JPH02117812U - - Google Patents

Info

Publication number
JPH02117812U
JPH02117812U JP1989026342U JP2634289U JPH02117812U JP H02117812 U JPH02117812 U JP H02117812U JP 1989026342 U JP1989026342 U JP 1989026342U JP 2634289 U JP2634289 U JP 2634289U JP H02117812 U JPH02117812 U JP H02117812U
Authority
JP
Japan
Prior art keywords
material plate
strip
spindle shaft
axis line
attached
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989026342U
Other languages
English (en)
Other versions
JPH0744405Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989026342U priority Critical patent/JPH0744405Y2/ja
Priority to KR1019900002691A priority patent/KR970004752B1/ko
Priority to US07/488,129 priority patent/US5027505A/en
Publication of JPH02117812U publication Critical patent/JPH02117812U/ja
Priority to US07/601,934 priority patent/US5067229A/en
Application granted granted Critical
Publication of JPH0744405Y2 publication Critical patent/JPH0744405Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F3/00—Labels, tag tickets, or similar identification or indication means; Seals; Postage or like stamps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09927—Machine readable code, e.g. bar code
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09936—Marks, inscriptions, etc. for information
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5147—Plural diverse manufacturing apparatus including means for metal shaping or assembling including composite tool
    • Y10T29/5148—Plural diverse manufacturing apparatus including means for metal shaping or assembling including composite tool including severing means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T409/00—Gear cutting, milling, or planing
    • Y10T409/30—Milling
    • Y10T409/306664—Milling including means to infeed rotary cutter toward work
    • Y10T409/306776—Axially
    • Y10T409/307—Axially with work holder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T409/00—Gear cutting, milling, or planing
    • Y10T409/30—Milling
    • Y10T409/306664—Milling including means to infeed rotary cutter toward work
    • Y10T409/306776—Axially
    • Y10T409/307056—Axially and laterally
    • Y10T409/307112—Simultaneously
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T409/00—Gear cutting, milling, or planing
    • Y10T409/30—Milling
    • Y10T409/309184—Milling including cutter limited to rotary motion
    • Y10T409/30924—Cutter turning about vertical axis

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Milling Processes (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Description

【図面の簡単な説明】
第１図は本考案の実施例を示す斜視図、第２図
は第１図の−視拡大断面図、第３図は従来の
例を示す斜視図である。 Ａ……帯状素材板、Ａ１……基板、Ａ２……電
子部品、Ａ３，Ａ４……繋ぎ片、Ａ５……スリツ
ト溝、１……ＸＹテーブル、２……Ｘ軸往復移動
台、３……Ｙ軸往復移動台、４……スピンドル軸
台、５…電動モータ、６……スピンドル軸、７…
…切削又は研削用工具、８，９……吸引ダクト。

Claims (1)

    【実用新案登録請求の範囲】
  1. 複数枚の基板を列状に連接した帯状素材板の搬
    送経路に、前記帯状素材板の表面と略平行な平面
    上において互いに直角に交わるＸ軸線とＹ軸線と
    の二つの軸線方向に沿つて各々往復移動するよう
    にしたＸＹテーブルを配設し、該ＸＹテーブルに
    、高速回転するスピンドル軸を、前記帯状素材板
    に向つて延びるように軸支し、該スピンドル軸の
    先端に、前記帯状素材板において各基板の周囲に
    繋ぎ片を残して部分的に設けられているスリツト
    溝内に嵌まるようにした回転式の切削又は研削用
    工具を取付けたことを特徴とするプリント基板の
    切断装置。
JP1989026342U 1989-03-07 1989-03-07 プリント基板の切断装置 Expired - Lifetime JPH0744405Y2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP1989026342U JPH0744405Y2 (ja) 1989-03-07 1989-03-07 プリント基板の切断装置
KR1019900002691A KR970004752B1 (ko) 1989-03-07 1990-02-28 전자장치의 제조방법 및 그 제조에 사용되는 소재기판 및 이 소재기판으로부터의 프린트기판의 절단장치
US07/488,129 US5027505A (en) 1989-03-07 1990-03-05 Method of producing electronic components
US07/601,934 US5067229A (en) 1989-03-07 1990-10-22 Cutting device for use in manufacturing electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989026342U JPH0744405Y2 (ja) 1989-03-07 1989-03-07 プリント基板の切断装置

Publications (2)

Publication Number Publication Date
JPH02117812U true JPH02117812U (ja) 1990-09-20
JPH0744405Y2 JPH0744405Y2 (ja) 1995-10-11

Family

ID=12190768

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989026342U Expired - Lifetime JPH0744405Y2 (ja) 1989-03-07 1989-03-07 プリント基板の切断装置

Country Status (2)

Country Link
US (1) US5067229A (ja)
JP (1) JPH0744405Y2 (ja)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5133118A (en) * 1991-08-06 1992-07-28 Sheldahl, Inc. Surface mounted components on flex circuits
ATE170312T1 (de) * 1992-06-03 1998-09-15 Landis & Gyr Tech Innovat Münzdetektor
US5259107A (en) * 1992-11-13 1993-11-09 Kabushiki Kaisha Komatsu Seisakusho Microjoint separation apparatus
US5527187A (en) * 1994-11-17 1996-06-18 Ford Motor Company Compliant electrical interconnect
US5894648A (en) * 1996-02-26 1999-04-20 Cencorp High speed depaneling apparatus and method
US5691242A (en) * 1996-02-26 1997-11-25 Motorola, Inc. Method for making an electronic component having an organic substrate
US5819395A (en) * 1996-08-29 1998-10-13 Western Atlas, Inc. Machine tool module with cutting tool and superimposed workpiece-carrying platen
US6192563B1 (en) * 1998-03-02 2001-02-27 Pmj Cencorp Llc Apparatus having improved cycle time for removing a PC board from a panel
US6357108B1 (en) 1998-11-20 2002-03-19 Pmj Cencorp, Llc Depaneling system having multiple router stations
KR100847660B1 (ko) 2001-01-16 2008-07-21 타이코 일렉트로닉스 코포레이션 회로기판 라우터 장치 및 그 방법
US6481098B1 (en) * 2001-07-05 2002-11-19 Shou-Chih Lin Chen Method of manufacturing circuit boards
US6637100B1 (en) * 2002-09-09 2003-10-28 Para Light Electronics Co., Ltd. Method for mounting external heat dissipater to light emitting diode
JP4394432B2 (ja) * 2003-12-15 2010-01-06 日東電工株式会社 配線回路基板保持シートの製造方法
JP4544624B2 (ja) * 2004-09-28 2010-09-15 ローム株式会社 金属製端子板付きハイブリッド回路基板を製造するための素材基板及びハイブリッド回路基板を製造する方法
CN101966605B (zh) * 2010-09-30 2012-02-08 王开来 一种智能卡铣槽机的铣槽方法
CN104227104B (zh) * 2014-09-12 2016-06-29 无锡福源自动化系统工程有限公司 应用于玻璃纤维板的切割铣槽机

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57107717A (en) * 1980-12-23 1982-07-05 Chiyuushiyou Kigyo Shinko Jigyodan Outline cutting-off device for printed circuit board rooter
JPS6042600U (ja) * 1983-09-01 1985-03-26 パイオニア株式会社 基板割り装置

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* Cited by examiner, † Cited by third party
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US3444441A (en) * 1965-06-18 1969-05-13 Motorola Inc Semiconductor devices including lead and plastic housing structure suitable for automated process construction
US3413713A (en) * 1965-06-18 1968-12-03 Motorola Inc Plastic encapsulated transistor and method of making same
US3423516A (en) * 1966-07-13 1969-01-21 Motorola Inc Plastic encapsulated semiconductor assemblies
US3916515A (en) * 1974-09-26 1975-11-04 Northern Electric Co Method of producing printed circuit board in multiple units
US3972262A (en) * 1974-12-26 1976-08-03 Q Corporation Printed circuit board support
US4084312A (en) * 1976-01-07 1978-04-18 Motorola, Inc. Electrically isolated heat sink lead frame for plastic encapsulated semiconductor assemblies
US4054238A (en) * 1976-03-23 1977-10-18 Western Electric Company, Inc. Method, apparatus and lead frame for assembling leads with terminals on a substrate
US4100675A (en) * 1976-11-01 1978-07-18 Mansol Ceramics Company Novel method and apparatus for hermetic encapsulation for integrated circuits and the like
JPS57190339A (en) * 1981-05-19 1982-11-22 Pioneer Electronic Corp Manufacture of printed circuit board unit
US4466183A (en) * 1982-05-03 1984-08-21 National Semiconductor Corporation Integrated circuit packaging process
JPS60183385A (ja) * 1984-03-01 1985-09-18 富士写真フイルム株式会社 ポット蓋の自動着脱システム
JPS6165461A (ja) * 1984-09-07 1986-04-04 Matsumura Seisakusho:Kk Ｉｃリ−ドフレ−ム切断用自動プレス装置
US4627159A (en) * 1984-10-01 1986-12-09 Kurt Waldner Apparatus and method for processing a semiconductor lead frame
DD254300A3 (de) * 1985-12-17 1988-02-24 Veb Plastverarbeitungswerk Schwerin,Dd Schliessvorrichtung fuer spannringe mit hebelverschluss
US4852250A (en) * 1988-01-19 1989-08-01 Microelectronics And Computer Technology Corporation Hermetically sealed package having an electronic component and method of making

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57107717A (en) * 1980-12-23 1982-07-05 Chiyuushiyou Kigyo Shinko Jigyodan Outline cutting-off device for printed circuit board rooter
JPS6042600U (ja) * 1983-09-01 1985-03-26 パイオニア株式会社 基板割り装置

Also Published As

Publication number Publication date
JPH0744405Y2 (ja) 1995-10-11
US5067229A (en) 1991-11-26

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Legal Events

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