JPH0210595B2 - - Google Patents

Info

Publication number
JPH0210595B2
JPH0210595B2 JP58142458A JP14245883A JPH0210595B2 JP H0210595 B2 JPH0210595 B2 JP H0210595B2 JP 58142458 A JP58142458 A JP 58142458A JP 14245883 A JP14245883 A JP 14245883A JP H0210595 B2 JPH0210595 B2 JP H0210595B2
Authority
JP
Japan
Prior art keywords
varnish
pressure
nozzle
discharge
controller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58142458A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6034093A (ja
Inventor
Hideki Washio
Takeo Mogi
Takao Sudo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP14245883A priority Critical patent/JPS6034093A/ja
Publication of JPS6034093A publication Critical patent/JPS6034093A/ja
Publication of JPH0210595B2 publication Critical patent/JPH0210595B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP14245883A 1983-08-05 1983-08-05 プリント回路板への液体ワニスの塗布方法 Granted JPS6034093A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14245883A JPS6034093A (ja) 1983-08-05 1983-08-05 プリント回路板への液体ワニスの塗布方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14245883A JPS6034093A (ja) 1983-08-05 1983-08-05 プリント回路板への液体ワニスの塗布方法

Publications (2)

Publication Number Publication Date
JPS6034093A JPS6034093A (ja) 1985-02-21
JPH0210595B2 true JPH0210595B2 (enrdf_load_stackoverflow) 1990-03-08

Family

ID=15315781

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14245883A Granted JPS6034093A (ja) 1983-08-05 1983-08-05 プリント回路板への液体ワニスの塗布方法

Country Status (1)

Country Link
JP (1) JPS6034093A (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62154794A (ja) * 1985-12-27 1987-07-09 ノードソン株式会社 実装回路板への防湿絶縁剤の被覆方法
JPS63194389A (ja) * 1987-02-07 1988-08-11 株式会社 電子技研 電子回路基板の被膜形成装置
JPS63194390A (ja) * 1987-02-07 1988-08-11 株式会社 電子技研 電子回路基板の被膜形成装置
JPS63194768A (ja) * 1987-02-07 1988-08-11 Denshi Giken:Kk 電子回路基板の被膜形成方法及び装置
JPS63194393A (ja) * 1987-02-07 1988-08-11 株式会社電子技研 電子回路基板の被膜形成方法及び装置
JPS63194392A (ja) * 1987-02-07 1988-08-11 株式会社電子技研 電子回路基板の被膜形成方法及び装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5944907B2 (ja) * 1976-11-30 1984-11-01 日本電気株式会社 液体塗布装置
JPS5720860A (en) * 1980-07-12 1982-02-03 Fujitsu Ltd Pattern input system

Also Published As

Publication number Publication date
JPS6034093A (ja) 1985-02-21

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