JPH02120846U - - Google Patents
Info
- Publication number
- JPH02120846U JPH02120846U JP3030389U JP3030389U JPH02120846U JP H02120846 U JPH02120846 U JP H02120846U JP 3030389 U JP3030389 U JP 3030389U JP 3030389 U JP3030389 U JP 3030389U JP H02120846 U JPH02120846 U JP H02120846U
- Authority
- JP
- Japan
- Prior art keywords
- ceramic substrate
- package
- external connection
- polyimide resin
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 7
- 238000005219 brazing Methods 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 239000009719 polyimide resin Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 238000009413 insulation Methods 0.000 claims 1
- 238000007747 plating Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Description
第１図は本考案にかかる平板状のＩＣパツケー
ジ用セラミツク基板の一例であるフラツトパツケ
ージ用セラミツク基板の部分斜視図、第２図はそ
の外部接続端子の接続部を拡大して見るための要
部拡大斜視図、第３図は本考案にかかる要部を示
す側断面図、第４図は従来例のフラツトパツケー
ジ用セラミツク基板の部分斜視図、第５図はその
要部を示す側断面図である。
図中 ２……ろう付け部、３……ニツケルメツ
キ、４……リード（外部接続端子）、４Ａ……リ
ード（外部接続端子）の取付部、５……銀ろう付
け、６……ニツケルメツキ、７……金メツキ、８
……微小な〓間、９……ポリイミド系樹脂層、１
００……フラツトパツケージ用セラミツク基板（
ＩＣパツケージ用セラミツク基板）、１０１……
セラミツク基板段部表面、１０３……段部。
Fig. 1 is a partial perspective view of a ceramic substrate for a flat package, which is an example of a flat ceramic substrate for an IC package according to the present invention, and Fig. 2 is an enlarged view of the connection part of the external connection terminal. FIG. 3 is a side sectional view showing the main parts of the present invention; FIG. 4 is a partial perspective view of a conventional ceramic substrate for a flat package; FIG. 5 is a side sectional view showing the main parts. It is a diagram. In the diagram 2...brazing part, 3...nickel plating, 4...lead (external connection terminal), 4A...lead (external connection terminal) mounting part, 5...silver brazing, 6...nickel plating, 7 ...Gold plating, 8
...Minute gap, 9...Polyimide resin layer, 1
00... Ceramic substrate for flat package (
Ceramic substrate for IC package), 101...
Ceramic substrate stepped portion surface, 103...stepped portion.
Claims (1)
めのセラミツク基板に、一端が該半導体素子の電
極と電気的に接続し、他端がセラミツク基板の外
表面に露出する配線パターンを複数配列して形成
し、各配線パターンの他端部に外部接続端子をろ
う付けしてなるＩＣパツケージ用セラミツク基板
において、 配列してろう付けされた外部接続端子の取付部
は、その外側に順次ニツケル（Ｎｉ）メツキ、金
（Ａｕ）メツキが実施され、さらに外側に耐熱性
および絶縁性に優れたポリイミド系樹脂がコーテ
イングされてなることを特徴とするＩＣパツケー
ジ用セラミツク基板。 ２ 前記ポリイミド系樹脂コーテイングの肉厚は
、１０〜１００ミクロンであることを特徴とする
請求項１記載のＩＣパツケージ用セラミツク基板
。[Claims for Utility Model Registration] 1. A ceramic substrate for mounting a semiconductor element forming an integrated circuit, one end of which is electrically connected to the electrode of the semiconductor element, and the other end exposed to the outer surface of the ceramic substrate. In a ceramic substrate for an IC package, which is formed by arranging a plurality of wiring patterns and brazing external connection terminals to the other end of each wiring pattern, the mounting part of the external connection terminals that are arranged and brazed is A ceramic substrate for an IC package, characterized in that the outside is sequentially plated with nickel (Ni) and then gold (Au), and the outside is further coated with a polyimide resin having excellent heat resistance and insulation properties. 2. The ceramic substrate for an IC package according to claim 1, wherein the polyimide resin coating has a wall thickness of 10 to 100 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3030389U JPH02120846U (en) | 1989-03-16 | 1989-03-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3030389U JPH02120846U (en) | 1989-03-16 | 1989-03-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02120846U true JPH02120846U (en) | 1990-09-28 |
Family
ID=31255254
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3030389U Pending JPH02120846U (en) | 1989-03-16 | 1989-03-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02120846U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0773769A (en) * | 1993-09-03 | 1995-03-17 | Ngk Spark Plug Co Ltd | External connecting terminal for semi-conductor package and manufacture thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6347150A (en) * | 1986-08-18 | 1988-02-27 | Matsushita Graphic Commun Syst Inc | Electrostatic recorder |
-
1989
- 1989-03-16 JP JP3030389U patent/JPH02120846U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6347150A (en) * | 1986-08-18 | 1988-02-27 | Matsushita Graphic Commun Syst Inc | Electrostatic recorder |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0773769A (en) * | 1993-09-03 | 1995-03-17 | Ngk Spark Plug Co Ltd | External connecting terminal for semi-conductor package and manufacture thereof |
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