JPS58136620A - エポキシ樹脂組成物 - Google Patents

エポキシ樹脂組成物

Info

Publication number
JPS58136620A
JPS58136620A JP1857982A JP1857982A JPS58136620A JP S58136620 A JPS58136620 A JP S58136620A JP 1857982 A JP1857982 A JP 1857982A JP 1857982 A JP1857982 A JP 1857982A JP S58136620 A JPS58136620 A JP S58136620A
Authority
JP
Japan
Prior art keywords
parts
weight
epoxy resin
acid
curing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1857982A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0160169B2 (enrdf_load_stackoverflow
Inventor
Kaoru Tominaga
薫 冨永
Tsukasa Sakuraba
司 桜庭
Tadao Iwata
岩田　忠雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Petrochemical Industries Ltd
Original Assignee
Mitsui Petrochemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Petrochemical Industries Ltd filed Critical Mitsui Petrochemical Industries Ltd
Priority to JP1857982A priority Critical patent/JPS58136620A/ja
Publication of JPS58136620A publication Critical patent/JPS58136620A/ja
Publication of JPH0160169B2 publication Critical patent/JPH0160169B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1857982A 1982-02-08 1982-02-08 エポキシ樹脂組成物 Granted JPS58136620A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1857982A JPS58136620A (ja) 1982-02-08 1982-02-08 エポキシ樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1857982A JPS58136620A (ja) 1982-02-08 1982-02-08 エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPS58136620A true JPS58136620A (ja) 1983-08-13
JPH0160169B2 JPH0160169B2 (enrdf_load_stackoverflow) 1989-12-21

Family

ID=11975533

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1857982A Granted JPS58136620A (ja) 1982-02-08 1982-02-08 エポキシ樹脂組成物

Country Status (1)

Country Link
JP (1) JPS58136620A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63280725A (ja) * 1987-05-13 1988-11-17 Toshiba Chem Corp 封止用樹脂組成物
JP2014035322A (ja) * 2012-08-10 2014-02-24 Tokai Rika Co Ltd コアホルダ及び電流センサ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63280725A (ja) * 1987-05-13 1988-11-17 Toshiba Chem Corp 封止用樹脂組成物
JP2014035322A (ja) * 2012-08-10 2014-02-24 Tokai Rika Co Ltd コアホルダ及び電流センサ

Also Published As

Publication number Publication date
JPH0160169B2 (enrdf_load_stackoverflow) 1989-12-21

Similar Documents

Publication Publication Date Title
CN101225156A (zh) 环氧树脂固化剂、环氧树脂灌封胶及其配制方法
JP5026244B2 (ja) バイポーラプレート製造用成形組成物
JPH05230337A (ja) 安定化されたエポキシ樹脂組成物
JP2002145993A (ja) 封止用樹脂組成物および電子部品封止装置
JPS58136620A (ja) エポキシ樹脂組成物
JPS635249B2 (enrdf_load_stackoverflow)
JP2000136290A (ja) 封止用樹脂組成物及び半導体封止装置
JPH1160898A (ja) 半導体封止用樹脂組成物及び樹脂封止型半導体装置
JP3819220B2 (ja) 封止用樹脂組成物および半導体封止装置
JPH10231353A (ja) エポキシ樹脂用硬化剤
JPS6181427A (ja) エポキシ樹脂組成物
JP2857444B2 (ja) 封止用樹脂組成物および半導体封止装置
JPH11286594A (ja) 封止用樹脂組成物および半導体封止装置
JP2000136291A (ja) 封止用樹脂組成物及び半導体封止装置
JPH0234626A (ja) 射出成形材料
JPH1112442A (ja) 封止用樹脂組成物および半導体封止装置
JPH11130943A (ja) 封止用樹脂組成物および半導体封止装置
JPS59164321A (ja) エポキシ樹脂組成物
JP2003252943A (ja) 熱硬化性樹脂組成物及びその硬化物
JP2001114984A (ja) 封止用樹脂組成物および半導体封止装置
JPH1112446A (ja) 封止用樹脂組成物および半導体封止装置
JPH0689119B2 (ja) 貯蔵安定で熱硬化性のエポキシ樹脂混合物およびその製法
JPH11166103A (ja) 封止用樹脂組成物および半導体封止装置
JPS61168620A (ja) 半導体封止用エポキシ樹脂組成物
JPH04248830A (ja) 封止用樹脂組成物および半導体封止装置