JPH0158047B2 - - Google Patents
Info
- Publication number
- JPH0158047B2 JPH0158047B2 JP26474185A JP26474185A JPH0158047B2 JP H0158047 B2 JPH0158047 B2 JP H0158047B2 JP 26474185 A JP26474185 A JP 26474185A JP 26474185 A JP26474185 A JP 26474185A JP H0158047 B2 JPH0158047 B2 JP H0158047B2
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- cleaning water
- plate
- wafer
- water supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004140 cleaning Methods 0.000 claims description 34
- 238000005520 cutting process Methods 0.000 claims description 34
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 32
- 239000000498 cooling water Substances 0.000 claims description 20
- 235000012431 wafers Nutrition 0.000 description 37
- 239000004065 semiconductor Substances 0.000 description 25
- 239000008188 pellet Substances 0.000 description 11
- 238000000034 method Methods 0.000 description 6
- 238000005336 cracking Methods 0.000 description 4
- 229910003460 diamond Inorganic materials 0.000 description 4
- 239000010432 diamond Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60264741A JPS61148004A (ja) | 1985-11-27 | 1985-11-27 | ダイシング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60264741A JPS61148004A (ja) | 1985-11-27 | 1985-11-27 | ダイシング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61148004A JPS61148004A (ja) | 1986-07-05 |
| JPH0158047B2 true JPH0158047B2 (xx) | 1989-12-08 |
Family
ID=17407530
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60264741A Granted JPS61148004A (ja) | 1985-11-27 | 1985-11-27 | ダイシング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61148004A (xx) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015208796A (ja) * | 2014-04-24 | 2015-11-24 | 株式会社ディスコ | バイト切削装置 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2526738Y2 (ja) * | 1990-06-26 | 1997-02-19 | 株式会社東京精密 | ダイシング機の洗浄装置 |
| JP4777072B2 (ja) * | 2006-01-11 | 2011-09-21 | 株式会社東京精密 | ダイシング装置 |
| WO2013051375A1 (ja) * | 2011-10-05 | 2013-04-11 | シャープ株式会社 | ダイシング装置及び半導体装置の製造方法 |
| JP6012239B2 (ja) * | 2012-04-23 | 2016-10-25 | 株式会社ディスコ | ウェーハの加工方法 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1063904A (en) * | 1963-07-13 | 1967-04-05 | Waldrich Werkzeugmasch | Method and apparatus for cooling machine tools |
| JPS4858771A (xx) * | 1971-11-22 | 1973-08-17 | ||
| JPS4894985A (xx) * | 1972-03-17 | 1973-12-06 | ||
| JPS493291A (xx) * | 1972-04-22 | 1974-01-12 | ||
| JPS4916072A (xx) * | 1972-04-10 | 1974-02-13 | ||
| JPS6112373A (ja) * | 1984-06-29 | 1986-01-20 | Tokyo Electric Co Ltd | 印字機 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS48104255U (xx) * | 1972-03-11 | 1973-12-05 |
-
1985
- 1985-11-27 JP JP60264741A patent/JPS61148004A/ja active Granted
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1063904A (en) * | 1963-07-13 | 1967-04-05 | Waldrich Werkzeugmasch | Method and apparatus for cooling machine tools |
| JPS4858771A (xx) * | 1971-11-22 | 1973-08-17 | ||
| JPS4894985A (xx) * | 1972-03-17 | 1973-12-06 | ||
| JPS4916072A (xx) * | 1972-04-10 | 1974-02-13 | ||
| JPS493291A (xx) * | 1972-04-22 | 1974-01-12 | ||
| JPS6112373A (ja) * | 1984-06-29 | 1986-01-20 | Tokyo Electric Co Ltd | 印字機 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015208796A (ja) * | 2014-04-24 | 2015-11-24 | 株式会社ディスコ | バイト切削装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61148004A (ja) | 1986-07-05 |
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