JPH0158863B2 - - Google Patents

Info

Publication number
JPH0158863B2
JPH0158863B2 JP58008365A JP836583A JPH0158863B2 JP H0158863 B2 JPH0158863 B2 JP H0158863B2 JP 58008365 A JP58008365 A JP 58008365A JP 836583 A JP836583 A JP 836583A JP H0158863 B2 JPH0158863 B2 JP H0158863B2
Authority
JP
Japan
Prior art keywords
metal
protrusion
lead
semiconductor element
metal lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58008365A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59139635A (ja
Inventor
Kenzo Hatada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP58008365A priority Critical patent/JPS59139635A/ja
Publication of JPS59139635A publication Critical patent/JPS59139635A/ja
Publication of JPH0158863B2 publication Critical patent/JPH0158863B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP58008365A 1983-01-20 1983-01-20 ボンデイング方法 Granted JPS59139635A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58008365A JPS59139635A (ja) 1983-01-20 1983-01-20 ボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58008365A JPS59139635A (ja) 1983-01-20 1983-01-20 ボンデイング方法

Publications (2)

Publication Number Publication Date
JPS59139635A JPS59139635A (ja) 1984-08-10
JPH0158863B2 true JPH0158863B2 (en:Method) 1989-12-13

Family

ID=11691205

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58008365A Granted JPS59139635A (ja) 1983-01-20 1983-01-20 ボンデイング方法

Country Status (1)

Country Link
JP (1) JPS59139635A (en:Method)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01214032A (ja) * 1988-02-22 1989-08-28 Canon Inc 電気回路装置
JP2556881B2 (ja) * 1988-05-31 1996-11-27 キヤノン株式会社 電気回路装置

Also Published As

Publication number Publication date
JPS59139635A (ja) 1984-08-10

Similar Documents

Publication Publication Date Title
KR100437436B1 (ko) 반도체패키지의제조법및반도체패키지
US20020033530A1 (en) Semiconductor device and semiconductor module
JPS6231819B2 (en:Method)
US20070267744A1 (en) Manufacturing a bump electrode with roughened face
TW200522231A (en) Method of manufacturing a semiconductor device
JPS59139636A (ja) ボンデイング方法
US6024274A (en) Method for tape automated bonding to composite bumps
JPH0214779B2 (en:Method)
JPH0158863B2 (en:Method)
JPH09232506A (ja) 半導体装置およびその製造方法
JP4012527B2 (ja) 電子部品の製造方法
JP2892455B2 (ja) Ｔａｂテープ
JP3267422B2 (ja) バンプ転写体および半導体集積回路装置の製造方法
JPH08316641A (ja) 一括接続法による多層配線基板
JPS5944834A (ja) 電子回路素子のダイボンデイング方法
JP3643760B2 (ja) 半導体装置の製造方法
JPS6234143B2 (en:Method)
JP2894172B2 (ja) 半導体装置
JPH0669620A (ja) 印刷配線板の接続構造
JPS5940539A (ja) 半導体装置およびその製造方法
JPH061789B2 (ja) 半導体装置用フイルムキヤリア
JPS6290939A (ja) 半導体装置
JPH11102939A (ja) 半導体素子搭載用テープキャリアおよびこれを用いた半導体装置
JPH10303254A (ja) 半導体素子搭載用テープキャリア、およびそのテープキャリアを使用した半導体装置
JPH07240420A (ja) バンプ電極付き半導体装置およびその形成方法