JPH0160169B2 - - Google Patents

Info

Publication number
JPH0160169B2
JPH0160169B2 JP1857982A JP1857982A JPH0160169B2 JP H0160169 B2 JPH0160169 B2 JP H0160169B2 JP 1857982 A JP1857982 A JP 1857982A JP 1857982 A JP1857982 A JP 1857982A JP H0160169 B2 JPH0160169 B2 JP H0160169B2
Authority
JP
Japan
Prior art keywords
parts
weight
acid
epoxy resin
curing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1857982A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58136620A (ja
Inventor
Kaoru Tominaga
Tsukasa Sakuraba
Tadao Iwata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Petrochemical Industries Ltd
Original Assignee
Mitsui Petrochemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Petrochemical Industries Ltd filed Critical Mitsui Petrochemical Industries Ltd
Priority to JP1857982A priority Critical patent/JPS58136620A/ja
Publication of JPS58136620A publication Critical patent/JPS58136620A/ja
Publication of JPH0160169B2 publication Critical patent/JPH0160169B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1857982A 1982-02-08 1982-02-08 エポキシ樹脂組成物 Granted JPS58136620A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1857982A JPS58136620A (ja) 1982-02-08 1982-02-08 エポキシ樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1857982A JPS58136620A (ja) 1982-02-08 1982-02-08 エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPS58136620A JPS58136620A (ja) 1983-08-13
JPH0160169B2 true JPH0160169B2 (enrdf_load_stackoverflow) 1989-12-21

Family

ID=11975533

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1857982A Granted JPS58136620A (ja) 1982-02-08 1982-02-08 エポキシ樹脂組成物

Country Status (1)

Country Link
JP (1) JPS58136620A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0819214B2 (ja) * 1987-05-13 1996-02-28 東芝ケミカル株式会社 封止用樹脂組成物
JP2014035322A (ja) * 2012-08-10 2014-02-24 Tokai Rika Co Ltd コアホルダ及び電流センサ

Also Published As

Publication number Publication date
JPS58136620A (ja) 1983-08-13

Similar Documents

Publication Publication Date Title
JPH0160169B2 (enrdf_load_stackoverflow)
JPS635249B2 (enrdf_load_stackoverflow)
KR100462143B1 (ko) 반도체소자 봉지용 저응력화 변성 실리콘 에폭시 수지의 제조방 법 및 이를 함유하는 반도체소자 봉지용 수지 조성물
JPH1160898A (ja) 半導体封止用樹脂組成物及び樹脂封止型半導体装置
JP3819220B2 (ja) 封止用樹脂組成物および半導体封止装置
JP2000136290A (ja) 封止用樹脂組成物及び半導体封止装置
JPH10231353A (ja) エポキシ樹脂用硬化剤
JPH10251380A (ja) 熱硬化性樹脂組成物
JPS6181427A (ja) エポキシ樹脂組成物
JP3247368B2 (ja) 電子部品封止用エポキシ樹脂成形材料
JPH11286594A (ja) 封止用樹脂組成物および半導体封止装置
JPH04173828A (ja) 電子部品封止用エポキシ樹脂成形材料
JPH11292956A (ja) エポキシ樹脂組成物
JP2009242472A (ja) 熱硬化性樹脂組成物および熱硬化性樹脂成形材料
JPH1112442A (ja) 封止用樹脂組成物および半導体封止装置
JPH11130943A (ja) 封止用樹脂組成物および半導体封止装置
JP4200896B2 (ja) 耐熱性液状フェノールノボラック樹脂
JP2000136291A (ja) 封止用樹脂組成物及び半導体封止装置
JP2003252943A (ja) 熱硬化性樹脂組成物及びその硬化物
JP2000017146A (ja) 熱硬化性樹脂組成物及びその硬化物
JPH1112446A (ja) 封止用樹脂組成物および半導体封止装置
JPH10204255A (ja) 熱硬化性樹脂組成物
JP3298084B2 (ja) 封止用樹脂組成物および半導体封止装置
JP3751171B2 (ja) 封止用樹脂組成物および半導体封止装置
JPH0234626A (ja) 射出成形材料