JPH02125334U - - Google Patents

Info

Publication number
JPH02125334U
JPH02125334U JP3311989U JP3311989U JPH02125334U JP H02125334 U JPH02125334 U JP H02125334U JP 3311989 U JP3311989 U JP 3311989U JP 3311989 U JP3311989 U JP 3311989U JP H02125334 U JPH02125334 U JP H02125334U
Authority
JP
Japan
Prior art keywords
wiring pattern
semiconductor device
wiring
width
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3311989U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3311989U priority Critical patent/JPH02125334U/ja
Publication of JPH02125334U publication Critical patent/JPH02125334U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Description

【図面の簡単な説明】
第１図は本考案に係る第１の実施例を示す配線
パターン平面図、第２図は同じく部分断面斜視図
、第３図は第２の実施例を示す配線パターンの平
面図である。第４図は従来の配線パターンの平面
図、第５図は同じく部分断面斜視図である。 １……基板、３，４……配線パターン、３ａ…
…長孔、４ａ……小孔。

Claims (1)

  1. 【実用新案登録請求の範囲】 基板上に配線パターンを形成して樹脂モールド
    した半導体装置において、 上記一定幅の配線パターンに、複数の長孔又は
    小孔を形成し、配線幅を部分的に狭小にしたこと
    を特徴とする半導体装置。
JP3311989U 1989-03-22 1989-03-22 Pending JPH02125334U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3311989U JPH02125334U (ja) 1989-03-22 1989-03-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3311989U JPH02125334U (ja) 1989-03-22 1989-03-22

Publications (1)

Publication Number Publication Date
JPH02125334U true JPH02125334U (ja) 1990-10-16

Family

ID=31536515

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3311989U Pending JPH02125334U (ja) 1989-03-22 1989-03-22

Country Status (1)

Country Link
JP (1) JPH02125334U (ja)

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