JPH0235535U - - Google Patents
Info
- Publication number
- JPH0235535U JPH0235535U JP11270788U JP11270788U JPH0235535U JP H0235535 U JPH0235535 U JP H0235535U JP 11270788 U JP11270788 U JP 11270788U JP 11270788 U JP11270788 U JP 11270788U JP H0235535 U JPH0235535 U JP H0235535U
- Authority
- JP
- Japan
- Prior art keywords
- output
- printed board
- electronic components
- input
- switching element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Electronic Switches (AREA)
- Multi-Conductor Connections (AREA)
Description
第１図ａ，ｂ，ｃ及び第２図はそれぞれ本考案
の一実施例を示すものであり、それぞれ第１図ａ
は斜視図、同図ｂはケースなしの斜視図、同図ｃ
は実装説明図、第２図は回路図である。第３図ａ
，ｂ，ｃはそれぞれ本考案の他の実施例を示すも
のであり、それぞれ同図ａは斜視図、同図ｂは要
部側面図、同図ｃはケースなしの斜視図である。
１…フオトカプラ、３…出力半導体スイツチン
グ素子、３ａ…放熱フイン部、４…プリント基板
、６，６…出力リード端子、５ａ，６ａ…出力端
子、７，７…入力リード端子、８…ケース。
Figures 1a, b, c and 2 each show an embodiment of the present invention;
is a perspective view, figure b is a perspective view without a case, figure c is a perspective view.
is an explanatory diagram of implementation, and FIG. 2 is a circuit diagram. Figure 3a
, b, and c show other embodiments of the present invention, respectively, in which figure a is a perspective view, figure b is a side view of the main part, and figure c is a perspective view without a case. DESCRIPTION OF SYMBOLS 1... Photocoupler, 3... Output semiconductor switching element, 3a... Heat radiation fin part, 4... Printed circuit board, 6, 6... Output lead terminal, 5a, 6a... Output terminal, 7, 7... Input lead terminal, 8... Case.
Claims (1)
イン付出力半導体スイツチング素子等の出力回路
用電子部品をそれぞれ表面に実装したプリント板
と、一端がそのプリント板の入出力回路配線パタ
ーンに電気的に接続され前記プリント板の裏面よ
り延出される複数の入出力リード端子と、前記各
電子部品を収納しプリント板を被嵌するケースと
よりなり、前記出力リード端子の他端に先端がケ
ース表面から突出した巾広の出力端子を一体に設
けると共にいずれか一つの出力端子の中間を前記
出力半導体スイツチング素子の放熱フイン部に取
着させてなることを特徴とするソリツドステート
リレー。 A printed board has electronic components for input circuits such as a photocoupler and electronic components for output circuits such as an output semiconductor switching element with heat dissipation fins mounted on its surface, and one end is electrically connected to the input/output circuit wiring pattern of the printed board. It consists of a plurality of input/output lead terminals extending from the back surface of the printed board, and a case that houses each of the electronic components and fits the printed board, and the other end of the output lead terminal has a tip protruding from the case surface. What is claimed is: 1. A solid-state relay, characterized in that wide output terminals are integrally provided, and the middle of any one of the output terminals is attached to a heat dissipation fin portion of the output semiconductor switching element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11270788U JPH0235535U (en) | 1988-08-26 | 1988-08-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11270788U JPH0235535U (en) | 1988-08-26 | 1988-08-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0235535U true JPH0235535U (en) | 1990-03-07 |
Family
ID=31351890
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11270788U Pending JPH0235535U (en) | 1988-08-26 | 1988-08-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0235535U (en) |
-
1988
- 1988-08-26 JP JP11270788U patent/JPH0235535U/ja active Pending
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