JPS63145338U - - Google Patents
Info
- Publication number
- JPS63145338U JPS63145338U JP1987038063U JP3806387U JPS63145338U JP S63145338 U JPS63145338 U JP S63145338U JP 1987038063 U JP1987038063 U JP 1987038063U JP 3806387 U JP3806387 U JP 3806387U JP S63145338 U JPS63145338 U JP S63145338U
- Authority
- JP
- Japan
- Prior art keywords
- electronic components
- solid
- input
- circuit board
- fins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007787 solid Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Description
第１図ないし第４図はそれぞれ本考案の一実施
例を示し、第１図はソリツドステートリレーの一
部切欠き正面図、第２図は側面断面図、第３図お
よび第４図はそれぞれ放熱板の斜視図および側面
図であり、第５図および第６図はそれぞれ従来装
置を示す一部切欠き正面図および側面断面図であ
る。
１……プリント基板、２……電子部品、４……
主回路素子、５……入出力端子、６……樹脂、７
……放熱板。
1 to 4 each show an embodiment of the present invention, in which FIG. 1 is a partially cutaway front view of a solid state relay, FIG. 2 is a side sectional view, and FIGS. 3 and 4 are FIGS. 5 and 6 are respectively a perspective view and a side view of a heat sink, and FIGS. 5 and 6 are a partially cutaway front view and a side sectional view, respectively, showing a conventional device. 1...Printed circuit board, 2...Electronic components, 4...
Main circuit element, 5... Input/output terminal, 6... Resin, 7
...heat sink.
Claims (1)
素子を実装するとともにこれらの表面を絶縁性樹
脂でコーテイングし、入出力用端子を引き出した
ソリツドリレーにおいて、前記主回路素子は高熱
伝導性金属板をコ字状に折り曲げた放熱板により
挾み込まれていることを特徴とするソリツドステ
ートリレー。 In solid relays, electronic components and main circuit elements with fins are mounted on a printed circuit board, their surfaces are coated with insulating resin, and input/output terminals are drawn out. A solid state relay characterized by being sandwiched between heat sinks bent into a shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987038063U JPS63145338U (en) | 1987-03-16 | 1987-03-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987038063U JPS63145338U (en) | 1987-03-16 | 1987-03-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63145338U true JPS63145338U (en) | 1988-09-26 |
Family
ID=30849957
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987038063U Pending JPS63145338U (en) | 1987-03-16 | 1987-03-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63145338U (en) |
-
1987
- 1987-03-16 JP JP1987038063U patent/JPS63145338U/ja active Pending
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