JPH02101545U - - Google Patents
Info
- Publication number
- JPH02101545U JPH02101545U JP831889U JP831889U JPH02101545U JP H02101545 U JPH02101545 U JP H02101545U JP 831889 U JP831889 U JP 831889U JP 831889 U JP831889 U JP 831889U JP H02101545 U JPH02101545 U JP H02101545U
- Authority
- JP
- Japan
- Prior art keywords
- eutectic solder
- main surface
- metallized layer
- cap
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005496 eutectics Effects 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- 229910052732 germanium Inorganic materials 0.000 claims 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 238000005219 brazing Methods 0.000 description 3
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP831889U JPH02101545U (enrdf_load_stackoverflow) | 1989-01-30 | 1989-01-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP831889U JPH02101545U (enrdf_load_stackoverflow) | 1989-01-30 | 1989-01-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02101545U true JPH02101545U (enrdf_load_stackoverflow) | 1990-08-13 |
Family
ID=31214087
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP831889U Pending JPH02101545U (enrdf_load_stackoverflow) | 1989-01-30 | 1989-01-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02101545U (enrdf_load_stackoverflow) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63111697A (ja) * | 1986-10-30 | 1988-05-16 | 株式会社東芝 | 配線基板およびその製造方法 |
| JPS63257255A (ja) * | 1987-04-14 | 1988-10-25 | Sumitomo Electric Ind Ltd | 集積回路パツケ−ジ |
-
1989
- 1989-01-30 JP JP831889U patent/JPH02101545U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63111697A (ja) * | 1986-10-30 | 1988-05-16 | 株式会社東芝 | 配線基板およびその製造方法 |
| JPS63257255A (ja) * | 1987-04-14 | 1988-10-25 | Sumitomo Electric Ind Ltd | 集積回路パツケ−ジ |
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