JPH0187552U - - Google Patents

Info

Publication number
JPH0187552U
JPH0187552U JP1987183042U JP18304287U JPH0187552U JP H0187552 U JPH0187552 U JP H0187552U JP 1987183042 U JP1987183042 U JP 1987183042U JP 18304287 U JP18304287 U JP 18304287U JP H0187552 U JPH0187552 U JP H0187552U
Authority
JP
Japan
Prior art keywords
semiconductor element
fin
fins
cooling structure
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987183042U
Other languages
Japanese (ja)
Other versions
JPH0525244Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987183042U priority Critical patent/JPH0525244Y2/ja
Publication of JPH0187552U publication Critical patent/JPH0187552U/ja
Application granted granted Critical
Publication of JPH0525244Y2 publication Critical patent/JPH0525244Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の原理説明図、第２図は本考案
による一実施例の説明図で、ａは正面図、ｂは側
面図、第３図は従来の説明図で、ａは正面図、ｂ
は側面図を示す。 図において、１は半導体素子、２はプリント基
板、３はリード端子、４は放熱片、５は絶縁部材
、６はフインを示す。 Fig. 1 is an explanatory diagram of the principle of the present invention, Fig. 2 is an explanatory diagram of an embodiment of the invention, where a is a front view, b is a side view, and Fig. 3 is a conventional explanatory diagram, and a is a front view. ,b
shows a side view. In the figure, 1 is a semiconductor element, 2 is a printed circuit board, 3 is a lead terminal, 4 is a heat sink, 5 is an insulating member, and 6 is a fin.

Claims (1)

【実用新案登録請求の範囲】 リード端子３がプリント基板２に固着される半
導体素子１と、該半導体素子１に係止されるフイ
ン６とを備え、該半導体素子１の発熱が該フイン
６によつて放熱されるように形成される冷却構造
において、 前記リード端子３に所定箇所が当接さる複数の
放熱片４と、該放熱片４のそれぞれを櫛状に連結
する絶縁部材５とによつて前記フイン６を構成す
ることを特徴とする冷却構造。[Claims for Utility Model Registration] A lead terminal 3 includes a semiconductor element 1 fixed to a printed circuit board 2 and a fin 6 locked to the semiconductor element 1, and the heat generated by the semiconductor element 1 is transmitted to the fin 6. In the cooling structure formed to radiate heat, a plurality of heat radiating pieces 4 are brought into contact with the lead terminals 3 at predetermined locations, and an insulating member 5 connects each of the heat radiating pieces 4 in a comb shape. A cooling structure characterized in that the fins 6 are made up of fins 6.
JP1987183042U 1987-12-01 1987-12-01 Expired - Lifetime JPH0525244Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987183042U JPH0525244Y2 (en) 1987-12-01 1987-12-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987183042U JPH0525244Y2 (en) 1987-12-01 1987-12-01

Publications (2)

Publication Number Publication Date
JPH0187552U true JPH0187552U (en) 1989-06-09
JPH0525244Y2 JPH0525244Y2 (en) 1993-06-25

Family

ID=31474475

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987183042U Expired - Lifetime JPH0525244Y2 (en) 1987-12-01 1987-12-01

Country Status (1)

Country Link
JP (1) JPH0525244Y2 (en)

Also Published As

Publication number Publication date
JPH0525244Y2 (en) 1993-06-25

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