JPH0440284Y2 - - Google Patents
Info
- Publication number
- JPH0440284Y2 JPH0440284Y2 JP10456687U JP10456687U JPH0440284Y2 JP H0440284 Y2 JPH0440284 Y2 JP H0440284Y2 JP 10456687 U JP10456687 U JP 10456687U JP 10456687 U JP10456687 U JP 10456687U JP H0440284 Y2 JPH0440284 Y2 JP H0440284Y2
- Authority
- JP
- Japan
- Prior art keywords
- metallization
- hole
- ceramic
- semiconductor container
- brazing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000001465 metallisation Methods 0.000 claims description 29
- 239000000919 ceramic Substances 0.000 claims description 20
- 238000005219 brazing Methods 0.000 claims description 14
- 239000004065 semiconductor Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 238000005245 sintering Methods 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10456687U JPH0440284Y2 (enrdf_load_stackoverflow) | 1987-07-09 | 1987-07-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10456687U JPH0440284Y2 (enrdf_load_stackoverflow) | 1987-07-09 | 1987-07-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6411553U JPS6411553U (enrdf_load_stackoverflow) | 1989-01-20 |
| JPH0440284Y2 true JPH0440284Y2 (enrdf_load_stackoverflow) | 1992-09-21 |
Family
ID=31336399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10456687U Expired JPH0440284Y2 (enrdf_load_stackoverflow) | 1987-07-09 | 1987-07-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0440284Y2 (enrdf_load_stackoverflow) |
-
1987
- 1987-07-09 JP JP10456687U patent/JPH0440284Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6411553U (enrdf_load_stackoverflow) | 1989-01-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3704864B2 (ja) | 半導体素子の実装構造 | |
| JP2001526002A (ja) | 改良はんだボール接合 | |
| US4578304A (en) | Multilayer wiring substrate | |
| US6007669A (en) | Layer to layer interconnect | |
| JPH0440284Y2 (enrdf_load_stackoverflow) | ||
| JPH10242332A (ja) | 半導体装置 | |
| JPH09298252A (ja) | 半導体パッケージ及びこれを用いた半導体装置 | |
| JPS5835935A (ja) | 半導体装置及びその製造方法 | |
| JP3563637B2 (ja) | 半導体装置とその製造方法 | |
| JP2000022070A (ja) | バンプを有する電子部品及びその製造方法 | |
| JP3362007B2 (ja) | 半導体装置、その製造方法及びテープキャリア | |
| JPH065769A (ja) | 積層構造のフィルム基材およびこれを用いた電子回路素子搭載用リードフレーム | |
| JPH02275655A (ja) | 混成集積回路 | |
| JP2572092Y2 (ja) | 半導体素子パッケージ | |
| JP2779843B2 (ja) | 電子部品搭載用基板及び電子部品パッケージ | |
| JPH07169871A (ja) | 半導体装置 | |
| JPS6334281Y2 (enrdf_load_stackoverflow) | ||
| JPH0241863Y2 (enrdf_load_stackoverflow) | ||
| JP2868779B2 (ja) | Ｔａｂ用テープ | |
| JPH01207938A (ja) | 半導体装置 | |
| JPH03241844A (ja) | 半導体装置 | |
| JPH03241843A (ja) | 半導体装置 | |
| JPH0362537A (ja) | 電子部品塔載用基板 | |
| JPH04199663A (ja) | パッドグリッドアレイパッケージ | |
| JP2001177251A (ja) | 多層配線基板 |