JPH0155584B2 - - Google Patents
Info
- Publication number
- JPH0155584B2 JPH0155584B2 JP58225656A JP22565683A JPH0155584B2 JP H0155584 B2 JPH0155584 B2 JP H0155584B2 JP 58225656 A JP58225656 A JP 58225656A JP 22565683 A JP22565683 A JP 22565683A JP H0155584 B2 JPH0155584 B2 JP H0155584B2
- Authority
- JP
- Japan
- Prior art keywords
- container
- terminal plate
- ceramic terminal
- ceramic
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000919 ceramic Substances 0.000 claims description 41
- 239000007788 liquid Substances 0.000 claims description 20
- 238000001816 cooling Methods 0.000 claims description 19
- 238000007654 immersion Methods 0.000 claims description 18
- 239000003507 refrigerant Substances 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 230000005855 radiation Effects 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 13
- 239000011521 glass Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 229910017309 Mo—Mn Inorganic materials 0.000 description 4
- 229910000990 Ni alloy Inorganic materials 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 239000000110 cooling liquid Substances 0.000 description 4
- 239000000498 cooling water Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 229910020816 Sn Pb Inorganic materials 0.000 description 3
- 229910020922 Sn-Pb Inorganic materials 0.000 description 3
- 229910008783 Sn—Pb Inorganic materials 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000005219 brazing Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000005496 eutectics Effects 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 229910000833 kovar Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- 230000008439 repair process Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000010802 sludge Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
【発明の詳細な説明】
(1) 発明の技術分野
本発明は浸漬液冷方法、詳しくは高密度の電子
機器を収納する容器の内外部の電気的接続を、多
数の端子を有するセラミツク端子板を容器へ気密
接合してなる浸漬液冷装置に関する。DETAILED DESCRIPTION OF THE INVENTION (1) Technical Field of the Invention The present invention relates to an immersion liquid cooling method, and more particularly, to a ceramic terminal board having a large number of terminals for electrically connecting the inside and outside of a container housing high-density electronic equipment. This invention relates to an immersion liquid cooling device in which a container is hermetically sealed to a container.
(2) 技術の背景
回路基板に実装された電子機器を冷却するため
に回路基板を密封容器内に収納し、容器に沸騰性
の冷媒を導入して回路基板を浸漬液冷する技術が
開発されている。気密端子の接合にはガラス端子
板またはセラミツク端子板が用いられる。(2) Background of the technology In order to cool the electronic devices mounted on the circuit board, a technology has been developed in which the circuit board is stored in a sealed container and a boiling refrigerant is introduced into the container to cool the circuit board by immersion in liquid. ing. A glass terminal plate or a ceramic terminal plate is used for joining the airtight terminals.
(3) 従来技術と問題点
従来の気密端子の接合方法としては、ガラスの
熱膨張係数とマツチングの良いコバール、42％
Ni合金などを用いて容器を形成し、他方接続端
子のためにはガラスを絶縁端子板として用い、金
属容器とガラス端子板とを気密に密封する方法が
ある。しかし多数の気密端子を必要とする場合、
高密度端子のためのガラス端子板を製造すること
は寸法精度の点から不適当である。(3) Conventional technology and problems The conventional method for joining airtight terminals is to use Kovar, which has a good thermal expansion coefficient of 42% and matches the coefficient of thermal expansion of glass.
There is a method of forming a container using a Ni alloy or the like, using glass as an insulating terminal plate for the other connection terminal, and airtightly sealing the metal container and the glass terminal plate. However, if a large number of hermetic terminals are required,
Manufacturing glass terminal plates for high density terminals is unsuitable from the viewpoint of dimensional accuracy.
セラミツク端子板はガラス端子板の前記した問
題を解決するものであるが、それと金属容器とを
接合する場合、セラミツク端子板上に設けたメタ
ライズ層と金属容器とを銀ろう付けなどにより接
合するときに、ろう付けのための作業温度が高い
ため、補修などをなす際の取外しが困難になる問
題がある。 Ceramic terminal plates solve the above-mentioned problems of glass terminal plates, but when bonding them to a metal container, it is difficult to bond the metallized layer provided on the ceramic terminal plate and the metal container by silver brazing or the like. Another problem is that the working temperature for brazing is high, making it difficult to remove for repairs or the like.
(4) 発明の目的
本発明は上記従来の問題に鑑み、メタライズ処
理したセラミツク端子板を浸漬液冷用容器に気密
はんだ封止することにより浸漬液冷用容器内外部
の多数の電気的接続を安価に寸法精度良く形成
し、また補修などのとき端子板の取外しを容易に
行うことができるセラミツク端子板を気密接合し
た浸漬液冷装置、および容器とセラミツク端子板
の熱膨張係数の不整合によつて発生する接合界面
の応力を緩和して容器とセラミツク端子板を接合
した浸漬液冷装置を提供することを目的とする。(4) Purpose of the Invention In view of the above-mentioned conventional problems, the present invention provides a method for connecting a large number of electrical connections inside and outside of an immersion liquid cooling container by hermetically sealing a metalized ceramic terminal plate to the immersion liquid cooling container with solder. This is an immersion liquid cooling device that hermetically seals ceramic terminal plates, which can be formed at low cost with good dimensional accuracy, and which can be easily removed for repairs, etc., and which can be used to solve the problem of mismatching coefficients of thermal expansion between the container and the ceramic terminal plates. It is an object of the present invention to provide an immersion liquid cooling device in which a container and a ceramic terminal plate are bonded together by alleviating the stress generated at the bonding interface.
(5) 発明の構成
そしてこの目的は本発明によれば、アルミニウ
ム金属製気密容器と、該容器内に設置される回路
基板と、複数の端子が貫通植立され、該容器の側
壁に気密接合されたセラミツク端子板と、放熱用
コールドプレートと、該回路基板を浸漬液冷する
冷媒と、該回路基板に接続され、該複数の端子に
接続される複数の内部接続ケーブルが設けられた
浸漬液冷装置であつて、アルミニウム金属製気密
容器と、該容器内に設置される回路基板と、複数
の端子が貫通植立され、該容器の側壁に気密接合
されたセラミツク端子板と、放熱用コールドプレ
ートと、該回路基板を浸漬液冷する冷媒と、該回
路基板に接続され、該複数の端子に接続される複
数の内部接続ケーブルが設けられた浸漬液冷装置
であつて、上記セラミツク端子板は、メタライズ
処理を施したメタライズ部ではんだ付けによりダ
ンパにはんだ付けされ、該ダンパが気密容器に気
密接合されてなることを特徴とする浸漬液冷装置
を提供することによつて達成される。(5) Structure of the Invention According to the present invention, the present invention provides an airtight container made of aluminum metal, a circuit board installed in the container, a plurality of terminals installed through the container, and an airtight connection to the side wall of the container. an immersion liquid provided with a ceramic terminal board, a cold plate for heat dissipation, a refrigerant for cooling the circuit board with the immersion liquid, and a plurality of internal connection cables connected to the circuit board and connected to the plurality of terminals. The cooling device includes an airtight container made of aluminum metal, a circuit board installed in the container, a ceramic terminal plate through which a plurality of terminals are installed and hermetically bonded to the side wall of the container, and a heat dissipation cold. An immersion liquid cooling device comprising a plate, a refrigerant for cooling the circuit board with an immersion liquid, and a plurality of internal connection cables connected to the circuit board and connected to the plurality of terminals, the ceramic terminal board This is achieved by providing an immersion liquid cooling device characterized in that a metallized portion subjected to metallization treatment is soldered to a damper, and the damper is hermetically sealed to an airtight container.
(6) 発明の実施例 以下本発明実施例を図面によつて詳説する。(6) Examples of the invention Embodiments of the present invention will be explained in detail below with reference to the drawings.
本発明者は、セラミツク端子板にMo−Mn系
メタライズ処理を施し、はんだ付けを容易にする
ためこの上にめつき処理を行い、耐圧性の必要な
金属製気密容器にはんだ付けによつて気密封止を
行うことを考えた。 The present inventor applied Mo-Mn metallization to a ceramic terminal board, plated it on top to make it easier to solder, and soldered it into a metal airtight container that required pressure resistance. I thought about sealing it.
かかる気密封止の第１の例を第１図を参照して
説明すると、１は気密容器、２はセラミツク端子
板、２ａは端子、３はメタライズ層、４はNiめ
つき層、５は電子機器が実装された回路基板、６
は内部接続ケーブル、７は冷却液、８は放熱用の
コールドプレート、９は冷却水の出入口、１０は
はんだ接合部を示す。 A first example of such hermetic sealing will be explained with reference to FIG. 1. 1 is an airtight container, 2 is a ceramic terminal board, 2a is a terminal, 3 is a metallized layer, 4 is a Ni plating layer, and 5 is an electronic circuit board on which equipment is mounted, 6
1 shows an internal connection cable, 7 a cooling liquid, 8 a cold plate for heat radiation, 9 an inlet/outlet for cooling water, and 10 a solder joint.
浸漬液冷用容器１にセラミツク端子板２をはん
だ気密封止する。セラミツク端子板２には第２図
の部分的拡大断面図に示される如く接合部にメタ
ライズ処理部３（Mo−Mn系）を形成し、更に
このメタライズ部にはＢ−Ni系無電解めつき層
４を形成する。容器１はセラミツク端子板２と熱
膨張係数が近いコバールまたは42％Ni合金で形
成すると、装置の温度上昇・下降により発生する
熱膨張係数のミスマツチが小さく、界面で発生す
る応力も相対的に小さくなり有利である。容器の
接合部に予備はんだを行い、セラミツク端子板に
フラツクスを塗布し、Sn−Pb系共晶はんだの融
点（183℃）より30〜40℃高温に加熱して接合す
ることにより１×10-10atm.c.c.／Ｓ以下の気密封
止が可能となる。 A ceramic terminal plate 2 is soldered and hermetically sealed in a container 1 for cooling an immersion liquid. As shown in the partially enlarged sectional view of FIG. 2, the ceramic terminal plate 2 has a metallized portion 3 (Mo-Mn based) formed at the joint, and this metalized portion is further coated with B-Ni electroless plating. Form layer 4. If the container 1 is made of Kovar or 42% Ni alloy, which has a coefficient of thermal expansion close to that of the ceramic terminal plate 2, mismatches in the coefficient of thermal expansion that occur due to temperature rises and falls of the device will be small, and the stress generated at the interface will also be relatively small. It is advantageous. By pre-soldering the joints of the containers, applying flux to the ceramic terminal plate, and joining by heating to 30 to 40 degrees Celsius higher than the melting point of Sn-Pb eutectic solder (183 degrees Celsius), 1×10 - Airtight sealing of 10 atm.cc/s or less is possible.
本発明の実施例においてはメタライズ処理した
セラミツク端子板を浸漬液冷用容器に気密はんだ
付けし、容器の内外部の多数の電気的接続を可能
にする。特に容器とセラミツク端子板の熱膨張係
数の不整合によつて発生する接合界面の応力をダ
ンパ構造によつて緩和することにより、熱膨張係
数の異なる容器とセラミツク端子板の接合がで
き、またこの接合は十分に耐久性を有するもので
ある。 In an embodiment of the invention, a metallized ceramic terminal plate is hermetically soldered to an immersion liquid cooling container, allowing multiple electrical connections to be made inside and outside the container. In particular, by alleviating the stress at the bonding interface caused by mismatching of the thermal expansion coefficients between the container and the ceramic terminal plate using a damper structure, it is possible to bond the container and the ceramic terminal plate with different coefficients of thermal expansion. The bond is sufficiently durable.
第３図にこの実施例が示され、同図において、
２１は気密容器、２２はセラミツク端子板、２２
ａは端子、２３はダンパ、２４はメタライズ層、
２５はNiめつき層、２６は回路基板、２７は内
部接続ケーブル、２８は冷却液、２９はコールド
プレート、３０は冷却水の出入口を示す。 This embodiment is shown in FIG. 3, in which:
21 is an airtight container, 22 is a ceramic terminal plate, 22
a is a terminal, 23 is a damper, 24 is a metallized layer,
25 is a Ni plating layer, 26 is a circuit board, 27 is an internal connection cable, 28 is a cooling liquid, 29 is a cold plate, and 30 is an inlet/outlet for cooling water.
浸漬液冷用容器２１にセラミツク端子板２２を
ダンパ２３を介して気密封止する。ダンパ２３は
例えばばね性のあるばね用ステンレスの如きFe
系合金で作るとよい。第４図の部分的拡大図に示
される如くセラミツク端子板２２には接合部にメ
タライズ処理２４を施し、この上にＢ−Ni無電
解めつき層２５を形成する。容器２１はセラミツ
ク端子板２２を直接接合する場合熱膨張係数の近
い値をもつコバールや42％Ni合金にすると装置
の温度上昇・下降により発生する熱膨張係数のミ
スマツチが小さく、界面での応力が低くなる。し
かし装置の軽量化のため、Al合金を使用すると
熱膨張係数の差が大きくなり、ミスマツチによる
応力が増大し、この繰返し応力によるクラツクに
より気密の低下がある。そこでダンパ２３を用
い、容器２１とセラミツク端子板２２の間の応力
を緩和する。この時ダンパ２３とセラミツク端子
板２２の間のはんだ接合部３１は高温はんだまた
はSn−Pb系共晶はんだを、容器２１とダンパ２
３の間のはんだ接合部３２にSn−Pb共晶はんだ
または低温はんだを用いるなど２段はんだ付けが
良い。これは接合の寸法精度を保持するに有効で
ある。 A ceramic terminal plate 22 is hermetically sealed in a container 21 for cooling immersion liquid via a damper 23. The damper 23 is made of Fe material such as spring stainless steel.
It is best to make it from a alloy. As shown in the partially enlarged view of FIG. 4, the ceramic terminal plate 22 is subjected to metallization treatment 24 at the joint portion, and a B--Ni electroless plating layer 25 is formed thereon. When the ceramic terminal plate 22 is directly bonded to the container 21, if it is made of Kovar or 42% Ni alloy, which have similar coefficients of thermal expansion, mismatches in the coefficients of thermal expansion that occur due to temperature rises and falls of the device will be small, and stress at the interface will be reduced. It gets lower. However, if an Al alloy is used to reduce the weight of the device, the difference in thermal expansion coefficients will increase, stress due to mismatching will increase, and cracks due to this repeated stress will reduce airtightness. Therefore, the damper 23 is used to relieve the stress between the container 21 and the ceramic terminal plate 22. At this time, the solder joint 31 between the damper 23 and the ceramic terminal plate 22 is formed by applying high temperature solder or Sn-Pb eutectic solder to the container 21 and the damper 2.
Two-step soldering is preferred, such as using Sn-Pb eutectic solder or low-temperature solder for the solder joint 32 between the two. This is effective in maintaining the dimensional accuracy of the joint.
気密容器２１とダンパ２３が同質材料の場合、
接合部３１をレーザ溶接により接合しても同じ効
果がある。 When the airtight container 21 and the damper 23 are made of the same material,
The same effect can be obtained even if the joint portion 31 is joined by laser welding.
第５図は複数の端子２２ａを貫通植立したセラ
ミツク端子板２２の平面図ａと要部拡大断面図ｂ
を含む。 FIG. 5 is a plan view a and an enlarged sectional view b of a main part of a ceramic terminal plate 22 with a plurality of terminals 22a installed therethrough.
including.
第５図ａを参照すると、例として45mm口のセラ
ミツク端子板２２には、ダンパ２３とのはんだ付
けされる幅４mmの外周メタライズ部５１がパター
ン形成されている。また、その内側には、例え
ば、30mm口の端子取付領域５２内に12×12（144）
の端子２２ａを受ける穴２２ｂが2.5mmピツチで
格子状に形成されている。なお同図において、穴
２２ｂの配置は模式的に示される。 Referring to FIG. 5a, for example, a 45 mm diameter ceramic terminal plate 22 is patterned with an outer peripheral metallized portion 51 having a width of 4 mm to be soldered to a damper 23. As shown in FIG. In addition, inside the terminal mounting area 52 with a 30 mm opening, for example, 12 x 12 (144)
The holes 22b for receiving the terminals 22a are formed in a grid pattern with a pitch of 2.5 mm. In addition, in the figure, the arrangement of the holes 22b is schematically shown.
次に第５図ｂを参照すると、端子２２ａはセラ
ミツク端子板２２に格子状に穴明けされた穴２２
ｂに植立され、セラミツク端子板２２の一方の表
面側で穴２２ｂの周囲に形成された。Mo−Mn
メタライズ層５３及びMoあるいは42％Ni合金等
のセラミツク板と熱膨張係数がほぼ同一の材料か
らなる端子２２ａをろう付けする。それには、銀
ろう（JIS BAg−８）５４により850〜860℃程
度の比較的高温で銀ろう付けを行う。なお、端子
２２ａのろう付け部は金めつきをあらかじめ施し
ておく。セラミツク端子板２２としては、アルミ
ナよりなる端子板を用いることが出来る。 Next, referring to FIG.
b, and was formed around the hole 22b on one surface side of the ceramic terminal plate 22. Mo−Mn
A terminal 22a made of a material having substantially the same coefficient of thermal expansion as the metallized layer 53 and a ceramic plate such as Mo or 42% Ni alloy is brazed. For this purpose, silver soldering is performed using silver soldering (JIS BAg-8) 54 at a relatively high temperature of about 850 to 860°C. Note that the brazed portion of the terminal 22a is pre-plated with gold. As the ceramic terminal plate 22, a terminal plate made of alumina can be used.
このようなセラミツク端子板２２はアルミナ粉
末、有機バインダ、可塑剤、溶剤を混練してセラ
ミツクスリツプ（泥漿）を形成し、セラミツクス
リツプからドクターブレード法によりグリーンシ
ートを形成し、グリーンシート上に端子２２ａを
貫通植立する穴２２ｂを設ける部分に穴より大き
い面積のパツドのマスクパターンを格子状に配列
し、また、ダンパ２３とのメタライズを行う外周
メタライズ部を印刷するマスクを用いてパツド及
び外周部をMo−Mnペーストをスクリーン印刷
した後、押型あるいはドリル等によりグリーンシ
ートの穴２２ｂ形成箇所の穴明けを行う。 Such a ceramic terminal plate 22 is made by kneading alumina powder, an organic binder, a plasticizer, and a solvent to form a ceramic slip (sludge), forming a green sheet from the ceramic slip by a doctor blade method, and then forming the terminal 22a on the green sheet. A mask pattern of pads having an area larger than the holes is arranged in a grid pattern in the area where the holes 22b are to be installed through the damper 23, and a mask is used to print the outer circumferential metallized portion that is to be metalized with the damper 23. After screen-printing the Mo--Mn paste, the holes 22b of the green sheet are formed using a press die or a drill.
しかる後、還元性雰囲気中、高温でグリーンシ
ートを焼結して外周メタライズ部５１及び端子２
２をろう付けするための穴２２ｂの周囲に形成さ
れたメタライズ層５３を有するセラミツク端子板
を形成することが出来る。なお、メタライズ層５
３は、穴明けを行つた後に形成しても良い。ま
た、Mo−Mnメタライズ層とアルミナ基板２２
との密着性を向上する、例えばNi層等を間に介
在させても良い。 After that, the green sheet is sintered at high temperature in a reducing atmosphere to form the outer metalized portion 51 and the terminal 2.
It is possible to form a ceramic terminal plate having a metallized layer 53 formed around the hole 22b for brazing 2. Note that the metallized layer 5
3 may be formed after drilling. In addition, the Mo-Mn metallized layer and the alumina substrate 22
For example, a Ni layer or the like may be interposed therebetween to improve the adhesion between the two layers.
(7) 発明の効果
以上詳細に説明した如く本発明によれば、金属
製気密容器とメタライズ処理したセラミツク端子
板を気密封止することができ、十分な耐久性と補
修のための取外し、再接合を用意に行うことがで
き、更には熱膨張係数の不整合を緩和し、気密容
器の内外部の電気的接続が形成されるため、電子
機器の浸漬液冷を確実に行うに効果大である。(7) Effects of the Invention As explained in detail above, according to the present invention, it is possible to hermetically seal a metal airtight container and a metalized ceramic terminal plate, and it has sufficient durability and is easy to remove and reuse for repair. It is highly effective in reliably immersing electronic devices in liquid cooling because it allows for easy bonding, alleviates thermal expansion coefficient mismatch, and forms electrical connections between the inside and outside of the airtight container. be.
第１図は本発明者の開発にかかる液冷装置の断
面図、第２図は第１図の装置の接合部の断面図、
第３図は本発明実施例の断面図、第４図は第３図
の装置の接合部の断面図、第５図ａはセラミツク
端子板平面図、同図ｂはセラミツク端子板要部拡
大断面図である。
１……気密容器、２……セラミツク端子板、２
ａ……端子、３……メタライズ層、４……Niめ
つき層、５……回路基板、６……内部接続ケーブ
ル、７……冷却液、８……コールドプレート、９
……冷却水出入口、１０……はんだ接合部、２１
……気密容器、２２……セラミツク端子板、２２
ａ……端子、２２ｂ……穴、２３……ダンパ、２
４……メタライズ層、２５……Niめつき層、２
６……回路基板、２７……内部接続ケーブル、２
８……冷却液、２９……コールドプレート、３０
……冷却水出入口、３１……はんだ接合部（容器
ダンパ間）、３２……はんだ接合部（ダンパ／セ
ラミツク端子板）、５１……メタライズ部、５２
……端子取付領域、５３……メタライズ層、５４
……銀ろう。
FIG. 1 is a cross-sectional view of a liquid cooling device developed by the present inventor, FIG. 2 is a cross-sectional view of the joint of the device shown in FIG.
FIG. 3 is a sectional view of an embodiment of the present invention, FIG. 4 is a sectional view of the joint of the device shown in FIG. 3, FIG. 5a is a plan view of a ceramic terminal plate, and FIG. It is a diagram. 1... Airtight container, 2... Ceramic terminal board, 2
a...Terminal, 3...Metallized layer, 4...Ni plating layer, 5...Circuit board, 6...Internal connection cable, 7...Cooling liquid, 8...Cold plate, 9
...Cooling water inlet/outlet, 10...Solder joint, 21
... Airtight container, 22 ... Ceramic terminal board, 22
a...terminal, 22b...hole, 23...damper, 2
4...metalized layer, 25...Ni plating layer, 2
6... Circuit board, 27... Internal connection cable, 2
8...Cooling liquid, 29...Cold plate, 30
... Cooling water inlet/outlet, 31 ... Solder joint (between container and damper), 32 ... Solder joint (damper/ceramic terminal board), 51 ... Metallized part, 52
... Terminal mounting area, 53 ... Metallized layer, 54
...Silver wax.
Claims (1)
の側壁に気密接合されたセラミツク端子板２２
と、 放熱用コールドプレート２９と、 該回路基板２６を浸漬液冷する冷媒２８と、 該回路基板２６に接続され、該複数の端子２２
ａに接続される複数の内部接続ケーブル２７が設
けられた浸漬液冷装置であつて、 上記セラミツク端子板２２は、メタライズ処理
を施したメタライズ部５１ではんだ付けによりダ
ンパ２３にはんだ付けされ、該ダンパ２３が気密
容器２１に気密接合されてなることを特徴とする
浸漬液冷装置。[Claims] 1. An airtight container 21 made of aluminum metal, a circuit board 26 installed in the container 21, and a plurality of terminals 22a installed through the container 21.
Ceramic terminal plate 22 hermetically sealed to the side wall of
a cold plate 29 for heat radiation; a refrigerant 28 for cooling the circuit board 26 with an immersion liquid; and a refrigerant 28 connected to the circuit board 26 and connected to the plurality of terminals 22.
This is an immersion liquid cooling device provided with a plurality of internal connection cables 27 connected to An immersion liquid cooling device characterized in that a damper 23 is hermetically sealed to an airtight container 21.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22565683A JPS60117760A (en) | 1983-11-30 | 1983-11-30 | Hermetic bonding method for ceramic terminal plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22565683A JPS60117760A (en) | 1983-11-30 | 1983-11-30 | Hermetic bonding method for ceramic terminal plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60117760A JPS60117760A (en) | 1985-06-25 |
| JPH0155584B2 true JPH0155584B2 (en) | 1989-11-27 |
Family
ID=16832709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22565683A Granted JPS60117760A (en) | 1983-11-30 | 1983-11-30 | Hermetic bonding method for ceramic terminal plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60117760A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7581585B2 (en) | 2004-10-29 | 2009-09-01 | 3M Innovative Properties Company | Variable position cooling apparatus |
| JP6278053B2 (en) | 2016-03-28 | 2018-02-14 | 富士通株式会社 | Immersion cooling device |
| JP6217835B1 (en) | 2016-09-16 | 2017-10-25 | 富士通株式会社 | Immersion cooling device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5115973A (en) * | 1974-07-31 | 1976-02-07 | Hitachi Ltd | |
| JPS52115181A (en) * | 1976-03-24 | 1977-09-27 | Hitachi Ltd | Sealing method for semiconductor devices |
| JPS5469858A (en) * | 1977-11-14 | 1979-06-05 | Hitachi Ltd | Boil-cooling device |
| JPS5931660A (en) * | 1982-08-13 | 1984-02-20 | Snow Brand Milk Prod Co Ltd | Cheese rice cake having plasticity |
-
1983
- 1983-11-30 JP JP22565683A patent/JPS60117760A/en active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5115973A (en) * | 1974-07-31 | 1976-02-07 | Hitachi Ltd | |
| JPS52115181A (en) * | 1976-03-24 | 1977-09-27 | Hitachi Ltd | Sealing method for semiconductor devices |
| JPS5469858A (en) * | 1977-11-14 | 1979-06-05 | Hitachi Ltd | Boil-cooling device |
| JPS5931660A (en) * | 1982-08-13 | 1984-02-20 | Snow Brand Milk Prod Co Ltd | Cheese rice cake having plasticity |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60117760A (en) | 1985-06-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6165820A (en) | Package for electronic devices | |
| US4506108A (en) | Copper body power hybrid package and method of manufacture | |
| CA1114936A (en) | All metal flat package | |
| JPH11214430A (en) | Wiring board and its manufacture | |
| US5945735A (en) | Hermetic sealing of a substrate of high thermal conductivity using an interposer of low thermal conductivity | |
| GB2032188A (en) | All metal flat package for microcircuits | |
| US6037193A (en) | Hermetic sealing of a substrate of high thermal conductivity using an interposer of low thermal conductivity | |
| JPH0155584B2 (en) | ||
| JP2534881B2 (en) | Hermetically sealed circuit device | |
| JP3377850B2 (en) | Surface mount type crystal oscillator and manufacturing method thereof | |
| JP4562301B2 (en) | Electronic component storage package | |
| JP2003133449A (en) | Seal ring having brazing material and manufacturing method of package for accommodating electronic component using the seal ring | |
| JPH07211822A (en) | Package for accommodating semiconductor element | |
| JPH06140527A (en) | Sealing device component for semiconductor | |
| JP2003068900A (en) | Package for housing electronic component | |
| JPH06151618A (en) | Package for enclosing semiconductor devices | |
| JP3339964B2 (en) | Surface mount type crystal oscillator and manufacturing method thereof | |
| JP2710893B2 (en) | Electronic components with leads | |
| JP2631397B2 (en) | Package for storing semiconductor elements | |
| JP2002170895A (en) | Package for housing electronic component and method for sealing the same | |
| JPH1167841A (en) | Mounting of output semiconductor chip and package for semiconductor chip | |
| JP2543153Y2 (en) | Package for storing semiconductor elements | |
| JP3583018B2 (en) | Ceramic wiring board | |
| JP2003078054A (en) | Electronic component device | |
| JPH0448757A (en) | Package for semiconductor device |