JPS635249B2 - - Google Patents

Info

Publication number
JPS635249B2
JPS635249B2 JP19213481A JP19213481A JPS635249B2 JP S635249 B2 JPS635249 B2 JP S635249B2 JP 19213481 A JP19213481 A JP 19213481A JP 19213481 A JP19213481 A JP 19213481A JP S635249 B2 JPS635249 B2 JP S635249B2
Authority
JP
Japan
Prior art keywords
parts
acid
weight
mold
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP19213481A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5892547A (ja
Inventor
Kaoru Tominaga
Tsukasa Sakuraba
Tadao Iwata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Petrochemical Industries Ltd
Original Assignee
Mitsui Petrochemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Petrochemical Industries Ltd filed Critical Mitsui Petrochemical Industries Ltd
Priority to JP19213481A priority Critical patent/JPS5892547A/ja
Publication of JPS5892547A publication Critical patent/JPS5892547A/ja
Publication of JPS635249B2 publication Critical patent/JPS635249B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0001—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor characterised by the choice of material

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP19213481A 1981-11-30 1981-11-30 電気・電子部品の製造方法 Granted JPS5892547A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19213481A JPS5892547A (ja) 1981-11-30 1981-11-30 電気・電子部品の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19213481A JPS5892547A (ja) 1981-11-30 1981-11-30 電気・電子部品の製造方法

Publications (2)

Publication Number Publication Date
JPS5892547A JPS5892547A (ja) 1983-06-01
JPS635249B2 true JPS635249B2 (enrdf_load_stackoverflow) 1988-02-02

Family

ID=16286241

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19213481A Granted JPS5892547A (ja) 1981-11-30 1981-11-30 電気・電子部品の製造方法

Country Status (1)

Country Link
JP (1) JPS5892547A (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60119734A (ja) * 1983-12-01 1985-06-27 Japan Steel Works Ltd:The 電子部品の樹脂封止方法
JPH0819214B2 (ja) * 1987-05-13 1996-02-28 東芝ケミカル株式会社 封止用樹脂組成物
JPH0289613A (ja) * 1988-09-27 1990-03-29 Somar Corp エポキシ樹脂組成物の射出成形方法及びそれに用いる組成物
US5064881A (en) * 1989-01-18 1991-11-12 Mitsui Petrochemical Industries, Ltd. Epoxy resin composition and semiconductor sealing material comprising same based on spherical silica

Also Published As

Publication number Publication date
JPS5892547A (ja) 1983-06-01

Similar Documents

Publication Publication Date Title
JPH09272786A (ja) 熱硬化性樹脂組成物及びその硬化物
JP2002145993A (ja) 封止用樹脂組成物および電子部品封止装置
JPS635249B2 (enrdf_load_stackoverflow)
KR100881311B1 (ko) 쌍극성 플레이트를 제조하기 위한 성형조성물
JPH0160169B2 (enrdf_load_stackoverflow)
JP3900317B2 (ja) 半導体封止用樹脂組成物及び樹脂封止型半導体装置
JP2000136290A (ja) 封止用樹脂組成物及び半導体封止装置
JP3819220B2 (ja) 封止用樹脂組成物および半導体封止装置
JPH10231353A (ja) エポキシ樹脂用硬化剤
JPH11286594A (ja) 封止用樹脂組成物および半導体封止装置
JPS6181427A (ja) エポキシ樹脂組成物
JPH0234626A (ja) 射出成形材料
JP3244195B2 (ja) メラミン・フェノール樹脂組成物
US20240384025A1 (en) A thermally curable epoxy system
JPH11130943A (ja) 封止用樹脂組成物および半導体封止装置
JP2009242472A (ja) 熱硬化性樹脂組成物および熱硬化性樹脂成形材料
JP2000136291A (ja) 封止用樹脂組成物及び半導体封止装置
JPH1112442A (ja) 封止用樹脂組成物および半導体封止装置
JPH0689119B2 (ja) 貯蔵安定で熱硬化性のエポキシ樹脂混合物およびその製法
JP3298084B2 (ja) 封止用樹脂組成物および半導体封止装置
JPH1112446A (ja) 封止用樹脂組成物および半導体封止装置
JP3751171B2 (ja) 封止用樹脂組成物および半導体封止装置
JP4525131B2 (ja) エポキシ樹脂組成物およびそれを用いた半導体装置
KR101243755B1 (ko) 암모니아 휘발이 작은 압출 또는 사출 성형용 속경화 페놀수지 성형재료 및 그의 제조방법
JP3649893B2 (ja) 封止用樹脂組成物および半導体封止装置