JPH0156111B2 - - Google Patents
Info
- Publication number
- JPH0156111B2 JPH0156111B2 JP60196541A JP19654185A JPH0156111B2 JP H0156111 B2 JPH0156111 B2 JP H0156111B2 JP 60196541 A JP60196541 A JP 60196541A JP 19654185 A JP19654185 A JP 19654185A JP H0156111 B2 JPH0156111 B2 JP H0156111B2
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- sensitive adhesive
- ultraviolet
- acrylic ester
- ultraviolet rays
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/50—Adhesives in the form of films or foils characterised by a primer layer between the carrier and the adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/001—Presence of polyolefin in the barrier layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2427/00—Presence of halogenated polymer
- C09J2427/006—Presence of halogenated polymer in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesive Tapes (AREA)
Priority Applications (11)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60196541A JPS6254782A (ja) | 1985-09-04 | 1985-09-04 | 感圧接着性シ−ト |
DE8686200196T DE3665191D1 (en) | 1985-02-14 | 1986-02-11 | A pressure sensitive adhesive and a pressure sensitive adhesive film having thereon a layer of the same |
DE8686200195T DE3671577D1 (de) | 1985-02-14 | 1986-02-11 | Verfahren zum schneiden einer halbleiterscheibe in wuerfel. |
EP19860200196 EP0194706B1 (en) | 1985-02-14 | 1986-02-11 | A pressure sensitive adhesive and a pressure sensitive adhesive film having thereon a layer of the same |
EP19860200195 EP0191534B1 (en) | 1985-02-14 | 1986-02-11 | A method for dicing a semiconductor wafer |
CA000501753A CA1252579A (en) | 1985-02-14 | 1986-02-13 | Method for dicing a semiconductor wafer |
CA000501750A CA1272542A (en) | 1985-02-14 | 1986-02-13 | Pressure sensitive adhesive and a pressure sensitive adhesive film having thereon a layer of the same |
US06/829,814 US4720317A (en) | 1985-02-14 | 1986-02-14 | Method for dicing a semiconductor wafer |
US06/829,818 US4818621A (en) | 1985-02-14 | 1986-02-14 | Pressure sensitive adhesives with reducible adhesive force using radiation, and films therewith |
US07/108,202 US4968559A (en) | 1985-02-14 | 1987-10-14 | Pressure sensitive adhesive film with barrier layer |
US07/287,089 US4913960A (en) | 1985-02-14 | 1988-12-21 | Pressure sensitive adhesive and a pressure sensitive adhesive film having thereon a layer of the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60196541A JPS6254782A (ja) | 1985-09-04 | 1985-09-04 | 感圧接着性シ−ト |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP26228390A Division JPH0689303B2 (ja) | 1990-09-28 | 1990-09-28 | 感圧接着性シート |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6254782A JPS6254782A (ja) | 1987-03-10 |
JPH0156111B2 true JPH0156111B2 (enrdf_load_stackoverflow) | 1989-11-28 |
Family
ID=16359452
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60196541A Granted JPS6254782A (ja) | 1985-02-14 | 1985-09-04 | 感圧接着性シ−ト |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6254782A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008045091A (ja) * | 2006-08-21 | 2008-02-28 | Nitto Denko Corp | 加工用粘着シート |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4674836B2 (ja) * | 2001-02-13 | 2011-04-20 | 日東電工株式会社 | ダイシング用粘着シート |
JP2008308527A (ja) * | 2007-06-12 | 2008-12-25 | Sekisui Chem Co Ltd | 印刷用再剥離性粘着シート |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5712083A (en) * | 1980-06-25 | 1982-01-21 | Nippon Carbide Ind Co Ltd | Self-adhesive film |
JPS5850164A (ja) * | 1981-09-19 | 1983-03-24 | Nippon Steel Corp | 連続鋳造設備 |
-
1985
- 1985-09-04 JP JP60196541A patent/JPS6254782A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008045091A (ja) * | 2006-08-21 | 2008-02-28 | Nitto Denko Corp | 加工用粘着シート |
Also Published As
Publication number | Publication date |
---|---|
JPS6254782A (ja) | 1987-03-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |