JPH02122431U - - Google Patents

Info

Publication number
JPH02122431U
JPH02122431U JP1989030891U JP3089189U JPH02122431U JP H02122431 U JPH02122431 U JP H02122431U JP 1989030891 U JP1989030891 U JP 1989030891U JP 3089189 U JP3089189 U JP 3089189U JP H02122431 U JPH02122431 U JP H02122431U
Authority
JP
Japan
Prior art keywords
jig
ring
utility
wafer
model registration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989030891U
Other languages
English (en)
Other versions
JP2537563Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989030891U priority Critical patent/JP2537563Y2/ja
Priority to KR1019890012753A priority patent/KR920006572B1/ko
Priority to KR1019890017771A priority patent/KR900015261A/ko
Priority to US07/528,483 priority patent/US5169684A/en
Publication of JPH02122431U publication Critical patent/JPH02122431U/ja
Priority to US07/700,945 priority patent/US5169453A/en
Application granted granted Critical
Publication of JP2537563Y2 publication Critical patent/JP2537563Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H01L21/203—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Vapour Deposition (AREA)
  • Formation Of Insulating Films (AREA)

Description

【図面の簡単な説明】
第１図は、本考案の実施例を示す斜視図、第２
図〜第９図は、縦型減圧装置に適用する場合の本
考案の他の実施例を示す側面図、第１０図は、本
考案の他の実施例を示す斜視図、第１１図及び第
１２図は、本考案の治具を横型減圧気相成長装置
に適用する場合の側面図、第１３図は、本考案の
治具を縦型減圧気相成長装置に適用する場合の側
面図、第１４図は、従来の縦型減圧気相成長装置
を示す断面図、第１５図は、従来の横型減圧気相
成長装置を示す断面図である。 図中、１１……支柱、１３……リング状治具、
１４……ウエハー。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 耐熱性材料から中央が開口したリング状に
    形成したことを特徴とする減圧気相成長法に使用
    するウエハー支持用治具。 (2) 前記リング状治具の表面にウエハー支持用
    突起を形成してなる実用新案登録請求の範囲第１
    項に記載のウエハー支持用治具。。 (3) 前記リング状治具を略円形のリング状に形
    成し、円形の一部に直線部を形成してなる実用新
    案登録請求の範囲第１項に記載のウエハー支持用
    治具。
JP1989030891U 1989-03-20 1989-03-20 縦型減圧気相成長装置 Expired - Lifetime JP2537563Y2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP1989030891U JP2537563Y2 (ja) 1989-03-20 1989-03-20 縦型減圧気相成長装置
KR1019890012753A KR920006572B1 (ko) 1989-03-20 1989-09-04 웨이퍼 지지용치구 및 이 치구를 사용하는 감압기상 성장방법
KR1019890017771A KR900015261A (ko) 1989-03-20 1989-12-01 웨이퍼 지지용치구 및 이 치구를 사용하는 감압기상 성장방법
US07/528,483 US5169684A (en) 1989-03-20 1990-05-25 Wafer supporting jig and a decompressed gas phase growth method using such a jig
US07/700,945 US5169453A (en) 1989-03-20 1991-05-14 Wafer supporting jig and a decompressed gas phase growth method using such a jig

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989030891U JP2537563Y2 (ja) 1989-03-20 1989-03-20 縦型減圧気相成長装置

Publications (2)

Publication Number Publication Date
JPH02122431U true JPH02122431U (ja) 1990-10-08
JP2537563Y2 JP2537563Y2 (ja) 1997-06-04

Family

ID=31256340

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989030891U Expired - Lifetime JP2537563Y2 (ja) 1989-03-20 1989-03-20 縦型減圧気相成長装置

Country Status (2)

Country Link
JP (1) JP2537563Y2 (ja)
KR (2) KR920006572B1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002141397A (ja) * 2000-10-31 2002-05-17 Yamagata Shinetsu Sekiei:Kk 石英ガラス製ウェーハ支持治具及びその製造方法
JP2003521109A (ja) * 1999-10-05 2003-07-08 ジーコ・プロドゥクツィオーンス−ウント・ハンデルスゲゼルシャフト・エム・ベー・ハー 半導体ウエハ用保持装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100481829B1 (ko) * 1997-05-30 2005-07-04 삼성전자주식회사 반도체스퍼터링설비의웨이퍼홀더링실드
JP3368852B2 (ja) * 1998-11-27 2003-01-20 株式会社村田製作所 積層パターンの形成方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6089282U (ja) * 1983-11-28 1985-06-19 沖電気工業株式会社 気相成長用サセプタ−
JPS62128633U (ja) * 1986-02-07 1987-08-14
JPS62142839U (ja) * 1986-03-04 1987-09-09

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6089282U (ja) * 1983-11-28 1985-06-19 沖電気工業株式会社 気相成長用サセプタ−
JPS62128633U (ja) * 1986-02-07 1987-08-14
JPS62142839U (ja) * 1986-03-04 1987-09-09

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003521109A (ja) * 1999-10-05 2003-07-08 ジーコ・プロドゥクツィオーンス−ウント・ハンデルスゲゼルシャフト・エム・ベー・ハー 半導体ウエハ用保持装置
JP2002141397A (ja) * 2000-10-31 2002-05-17 Yamagata Shinetsu Sekiei:Kk 石英ガラス製ウェーハ支持治具及びその製造方法
JP4526683B2 (ja) * 2000-10-31 2010-08-18 株式会社山形信越石英 石英ガラス製ウェーハ支持治具及びその製造方法

Also Published As

Publication number Publication date
KR920006572B1 (ko) 1992-08-08
KR900015261A (ko) 1990-10-26
KR910007098A (ko) 1991-04-30
JP2537563Y2 (ja) 1997-06-04

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