JPH0155584B2 - - Google Patents
Info
- Publication number
- JPH0155584B2 JPH0155584B2 JP58225656A JP22565683A JPH0155584B2 JP H0155584 B2 JPH0155584 B2 JP H0155584B2 JP 58225656 A JP58225656 A JP 58225656A JP 22565683 A JP22565683 A JP 22565683A JP H0155584 B2 JPH0155584 B2 JP H0155584B2
- Authority
- JP
- Japan
- Prior art keywords
- container
- terminal plate
- ceramic terminal
- ceramic
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22565683A JPS60117760A (ja) | 1983-11-30 | 1983-11-30 | 浸漬液冷装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22565683A JPS60117760A (ja) | 1983-11-30 | 1983-11-30 | 浸漬液冷装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60117760A JPS60117760A (ja) | 1985-06-25 |
JPH0155584B2 true JPH0155584B2 (enrdf_load_stackoverflow) | 1989-11-27 |
Family
ID=16832709
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22565683A Granted JPS60117760A (ja) | 1983-11-30 | 1983-11-30 | 浸漬液冷装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60117760A (enrdf_load_stackoverflow) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7581585B2 (en) | 2004-10-29 | 2009-09-01 | 3M Innovative Properties Company | Variable position cooling apparatus |
JP6278053B2 (ja) | 2016-03-28 | 2018-02-14 | 富士通株式会社 | 液浸冷却装置 |
JP6217835B1 (ja) | 2016-09-16 | 2017-10-25 | 富士通株式会社 | 液浸冷却装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5115973A (enrdf_load_stackoverflow) * | 1974-07-31 | 1976-02-07 | Hitachi Ltd | |
JPS52115181A (en) * | 1976-03-24 | 1977-09-27 | Hitachi Ltd | Sealing method for semiconductor devices |
JPS5931661B2 (ja) * | 1977-11-14 | 1984-08-03 | 株式会社日立製作所 | 沸騰冷却装置 |
JPS5931660A (ja) * | 1982-08-13 | 1984-02-20 | Snow Brand Milk Prod Co Ltd | 可塑性を保有するチ−ズ餅 |
-
1983
- 1983-11-30 JP JP22565683A patent/JPS60117760A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS60117760A (ja) | 1985-06-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6165820A (en) | Package for electronic devices | |
US4506108A (en) | Copper body power hybrid package and method of manufacture | |
CA1114936A (en) | All metal flat package | |
JPH11214430A (ja) | 配線基板及びその製造方法 | |
US5945735A (en) | Hermetic sealing of a substrate of high thermal conductivity using an interposer of low thermal conductivity | |
GB2032188A (en) | All metal flat package for microcircuits | |
US6037193A (en) | Hermetic sealing of a substrate of high thermal conductivity using an interposer of low thermal conductivity | |
JP2534881B2 (ja) | 気密封止回路装置 | |
JPH0155584B2 (enrdf_load_stackoverflow) | ||
JP3377850B2 (ja) | 表面実装型水晶発振器及びその製造方法 | |
JP4562301B2 (ja) | 電子部品収納用パッケージ | |
JPH07211822A (ja) | 半導体素子収納用パッケージ | |
JP2003133449A (ja) | ろう材付きシールリングおよびこれを用いた電子部品収納用パッケージの製造方法 | |
JPH06140527A (ja) | 半導体用封止装置部品 | |
JPH1167841A (ja) | 出力半導体チップの実装方法及び半導体チップ用パッケージ | |
JPH06151618A (ja) | 半導体素子収納用パッケージ | |
JP3339964B2 (ja) | 表面実装型水晶発振器及びその製造方法 | |
JP2002170895A (ja) | 電子部品収納用パッケージおよびその封止方法 | |
JP2710893B2 (ja) | リード付き電子部品 | |
JP2543153Y2 (ja) | 半導体素子収納用パッケージ | |
JP3583018B2 (ja) | セラミック配線基板 | |
CN118510188A (zh) | Pcb实现的器件用、组件用的密封小表贴封装装置及其工艺 | |
JP2003078054A (ja) | 電子部品装置 | |
JPH0448757A (ja) | 半導体用パツケージ | |
JPH0439776B2 (enrdf_load_stackoverflow) |