JPS61196539U - - Google Patents
Info
- Publication number
- JPS61196539U JPS61196539U JP1985070728U JP7072885U JPS61196539U JP S61196539 U JPS61196539 U JP S61196539U JP 1985070728 U JP1985070728 U JP 1985070728U JP 7072885 U JP7072885 U JP 7072885U JP S61196539 U JPS61196539 U JP S61196539U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- heating element
- element body
- fins
- terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- 230000037431 insertion Effects 0.000 claims description 2
- 238000003780 insertion Methods 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図乃至第３図は本考案に係る発熱素子の放
熱構造の実施例を示し、第１図及び第２図は斜視
図、第３図は他の構成例を示す斜視図である。第
４図Ａ乃至Ｃは従来の素子の放熱手段を示す斜視
図である。
１：多足発熱素子本体、２：配線端子、３：放
熱フイン、４：切欠部、５：挿入用端子部。
1 to 3 show an embodiment of a heat dissipation structure for a heating element according to the present invention, FIGS. 1 and 2 are perspective views, and FIG. 3 is a perspective view showing another example of the structure. FIGS. 4A to 4C are perspective views showing heat dissipation means of a conventional device. 1: Multi-legged heating element body, 2: Wiring terminal, 3: Heat dissipation fin, 4: Notch, 5: Insertion terminal part.
Claims (1)
体の配線端子と同一方向に放熱フインを延設する
と共に該フインの先端側には複数の挿入用端子部
を形成したことを特徴とする発熱素子の放熱構造
。 A heating element characterized in that heat dissipation fins extend from a molded multi-legged heating element body in the same direction as the wiring terminals of the element body, and a plurality of insertion terminals are formed on the tip side of the fins. Heat dissipation structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985070728U JPS61196539U (en) | 1985-05-15 | 1985-05-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985070728U JPS61196539U (en) | 1985-05-15 | 1985-05-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61196539U true JPS61196539U (en) | 1986-12-08 |
Family
ID=30607573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985070728U Pending JPS61196539U (en) | 1985-05-15 | 1985-05-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61196539U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4824522U (en) * | 1971-07-26 | 1973-03-22 | ||
| JPS5141469A (en) * | 1974-10-01 | 1976-04-07 | Yoshimitsu Shirotani | Jugyokainikuno nerikakoshokuhinno hozonhoho |
-
1985
- 1985-05-15 JP JP1985070728U patent/JPS61196539U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4824522U (en) * | 1971-07-26 | 1973-03-22 | ||
| JPS5141469A (en) * | 1974-10-01 | 1976-04-07 | Yoshimitsu Shirotani | Jugyokainikuno nerikakoshokuhinno hozonhoho |