the electrodes is suppressed by this.

Zr含有量を0.05〜10wt%とする理由はZr含
有量が0.05vt%未満ではマイグレーション現象を
抑制する効果がなく、I 、 Ovt%を超えるとマイ
グレーション現象の抑制効果はあるが、導電率が低下し
、通電時の発熱量が大きくなり、熱放散性も低くなるた
めである。
The reason why the Zr content is set to 0.05 to 10 wt% is that if the Zr content is less than 0.05 vt%, there is no effect of suppressing the migration phenomenon, and if it exceeds I, Ovt%, there is an effect of suppressing the migration phenomenon, but the conductivity This is because the heat dissipation rate decreases, the amount of heat generated during energization increases, and the heat dissipation performance also decreases.

同様にZn含有量を0.1〜50wt%とする理由はZ
n含有量が0.1wt%未満ではマイグレーション現象
をより抑制する効果がなく、50wt%を超えるとマイ
グレーション現象をより抑制する効果はあるが、導電率
が低下し、通電時の発熱量が大きくなり、熱放散性も低
くなるためである。
Similarly, the reason why the Zn content is set to 0.1 to 50 wt% is that Z
If the n content is less than 0.1 wt%, it will not be effective in suppressing the migration phenomenon, and if it exceeds 50 wt%, it will be effective in suppressing the migration phenomenon, but the conductivity will decrease and the amount of heat generated when energized will increase. This is because the heat dissipation property is also lowered.

更に副成分として、As、Al、Ag、P。Furthermore, As, Al, Ag, and P as subcomponents.

S n、MgSMn5S b、Co、P b、B。Sn, MgSMn5Sb, Co, Pb, B.

St、Feからなる1種又は2種以上を0.01vt〜
3.0wt%添加するのは、強度を向上させるためであ
るが、’ 0.01wt%未満ではその効果はなく、3
.0wt%を超えると導電率が低下するためである。
0.01vt or more of one or more of St and Fe
The reason for adding 3.0 wt% is to improve the strength, but if it is less than 0.01 wt%, there is no effect, and 3.0 wt% is added.
.. This is because if it exceeds 0 wt%, the conductivity will decrease.

[実施例] 以下に本発明の具体例を示す。[Example] Specific examples of the present invention are shown below.

まず、第1表に示す組成の本発明合金及び比較合金を大
気中もしくは不活性雰囲気中で溶解鋳造し、面側後熱間
圧延し、その後冷間圧延、焼鈍酸洗をくり返し、400
〜600℃で4時間最終焼鈍、酸洗後加工度20%で冷
間圧延してO16rAmの厚さの板を得た。そして、:
l 1200工メリー紙で表面研磨し、スケールを除去
した。
First, the alloys of the present invention and comparative alloys having the compositions shown in Table 1 were melted and cast in air or an inert atmosphere, hot rolled on the face side, and then cold rolled, annealed and pickled repeatedly.
After final annealing at ~600° C. for 4 hours and pickling, cold rolling was performed at a workability of 20% to obtain a plate with a thickness of 016 rAm. and,:
The surface was polished with 1200mm paper to remove scale.

これらの供試材について引張強さ、伸び、導電率、耐マ
イグレーション性を評価した。耐マイグレーション性は
、供試材を10■×1001111mに切断し、2枚1
組として、第1図並びに第2図に示すようにして水道水
(300cc)中に浸漬した。
These test materials were evaluated for tensile strength, elongation, electrical conductivity, and migration resistance. Migration resistance was determined by cutting the sample material into 10cm x 1001111m pieces and
As a set, they were immersed in tap water (300 cc) as shown in FIGS. 1 and 2.

次にこの2枚の供試材に14Vの直流電圧を加え、経過
時間に対する電流値の変化を記録計にて測定した。この
結果の代表例を第3図に示す。又、各供試材における電
流値が1.OAになるまでの時間(第3図中矢印)を第
1表に示す。
Next, a DC voltage of 14 V was applied to these two test materials, and the change in current value with respect to elapsed time was measured using a recorder. A typical example of this result is shown in FIG. Also, the current value in each sample material is 1. Table 1 shows the time until OA (arrow in Figure 3).

第1表より本発明合金No、1〜9はいずれも導電率が
45%lAC3以上で、かつ強度と耐マイグレーション
性に優れ、自動車の端子、コネクター、バスバー等の耐
マイグレーション性の求められる通電材料として最適な
合金であることが判る。
From Table 1, alloys No. 1 to 9 of the present invention all have a conductivity of 45%lAC3 or higher, have excellent strength and migration resistance, and are electrically conductive materials that require migration resistance, such as automobile terminals, connectors, and bus bars. It turns out that it is the most suitable alloy for this purpose.

又、比較合金No、10はZrとZnの含有量が少ない
ため、耐マイグレーション性が悪く、又、強度も低い。
In addition, comparative alloy No. 10 has a low content of Zr and Zn, so it has poor migration resistance and low strength.

N0.11はZr含有量が少ないため耐マイグレーショ
ン性が悪い。No、12はZr含有量が多すぎるため導
電率が低い。No、13はZn含有量が多いため導電率
が低い。No、14は従来自動車のバスバー材に用いら
れる黄銅1種で強度と耐マイグレ が低い。
Since N0.11 has a low Zr content, it has poor migration resistance. No. 12 has too much Zr content and therefore has low conductivity. No. 13 has a high Zn content and therefore has low conductivity. No. 14 is a type of brass conventionally used for busbar materials in automobiles, and has low strength and migration resistance.

ジョン性は高いが導電率 口発明の効果] 本発明の通電材料は高い導電率を有し、かつ耐マイグレ
ーション性の優れた材料である。
[Effects of invention with high conductivity and conductivity] The current-carrying material of the present invention has high conductivity and is a material with excellent migration resistance.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は耐マイグレーション性のテストのための供試材
の斜視図、第2図は同テストの説明図、第3図は測定結
果を示すグラフである。
FIG. 1 is a perspective view of a sample material for a migration resistance test, FIG. 2 is an explanatory diagram of the test, and FIG. 3 is a graph showing the measurement results.

Claims (2)

【特許請求の範囲】[Claims] (1)Zr0.05〜1.0wt%、Zn0.1〜5.
0wt%を含み、残部Cu及び不可避的不純物からなる
ことを特徴とする通電材料。
(1) Zr0.05-1.0wt%, Zn0.1-5.
A current-carrying material characterized by containing 0 wt% of Cu, and the remainder consisting of Cu and unavoidable impurities.
(2)Zr0.05〜1.0wt%、Zn0.1〜5.
0wt%を含み、更に副成分としてAs、Al、 Ag、P、Sn、Mg、Mn、Sb、Co、Pb、B、
Si、Feからなる1種又は2種以上を総量で0.01
〜3.0wt%含み、残部Cu及び不可避的不純物から
なることを特徴とする通電材料。
(2) Zr0.05-1.0wt%, Zn0.1-5.
Contains 0wt%, and further contains As, Al, Ag, P, Sn, Mg, Mn, Sb, Co, Pb, B, as subcomponents.
One or more of Si and Fe in a total amount of 0.01
A current-carrying material characterized in that it contains up to 3.0 wt% of Cu, with the remainder consisting of Cu and unavoidable impurities.
JP21375490A 1990-08-14 1990-08-14 Conductive material Pending JPH0499837A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21375490A JPH0499837A (en) 1990-08-14 1990-08-14 Conductive material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21375490A JPH0499837A (en) 1990-08-14 1990-08-14 Conductive material

Publications (1)

Publication Number Publication Date
JPH0499837A true JPH0499837A (en) 1992-03-31

Family

ID=16644474

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21375490A Pending JPH0499837A (en) 1990-08-14 1990-08-14 Conductive material

Country Status (1)

Country Link
JP (1) JPH0499837A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100344782B1 (en) * 1997-09-16 2002-07-20 워터베리 롤링 밀즈,인코퍼레이티드 Copper alloy and process for obtaining same
WO2006016614A1 (en) * 2004-08-10 2006-02-16 Sanbo Shindo Kogyo Kabushiki Kaisha Master alloy for use in modifying copper alloy and casting method using the same

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100344782B1 (en) * 1997-09-16 2002-07-20 워터베리 롤링 밀즈,인코퍼레이티드 Copper alloy and process for obtaining same
WO2006016614A1 (en) * 2004-08-10 2006-02-16 Sanbo Shindo Kogyo Kabushiki Kaisha Master alloy for use in modifying copper alloy and casting method using the same
EP1777309A1 (en) * 2004-08-10 2007-04-25 Sanbo Shindo Kogyo Kabushiki Kaishah Master alloy for use in modifying copper alloy and casting method using the same
EP1777309A4 (en) * 2004-08-10 2008-11-05 Mitsubishi Shindo Kk Master alloy for use in modifying copper alloy and casting method using the same
AU2005272455B2 (en) * 2004-08-10 2009-06-11 Mitsubishi Shindoh Co., Ltd. Master alloy for use in modifying copper alloy and casting method using the same
KR100921311B1 (en) * 2004-08-10 2009-10-13 미쓰비시 신도 가부시키가이샤 Casting method of modified copper alloy using the master alloy for use in modifying copper alloy

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