JPH0420203U - - Google Patents
Info
- Publication number
- JPH0420203U JPH0420203U JP6247390U JP6247390U JPH0420203U JP H0420203 U JPH0420203 U JP H0420203U JP 6247390 U JP6247390 U JP 6247390U JP 6247390 U JP6247390 U JP 6247390U JP H0420203 U JPH0420203 U JP H0420203U
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- insulating substrate
- base
- soldered
- foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
Description
第１図は本考案のパワーモジユールの一実施例
の外観図、第２図および第３図は本考案のパワー
モジユールの実施例の断面図である。
図中、１はパワーモジユール、２は上蓋、３は
アルミベース絶縁基板、４は絶縁材、５は回路パ
ターン、６は半田、７は半田レジスト、８はシヤ
ント抵抗器、９は放熱材である。
FIG. 1 is an external view of an embodiment of the power module of the present invention, and FIGS. 2 and 3 are sectional views of the embodiments of the power module of the present invention. In the figure, 1 is the power module, 2 is the top cover, 3 is the aluminum base insulating substrate, 4 is the insulating material, 5 is the circuit pattern, 6 is the solder, 7 is the solder resist, 8 is the shunt resistor, and 9 is the heat dissipation material. be.
Claims (1)
て抵抗器としその両端をアルミ・ベース絶縁基板
上に形成した回路パターンに半田付けし、該アル
ミ・ベース絶縁基板を基部として上部より金属ケ
ースを被せ、内部を放熱材にて充填してなるシヤ
ント抵抗器。 (2) 帯状でかつ箔状の抵抗体の略中央部を折り
返し、渦巻き状に形成して抵抗器としその両端を
アルミ・ベース絶縁基板上に形成した回路パター
ンに半田付けし、該アルミ・ベース絶縁基板を基
部として上部より金属ケースを被せ、内部を放熱
材にて充填してなるシヤント抵抗器。[Scope of Claim for Utility Model Registration] (1) A resistor is formed by forming a strip-like and foil-like resistor into a substantially waveform, and its both ends are soldered to a circuit pattern formed on an aluminum-based insulating substrate. - A shunt resistor consisting of an insulating substrate as the base, a metal case covering the top, and the inside filled with heat dissipation material. (2) Fold back the approximate center of the strip-like foil-like resistor and form it into a spiral shape to form a resistor.Both ends of the resistor are soldered to a circuit pattern formed on an aluminum base insulating substrate. A shunt resistor that consists of an insulating substrate as a base, a metal case covering the top, and the inside filled with heat dissipating material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6247390U JPH0420203U (en) | 1990-06-13 | 1990-06-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6247390U JPH0420203U (en) | 1990-06-13 | 1990-06-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0420203U true JPH0420203U (en) | 1992-02-20 |
Family
ID=31591654
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6247390U Pending JPH0420203U (en) | 1990-06-13 | 1990-06-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0420203U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014146799A (en) * | 2013-01-25 | 2014-08-14 | Tektronix Inc | Low inductance electric shunt |
-
1990
- 1990-06-13 JP JP6247390U patent/JPH0420203U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014146799A (en) * | 2013-01-25 | 2014-08-14 | Tektronix Inc | Low inductance electric shunt |
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