JPS6413147U - - Google Patents
Info
- Publication number
- JPS6413147U JPS6413147U JP10607987U JP10607987U JPS6413147U JP S6413147 U JPS6413147 U JP S6413147U JP 10607987 U JP10607987 U JP 10607987U JP 10607987 U JP10607987 U JP 10607987U JP S6413147 U JPS6413147 U JP S6413147U
- Authority
- JP
- Japan
- Prior art keywords
- transistor
- mounting structure
- fins
- package
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の原理側面断面図、第２図のａ
，ｂは本考案による一実施例の斜視図、第３図は
従来の斜視図を示す。
図において、１はトランジスタ、２はパツケー
ジ、３はリード端子、４はプリント基板、５はス
ルホール、６はフインを示す。
Figure 1 is a side sectional view of the principle of the present invention, and Figure 2 is a.
, b are perspective views of an embodiment of the present invention, and FIG. 3 is a conventional perspective view. In the figure, 1 is a transistor, 2 is a package, 3 is a lead terminal, 4 is a printed circuit board, 5 is a through hole, and 6 is a fin.
Claims (1)
ール５に半田付けされることで保持されたトラン
ジスタ１と、該トランジスタ１のパツケージ２に
固着される良熱伝導材の金属部材によつて形成さ
れたフイン６とを備え、該フイン６を介して該ト
ランジスタ１の放熱が行われるように形成された
トランジスタの取付構造において、 前記パツケージ２を挟持するが如く、該パツケ
ージ２の両面に前記フイン６を固着させる共に、
該フイン６の外形が該パツケージ２の外周とほぼ
同等に形成されて成ることを特徴とするトランジ
スタの取付構造。[Claims for Utility Model Registration] A transistor 1 held by having a lead terminal 3 soldered to a through hole 5 of a predetermined printed circuit board 4, and a metal made of a good heat conductive material fixed to a package 2 of the transistor 1. In the transistor mounting structure, the transistor mounting structure includes fins 6 formed of a member, and is formed so that heat is dissipated from the transistor 1 through the fins 6. The fins 6 are fixed to both sides of the
A transistor mounting structure characterized in that the outer shape of the fin 6 is formed to be approximately the same as the outer periphery of the package 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10607987U JPS6413147U (en) | 1987-07-10 | 1987-07-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10607987U JPS6413147U (en) | 1987-07-10 | 1987-07-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6413147U true JPS6413147U (en) | 1989-01-24 |
Family
ID=31339267
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10607987U Pending JPS6413147U (en) | 1987-07-10 | 1987-07-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6413147U (en) |
-
1987
- 1987-07-10 JP JP10607987U patent/JPS6413147U/ja active Pending
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