JPH0191320U - - Google Patents
Info
- Publication number
- JPH0191320U JPH0191320U JP18739587U JP18739587U JPH0191320U JP H0191320 U JPH0191320 U JP H0191320U JP 18739587 U JP18739587 U JP 18739587U JP 18739587 U JP18739587 U JP 18739587U JP H0191320 U JPH0191320 U JP H0191320U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- stabilizing
- lead
- installation
- electrode structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000009434 installation Methods 0.000 claims description 4
- 230000000087 stabilizing effect Effects 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims 1
- 239000012212 insulator Substances 0.000 claims 1
- 239000013078 crystal Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987187395U JPH0619211Y2 (ja) | 1987-12-09 | 1987-12-09 | 表面実装用電子部品の電極構造 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987187395U JPH0619211Y2 (ja) | 1987-12-09 | 1987-12-09 | 表面実装用電子部品の電極構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0191320U true JPH0191320U (US06168776-20010102-C00028.png) | 1989-06-15 |
JPH0619211Y2 JPH0619211Y2 (ja) | 1994-05-18 |
Family
ID=31478552
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987187395U Expired - Lifetime JPH0619211Y2 (ja) | 1987-12-09 | 1987-12-09 | 表面実装用電子部品の電極構造 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0619211Y2 (US06168776-20010102-C00028.png) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02228110A (ja) * | 1989-03-01 | 1990-09-11 | Hirai Seimitsu:Kk | 水晶振動子のパッケージ構造 |
JP2010187091A (ja) * | 2009-02-10 | 2010-08-26 | Seiko Instruments Inc | パッケージの製造方法、圧電振動子の製造方法、発振器、電子機器および電波時計。 |
JP5258957B2 (ja) * | 2009-02-25 | 2013-08-07 | セイコーインスツル株式会社 | 圧電振動子の製造方法及び基板の製造方法 |
JP2015153806A (ja) * | 2014-02-12 | 2015-08-24 | セイコーエプソン株式会社 | 配線基板の製造方法、配線基板、電子デバイス、電子機器および移動体 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55105981A (en) * | 1979-01-24 | 1980-08-14 | Sumitomo Electric Industries | Terminal for aluminum wire |
JPS58120662U (ja) * | 1982-02-12 | 1983-08-17 | 株式会社日立製作所 | チツプキヤリヤ− |
JPS58202540A (ja) * | 1982-05-21 | 1983-11-25 | Nippon Telegr & Teleph Corp <Ntt> | スタンド・オフによるボンデイング微細位置合せ方法 |
JPS5985123A (ja) * | 1982-11-05 | 1984-05-17 | Kinseki Kk | 圧電振動子用気密ベ−ス |
JPS6249226U (US06168776-20010102-C00028.png) * | 1985-09-12 | 1987-03-26 |
-
1987
- 1987-12-09 JP JP1987187395U patent/JPH0619211Y2/ja not_active Expired - Lifetime
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55105981A (en) * | 1979-01-24 | 1980-08-14 | Sumitomo Electric Industries | Terminal for aluminum wire |
JPS58120662U (ja) * | 1982-02-12 | 1983-08-17 | 株式会社日立製作所 | チツプキヤリヤ− |
JPS58202540A (ja) * | 1982-05-21 | 1983-11-25 | Nippon Telegr & Teleph Corp <Ntt> | スタンド・オフによるボンデイング微細位置合せ方法 |
JPS5985123A (ja) * | 1982-11-05 | 1984-05-17 | Kinseki Kk | 圧電振動子用気密ベ−ス |
JPS6249226U (US06168776-20010102-C00028.png) * | 1985-09-12 | 1987-03-26 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02228110A (ja) * | 1989-03-01 | 1990-09-11 | Hirai Seimitsu:Kk | 水晶振動子のパッケージ構造 |
JP2010187091A (ja) * | 2009-02-10 | 2010-08-26 | Seiko Instruments Inc | パッケージの製造方法、圧電振動子の製造方法、発振器、電子機器および電波時計。 |
JP5258957B2 (ja) * | 2009-02-25 | 2013-08-07 | セイコーインスツル株式会社 | 圧電振動子の製造方法及び基板の製造方法 |
JP2015153806A (ja) * | 2014-02-12 | 2015-08-24 | セイコーエプソン株式会社 | 配線基板の製造方法、配線基板、電子デバイス、電子機器および移動体 |
Also Published As
Publication number | Publication date |
---|---|
JPH0619211Y2 (ja) | 1994-05-18 |