JPS63106192U - - Google Patents
Info
- Publication number
- JPS63106192U JPS63106192U JP20157486U JP20157486U JPS63106192U JP S63106192 U JPS63106192 U JP S63106192U JP 20157486 U JP20157486 U JP 20157486U JP 20157486 U JP20157486 U JP 20157486U JP S63106192 U JPS63106192 U JP S63106192U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- dissipation fin
- temperature
- shape memory
- memory alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 7
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims 1
- 230000006903 response to temperature Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 6
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図イ，ロは本考案の原理を説明する図、第
２図は本考案の１実施例を説明する斜視図、第３
図イ，ロは本考案の別の実施例を説明する図、第
４図は従来の放熱フイン構造を説明する図、第５
図は電子装置内部を説明する図である。
図において、１は発熱部品、２はベース、７は
形状記憶合金部材、９は突起部、１１はスリ割り
、１２はネジを示す。
Figure 1 A and B are diagrams explaining the principle of the present invention, Figure 2 is a perspective view explaining one embodiment of the present invention, and Figure 3 is a diagram explaining the principle of the present invention.
Figures A and B are diagrams explaining another embodiment of the present invention, Figure 4 is a diagram explaining a conventional heat dissipation fin structure, and Figure 5 is a diagram explaining another embodiment of the present invention.
The figure is a diagram illustrating the inside of the electronic device. In the figure, 1 is a heat generating component, 2 is a base, 7 is a shape memory alloy member, 9 is a projection, 11 is a slot, and 12 is a screw.
Claims (1)
ための放熱フインＡの構造であつて、 前記放熱フインＡを形状記憶合金部材７で構成
し、或る温度以上になつた時に放熱面積が増える
構造とし、温度変化に対する放熱面積を自動的に
変化させることを特徴とする放熱フインの構造。[Claims for Utility Model Registration] A structure of a heat dissipation fin A for cooling heat-generating components mounted on a base 2, wherein the heat dissipation fin A is made of a shape memory alloy member 7, and the heat dissipation fin A is made of a shape memory alloy member 7, and the temperature exceeds a certain temperature. The structure of the heat dissipation fin is such that the heat dissipation area increases as the temperature increases, and the heat dissipation area automatically changes in response to temperature changes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20157486U JPS63106192U (en) | 1986-12-26 | 1986-12-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20157486U JPS63106192U (en) | 1986-12-26 | 1986-12-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63106192U true JPS63106192U (en) | 1988-07-08 |
Family
ID=31165157
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20157486U Pending JPS63106192U (en) | 1986-12-26 | 1986-12-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63106192U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007077620A1 (en) * | 2005-12-28 | 2007-07-12 | National University Corporation Nagoya University | Smart vortex generator, and airplane, ships, and rotating machines comprising the same |
-
1986
- 1986-12-26 JP JP20157486U patent/JPS63106192U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007077620A1 (en) * | 2005-12-28 | 2007-07-12 | National University Corporation Nagoya University | Smart vortex generator, and airplane, ships, and rotating machines comprising the same |
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