JPH0157518B2 - - Google Patents
Info
- Publication number
- JPH0157518B2 JPH0157518B2 JP60064750A JP6475085A JPH0157518B2 JP H0157518 B2 JPH0157518 B2 JP H0157518B2 JP 60064750 A JP60064750 A JP 60064750A JP 6475085 A JP6475085 A JP 6475085A JP H0157518 B2 JPH0157518 B2 JP H0157518B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- component
- support
- printed circuit
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000010438 heat treatment Methods 0.000 claims description 22
- 230000032258 transport Effects 0.000 claims description 22
- 238000005476 soldering Methods 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 10
- 239000011521 glass Substances 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 4
- 230000008602 contraction Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60064750A JPS61224395A (ja) | 1985-03-28 | 1985-03-28 | フラツトパツケ−ジ型電子部品の装着方法および装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60064750A JPS61224395A (ja) | 1985-03-28 | 1985-03-28 | フラツトパツケ−ジ型電子部品の装着方法および装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61224395A JPS61224395A (ja) | 1986-10-06 |
JPH0157518B2 true JPH0157518B2 (enrdf_load_stackoverflow) | 1989-12-06 |
Family
ID=13267150
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60064750A Granted JPS61224395A (ja) | 1985-03-28 | 1985-03-28 | フラツトパツケ−ジ型電子部品の装着方法および装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61224395A (enrdf_load_stackoverflow) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01183890A (ja) * | 1988-01-19 | 1989-07-21 | Toshiba Corp | 電子部品実装装置 |
JPH02232999A (ja) * | 1989-03-07 | 1990-09-14 | Matsushita Electric Ind Co Ltd | 電子部品装着装置 |
JPH02285700A (ja) * | 1989-04-27 | 1990-11-22 | Matsushita Electric Ind Co Ltd | 部品装着装置 |
JPH02303100A (ja) * | 1989-05-17 | 1990-12-17 | Matsushita Electric Ind Co Ltd | 部品装着方法 |
JP2853197B2 (ja) * | 1989-08-18 | 1999-02-03 | 松下電器産業株式会社 | 部品装着装置 |
JPWO2023203708A1 (enrdf_load_stackoverflow) | 2022-04-21 | 2023-10-26 |
-
1985
- 1985-03-28 JP JP60064750A patent/JPS61224395A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS61224395A (ja) | 1986-10-06 |
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