JPH0542138B2 - - Google Patents

Info

Publication number
JPH0542138B2
JPH0542138B2 JP2238755A JP23875590A JPH0542138B2 JP H0542138 B2 JPH0542138 B2 JP H0542138B2 JP 2238755 A JP2238755 A JP 2238755A JP 23875590 A JP23875590 A JP 23875590A JP H0542138 B2 JPH0542138 B2 JP H0542138B2
Authority
JP
Japan
Prior art keywords
dicing
film
pressure
sensitive adhesive
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2238755A
Other languages
English (en)
Japanese (ja)
Other versions
JPH03278444A (ja
Inventor
Hideo Kuroda
Masao Taniguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bando Chemical Industries Ltd
Original Assignee
Bando Chemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bando Chemical Industries Ltd filed Critical Bando Chemical Industries Ltd
Priority to JP2238755A priority Critical patent/JPH03278444A/ja
Publication of JPH03278444A publication Critical patent/JPH03278444A/ja
Publication of JPH0542138B2 publication Critical patent/JPH0542138B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
JP2238755A 1990-09-07 1990-09-07 半導体ウエハーのダイシング方法 Granted JPH03278444A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2238755A JPH03278444A (ja) 1990-09-07 1990-09-07 半導体ウエハーのダイシング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2238755A JPH03278444A (ja) 1990-09-07 1990-09-07 半導体ウエハーのダイシング方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP60196542A Division JPS6254937A (ja) 1985-02-14 1985-09-04 半導体ウエハ−のダイシング方法

Publications (2)

Publication Number Publication Date
JPH03278444A JPH03278444A (ja) 1991-12-10
JPH0542138B2 true JPH0542138B2 (enrdf_load_stackoverflow) 1993-06-25

Family

ID=17034784

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2238755A Granted JPH03278444A (ja) 1990-09-07 1990-09-07 半導体ウエハーのダイシング方法

Country Status (1)

Country Link
JP (1) JPH03278444A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5977954B2 (ja) * 2012-02-09 2016-08-24 リンテック株式会社 半導体ウエハ加工用シート

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5515696B2 (enrdf_load_stackoverflow) * 1973-08-07 1980-04-25
JPS51117730A (en) * 1975-04-10 1976-10-16 Oosakafu Pressure sensitive adhesives
JPS5850164B2 (ja) * 1977-04-01 1983-11-09 日立化成工業株式会社 表面保護方法
JPS58173179A (ja) * 1982-04-06 1983-10-12 Nhk Spring Co Ltd 粘着剤付発泡シ−ト体
JPS5921038A (ja) * 1982-07-27 1984-02-02 Nec Home Electronics Ltd ペレツト剥離方法
JPH0616524B2 (ja) * 1984-03-12 1994-03-02 日東電工株式会社 半導体ウエハ固定用接着薄板
JPS6128572A (ja) * 1984-07-19 1986-02-08 F S K Kk 半導体ウエハー用粘着シートの使用法

Also Published As

Publication number Publication date
JPH03278444A (ja) 1991-12-10

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