JPH0210595B2 - - Google Patents
Info
- Publication number
- JPH0210595B2 JPH0210595B2 JP58142458A JP14245883A JPH0210595B2 JP H0210595 B2 JPH0210595 B2 JP H0210595B2 JP 58142458 A JP58142458 A JP 58142458A JP 14245883 A JP14245883 A JP 14245883A JP H0210595 B2 JPH0210595 B2 JP H0210595B2
- Authority
- JP
- Japan
- Prior art keywords
- varnish
- pressure
- nozzle
- discharge
- controller
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14245883A JPS6034093A (ja) | 1983-08-05 | 1983-08-05 | プリント回路板への液体ワニスの塗布方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14245883A JPS6034093A (ja) | 1983-08-05 | 1983-08-05 | プリント回路板への液体ワニスの塗布方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6034093A JPS6034093A (ja) | 1985-02-21 |
JPH0210595B2 true JPH0210595B2 (enrdf_load_stackoverflow) | 1990-03-08 |
Family
ID=15315781
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14245883A Granted JPS6034093A (ja) | 1983-08-05 | 1983-08-05 | プリント回路板への液体ワニスの塗布方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6034093A (enrdf_load_stackoverflow) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62154794A (ja) * | 1985-12-27 | 1987-07-09 | ノードソン株式会社 | 実装回路板への防湿絶縁剤の被覆方法 |
JPS63194389A (ja) * | 1987-02-07 | 1988-08-11 | 株式会社 電子技研 | 電子回路基板の被膜形成装置 |
JPS63194390A (ja) * | 1987-02-07 | 1988-08-11 | 株式会社 電子技研 | 電子回路基板の被膜形成装置 |
JPS63194768A (ja) * | 1987-02-07 | 1988-08-11 | Denshi Giken:Kk | 電子回路基板の被膜形成方法及び装置 |
JPS63194393A (ja) * | 1987-02-07 | 1988-08-11 | 株式会社電子技研 | 電子回路基板の被膜形成方法及び装置 |
JPS63194392A (ja) * | 1987-02-07 | 1988-08-11 | 株式会社電子技研 | 電子回路基板の被膜形成方法及び装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5944907B2 (ja) * | 1976-11-30 | 1984-11-01 | 日本電気株式会社 | 液体塗布装置 |
JPS5720860A (en) * | 1980-07-12 | 1982-02-03 | Fujitsu Ltd | Pattern input system |
-
1983
- 1983-08-05 JP JP14245883A patent/JPS6034093A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6034093A (ja) | 1985-02-21 |
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