JPH0157498B2 - - Google Patents
Info
- Publication number
- JPH0157498B2 JPH0157498B2 JP58100215A JP10021583A JPH0157498B2 JP H0157498 B2 JPH0157498 B2 JP H0157498B2 JP 58100215 A JP58100215 A JP 58100215A JP 10021583 A JP10021583 A JP 10021583A JP H0157498 B2 JPH0157498 B2 JP H0157498B2
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- lead
- semiconductor device
- lead frame
- punching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/79—Apparatus for Tape Automated Bonding [TAB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58100215A JPS59225536A (ja) | 1983-06-07 | 1983-06-07 | アウタ−リ−ドボンデイング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58100215A JPS59225536A (ja) | 1983-06-07 | 1983-06-07 | アウタ−リ−ドボンデイング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59225536A JPS59225536A (ja) | 1984-12-18 |
| JPH0157498B2 true JPH0157498B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-12-06 |
Family
ID=14268073
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58100215A Granted JPS59225536A (ja) | 1983-06-07 | 1983-06-07 | アウタ−リ−ドボンデイング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59225536A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63166238A (ja) * | 1986-12-27 | 1988-07-09 | Shinkawa Ltd | インナ−リ−ドボンデイング装置 |
| US5094381A (en) * | 1990-11-20 | 1992-03-10 | International Business Machines Corporation | System for automated mounting of electronic components to circuit boards |
-
1983
- 1983-06-07 JP JP58100215A patent/JPS59225536A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59225536A (ja) | 1984-12-18 |