JPS60117760A - Hermetic bonding method for ceramic terminal plate - Google Patents
Hermetic bonding method for ceramic terminal plateInfo
- Publication number
- JPS60117760A JPS60117760A JP22565683A JP22565683A JPS60117760A JP S60117760 A JPS60117760 A JP S60117760A JP 22565683 A JP22565683 A JP 22565683A JP 22565683 A JP22565683 A JP 22565683A JP S60117760 A JPS60117760 A JP S60117760A
- Authority
- JP
- Japan
- Prior art keywords
- terminal plate
- container
- ceramic terminal
- ceramic
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
（１）発明の技術分野
本発明は電子機器の浸漬液冷方法、ＩＩＹニジ＜はｊｌ
密度の電子機器を収納する容器の内外部の電気的接続に
使用するセラミック端子板の容器への気密接合を行う方
法に関する。DETAILED DESCRIPTION OF THE INVENTION (1) Technical field of the invention The present invention relates to an immersion liquid cooling method for electronic equipment,
The present invention relates to a method for airtightly bonding a ceramic terminal plate to a container, which is used for electrical connection between the inside and outside of a container housing high-density electronic equipment.
（２）技術の背景
回路基板に実装された電子機器を冷却するために回路基
板を密封容器内に収納し、容器に沸騰性の冷媒を導入し
て回路基板を浸漬冷却する技術が開発されている。気密
端子の接合にはガラス端子板またはセラミック端子板が
用いられる。(2) Background of the technology In order to cool the electronic devices mounted on the circuit board, a technology has been developed in which the circuit board is stored in a sealed container and a boiling refrigerant is introduced into the container to cool the circuit board by immersion. There is. A glass terminal plate or a ceramic terminal plate is used for joining the airtight terminal.
（３）従来技術と問題点
従来の気密端子の接合方法としては、ガラスの熱膨張係
数とマツチングの良いコバール、４２％Ｎｉ合金などを
用いて容器を形成し、他方接続端子のためにはガラスを
絶縁端子板として用い、全屈容器とガラス端子板とを気
密に密封する方法がある。(3) Conventional technology and problems The conventional method for joining airtight terminals is to form a container using Kovar, a 42% Ni alloy, etc., which has a good thermal expansion coefficient matching with the coefficient of thermal expansion of glass, and use glass for the connection terminal. There is a method of using a glass terminal plate as an insulating terminal plate to airtightly seal a fully bent container and a glass terminal plate.
しかし多数の気密端子を必要とする場合、高密度端子の
ためのガラス端子板を製造することは寸法精度の点から
不適当である。However, when a large number of hermetic terminals are required, manufacturing a glass terminal plate for high-density terminals is inappropriate from the viewpoint of dimensional accuracy.
セラミック端子板はガラス端子板の前記した問題を解決
するものであるが、それと金属容器とを接合する場合、
セラミンク端子板上に設けたメタライズ層と金属容器と
を銀ろうイ」けなどにより接合するときに、ろう付けの
ための作業温度が高いため、補修などをなす際の取外し
が困難になる問題がある。Ceramic terminal plates solve the above-mentioned problems of glass terminal plates, but when joining them to a metal container,
When the metallized layer provided on the ceramic terminal board and the metal container are joined by silver soldering, etc., the working temperature for brazing is high, making it difficult to remove for repairs etc. be.
（４）発明の目的
本発明は上記従来の問題に鑑み、メタライズ処理したセ
ラミック端子板を浸漬液冷用容器に気密はんだ封止する
ことにより浸漬液冷用容器内外部の多数の電気的接続を
安価に寸法精度良く形成し、また補修などのとき端子板
の取外しを容易に行うことができるセラミック端子板の
気密接合方法、および容器とセラミック端子板の熱膨張
係数の不整合によって発生ずる接合界面の応力を緩和し
て容器とセラミック端子板を接合する方法を提供するこ
とを目的とする。(4) Purpose of the Invention In view of the above-mentioned conventional problems, the present invention provides a large number of electrical connections inside and outside of the immersion liquid cooling container by hermetically sealing a metalized ceramic terminal plate to the immersion liquid cooling container with solder. A method for airtightly joining ceramic terminal plates that can be formed at low cost and with good dimensional accuracy, and that allows the terminal plate to be easily removed for repairs, etc., and a bonding interface that occurs due to mismatching coefficients of thermal expansion between the container and the ceramic terminal plate. An object of the present invention is to provide a method for bonding a container and a ceramic terminal plate by relieving stress.
（５）発明の構成
そしてこの目的は本発明によれば、不活性液体を冷却液
とする浸漬液冷においてメタライズ処理を施したセラミ
ック端子板を用い気密容器の内外部を電気的に接続し、
前記セラミック端子板のメタライズ部と気密容器をはん
だ付けにより気密接合することを特徴とするセラミック
端子板の気密接合方法を提供することによって達成され
、また前記方法において容器にはんだ付けしたダンパに
セラミック端子板をはんだ付けして当該端子板と容器と
を気密接合することによっても達成される。(5) Structure and object of the invention According to the present invention, the inside and outside of an airtight container are electrically connected using a ceramic terminal plate subjected to metallization treatment in immersion liquid cooling using an inert liquid as a cooling liquid.
This is achieved by providing a method for airtightly joining a ceramic terminal board, characterized in that the metallized portion of the ceramic terminal board and the airtight container are hermetically joined by soldering, and in the method, the ceramic terminal is attached to the damper soldered to the container. This can also be achieved by soldering the plates to form a hermetic connection between the terminal plate and the container.
（６）発明の実施例 以下本発明実施例を図面によって詳説する。(6) Examples of the invention Embodiments of the present invention will be explained in detail below with reference to the drawings.
本発明者は、セラミック端子板にＭｏ−Ｍｎ系メタライ
ズ処理を施し、はんだ付けを容易にするためこの上にめ
っき処理を行い、耐圧性の必要な金属製気密容器にはん
だ付けによって気密封止を行うことを考えた。The present inventor applied a Mo-Mn metallization treatment to a ceramic terminal plate, applied plating treatment thereon to facilitate soldering, and sealed hermetically by soldering it to a metal airtight container that requires pressure resistance. I thought about doing it.
本発明の第１実施例を第１図を参照して説明すると、１
は気密容器、２はセラミック端子板、２ａは端子、３は
メタライズ層、４は旧めっき層、５は電子機器が実装さ
れた回路基板、６は内部接続ケーブル、７ば冷却液、８
は放熱用のコールドプレート、９は冷却水の出入口、１
０ははんだ接合部を示す。A first embodiment of the present invention will be described with reference to FIG.
is an airtight container, 2 is a ceramic terminal board, 2a is a terminal, 3 is a metallized layer, 4 is an old plating layer, 5 is a circuit board on which electronic equipment is mounted, 6 is an internal connection cable, 7 is a cooling liquid, 8
is a cold plate for heat dissipation, 9 is a cooling water inlet and outlet, 1
0 indicates a solder joint.
浸漬液冷用容器１にセラミ・ツク端子板２をはんだ気密
封止する。セラミック端子板２には第２図の部分的拡大
断面図に示される如く接合部にメタライズ処理部３ （
Ｍｏ−Ｍｎ系）を形成し、更にこのメタライズ部にはＢ
−Ｎｉ系無電解めっき層４を形成する。容器ｌはセラミ
ック端子板２と熱膨張係数が近いコバールまたは４２％
Ｎｔ合金で形成すると、装置の温度上昇・下降により発
生する熱膨張係数のミスマツチが小さく、界面で発生す
る応力も相り１的に小さくなり有利である。容器の接合
部に予備はんだを行い、セラミック端子板にフラ・ノク
スを塗布し、ｓｎ−？ｂ系共品はんだの融点（１８３°
Ｃ）より３０〜４０°Ｃ高温に加熱して接合することに
よりＩ Ｘ １０−” ａｔｍ、ｃｃ／ Ｓ以下の気密
封止が可能となる。A ceramic terminal plate 2 is soldered and hermetically sealed in a container 1 for cooling an immersion liquid. The ceramic terminal plate 2 has a metallized portion 3 (
(Mo-Mn system), and furthermore, B is formed in this metallized part.
-Ni-based electroless plating layer 4 is formed. The container l is made of Kovar or 42%, which has a thermal expansion coefficient similar to that of the ceramic terminal plate 2.
Forming the Nt alloy is advantageous because mismatches in thermal expansion coefficients caused by temperature rises and falls of the device are small, and the stress generated at the interface is also reduced. Pre-solder the joints of the container, apply Fura Nox to the ceramic terminal board, and connect the sn-? Melting point of b-based solder (183°
By heating and bonding to a temperature higher than C) by 30 to 40°C, it is possible to achieve an airtight seal of I x 10-" atm, cc/s or less.
本発明の第２実施例においてはメタライズ処理したセラ
ミック端子板を浸漬液冷用容器に気密はんだイス１けし
、容器の内外部の多数の電気的接続を可能にする。特に
容器とセラミ・ツク端子板の熱膨張係数の不整合によっ
て発生する接合界面の応力をダンパ構造によって緩和す
ることにより、熱膨張係数の異なる容器とセラミック端
子板の接合ができ、またこの接合は十分に耐久性を有す
るものである。In a second embodiment of the invention, a metallized ceramic terminal plate is placed in an airtight soldering chair in an immersion liquid cooling container, allowing multiple electrical connections to be made inside and outside the container. In particular, by alleviating the stress at the bonding interface caused by mismatching of the thermal expansion coefficients between the container and the ceramic terminal plate using a damper structure, it is possible to bond the container and the ceramic terminal plate, which have different coefficients of thermal expansion. It is sufficiently durable.
第３図に本発明の第２実施例が示され同図において、２
１は気密容器、２２はセラミック端子板、２２ａは端子
、２３はダンパ、２４はメタライズ層、２５はＮｔめっ
き層、２６は回路基板、２７は内部接続ケーブル、２８
は冷却液、２９はコールドプレート、３０ば冷却水の出
入口を示す。A second embodiment of the present invention is shown in FIG.
1 is an airtight container, 22 is a ceramic terminal board, 22a is a terminal, 23 is a damper, 24 is a metallized layer, 25 is an Nt plating layer, 26 is a circuit board, 27 is an internal connection cable, 28
29 is a cold plate, and 30 is a cooling water inlet/outlet.
浸漬液冷用容器２１にセラミック端子板２２をダンパ２
３を介して気密封止する。ダンパ２３は例えばばね性の
あるばね用ステンレスの如きＦｅ系合金で作るとよい。A ceramic terminal plate 22 is attached to a damper 2 in a container 21 for cooling immersion liquid.
3 and hermetically sealed. The damper 23 is preferably made of an Fe-based alloy such as spring stainless steel, which has spring properties.
第４図の部分的拡大図に示される如くセラミック端子板
２２には接合部にメタライズ処理２４を施し、この上に
Ｂ−Ｎｉ無電解めっき層２５を形成する。容器２１はセ
ラミック端子板２２を直接接合する場合熱膨張係数の近
い値をもつコバールや４２％Ｎｉ合金にすると装置の温
度上昇・下降により発生する熱膨張係数のミスマツチが
小さく、界面でのＪ心力が低くなる。しかし装置の軽量
化のためｉ合金を使用すると熱膨張係数の差が太き（な
り、ミスマツチによる応力が増大し、この繰返し応力に
よるクラックにより気密の低下がある。そこでダンパ２
３を用い、容器２１とセラミック端子板２２の間の応力
を緩和する。この時ダンパ２３とセラミック端子板２２
の間のはんだ接合部３１は高温はんだまたは５ｎ−１’
ｂ系共晶はんだを、容器２１とダンパ２３の間のはんだ
接合部３２に５ｎ−Ｐｂ共晶はんだまたは低温はんだを
用いるなど２段はんだ付けが良い。これは接合の寸法精
度を保持するに有効である。As shown in the partially enlarged view of FIG. 4, the ceramic terminal plate 22 is subjected to metallization treatment 24 at the joint portion, and a B-Ni electroless plating layer 25 is formed thereon. When the container 21 is directly bonded to the ceramic terminal plate 22, if it is made of Kovar or 42% Ni alloy, which have similar coefficients of thermal expansion, mismatches in the coefficients of thermal expansion that occur due to temperature rises and falls of the device will be small, and the J center force at the interface will be reduced. becomes lower. However, when i-alloy is used to reduce the weight of the device, the difference in thermal expansion coefficient becomes large (this results in an increase in stress due to mismatching, and a decrease in airtightness due to cracks caused by this repeated stress.
3 to relieve stress between the container 21 and the ceramic terminal plate 22. At this time, the damper 23 and the ceramic terminal board 22
The solder joints 31 between the
Two-step soldering is preferred, such as using 5n-Pb eutectic solder or low-temperature solder for the solder joint 32 between the container 21 and the damper 23 using the b-based eutectic solder. This is effective in maintaining the dimensional accuracy of the joint.
気密容器２１とダンパ２３が同質材料の場合、接合部３
１をレーザ溶接により接合しても同じ効果がある。If the airtight container 21 and the damper 23 are made of the same material, the joint 3
The same effect can be obtained by joining 1 by laser welding.
（７）発明の効果
以上詳細に説明した如く本発明によれば、金属製気密容
器とメタライズ処理したセラミック端子板を気密封止す
ることができ、十分な耐久性と補修のための取外し、再
接合を容易にマ〒うこと力くでき、更には熱膨張係数の
不整合を緩和し、気密容器の内外部の電気的接続が形成
されるため、電子機器の浸漬液冷を確実に行うに効果大
である。(7) Effects of the Invention As explained in detail above, according to the present invention, it is possible to hermetically seal a metal hermetic container and a metalized ceramic terminal plate, and to ensure sufficient durability and ease of removal and reuse for repair. It is a reliable method for immersion liquid cooling of electronic equipment because it makes the bond easier to maintain, reduces thermal expansion coefficient mismatch, and creates electrical connections between the inside and outside of the airtight container. It is highly effective.
第１図と第３図は本発明実施例の断面図、第２図と第４
図は第１図と第３図に示した実り缶（郵ｊの一部の拡大
断面図である。
１−気密容器、２−セラミ・ツク端子板、２ａ・一端子
、３−・−メタライズ層、４〜Ｎｉめっき層、５−回路
基板、６−内部接続ケーブル、７−冷却液、８−
コールドプレート、９・−冷却水出入口、１０−はんだ
接合部、２１−気密容器、２２・−セラミック端子板、
２２ａ一端子、２３−・ダンパ、２４− メタライズ層
、２５−Ｎｉめっき層、２６−回路基板、２７−内部接
続ケーブル、２８・−冷却液、２９−コールドプレート
、３叶−冷却水出入口、３１・−はんだ接合部（容器ダ
ン）ｉ間）、３２８．はんだ接合部（ダンノ々／セラミ
・ツク端子板）Figures 1 and 3 are cross-sectional views of embodiments of the present invention, and Figures 2 and 4 are
The figure is an enlarged sectional view of a part of the fruit can shown in Figs. layer, 4 - Ni plating layer, 5 - circuit board, 6 - internal connection cable, 7 - cooling liquid, 8 - cold plate, 9 - cooling water inlet/outlet, 10 - solder joint, 21 - airtight container, 22 - ceramic terminal board,
22a - terminal, 23 - damper, 24 - metallized layer, 25 - Ni plating layer, 26 - circuit board, 27 - internal connection cable, 28 - coolant, 29 - cold plate, 3 - cooling water inlet/outlet, 31・-Solder joint part (container hole) between i), 328. Solder joints (Danno/ceramic terminal board)
Claims (2)
ライス処理を施したセラミック端子板を用い気密容器の
内外部を電気的に接続し、前記セラミック端子板のメタ
ライズ部と気密容器をはんだイ］けにより気密接合する
ことを特徴とするセラミック端子板の気密接合方法。(1) Electrically connect the inside and outside of an airtight container using a ceramic terminal plate that has been subjected to metallization treatment using immersion liquid cooling using an inert liquid as a cooling liquid, and solder the metallized portion of the ceramic terminal board and the airtight container. ] A method for airtightly joining ceramic terminal plates, characterized by airtightly joining them.
気密容器の内外部を電気的に接続し、前記セラミック端
子板のメタライズ部と気密容器をはんだ付けにより気密
接合する不活性液体を冷却液とする浸漬液冷において、
容器にはんだ付けしたダンパにセラミック端子板をはん
だ付けして当該端子板と容器とを気密接合することを特
徴とするセラミック端子板の気密接合方法。(2) Electrically connect the inside and outside of the airtight container using a ceramic terminal plate subjected to metallizing treatment, and use an inert liquid as a cooling liquid to hermetically connect the metallized portion of the ceramic terminal plate and the airtight container by soldering. In immersion liquid cooling,
1. A method for airtightly joining a ceramic terminal board, the method comprising soldering a ceramic terminal board to a damper soldered to a container to airtightly join the terminal board and the container.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22565683A JPS60117760A (en) | 1983-11-30 | 1983-11-30 | Hermetic bonding method for ceramic terminal plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22565683A JPS60117760A (en) | 1983-11-30 | 1983-11-30 | Hermetic bonding method for ceramic terminal plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60117760A true JPS60117760A (en) | 1985-06-25 |
| JPH0155584B2 JPH0155584B2 (en) | 1989-11-27 |
Family
ID=16832709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22565683A Granted JPS60117760A (en) | 1983-11-30 | 1983-11-30 | Hermetic bonding method for ceramic terminal plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60117760A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7581585B2 (en) | 2004-10-29 | 2009-09-01 | 3M Innovative Properties Company | Variable position cooling apparatus |
| US10015905B2 (en) | 2016-03-28 | 2018-07-03 | Fujitsu Limited | Immersion cooling device and seal tank |
| US10080308B2 (en) | 2016-09-16 | 2018-09-18 | Fujitsu Limited | Immersion cooling apparatus |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5115973A (en) * | 1974-07-31 | 1976-02-07 | Hitachi Ltd | |
| JPS52115181A (en) * | 1976-03-24 | 1977-09-27 | Hitachi Ltd | Sealing method for semiconductor devices |
| JPS5469858A (en) * | 1977-11-14 | 1979-06-05 | Hitachi Ltd | Boil-cooling device |
| JPS5931660A (en) * | 1982-08-13 | 1984-02-20 | Snow Brand Milk Prod Co Ltd | Cheese rice cake having plasticity |
-
1983
- 1983-11-30 JP JP22565683A patent/JPS60117760A/en active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5115973A (en) * | 1974-07-31 | 1976-02-07 | Hitachi Ltd | |
| JPS52115181A (en) * | 1976-03-24 | 1977-09-27 | Hitachi Ltd | Sealing method for semiconductor devices |
| JPS5469858A (en) * | 1977-11-14 | 1979-06-05 | Hitachi Ltd | Boil-cooling device |
| JPS5931660A (en) * | 1982-08-13 | 1984-02-20 | Snow Brand Milk Prod Co Ltd | Cheese rice cake having plasticity |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7581585B2 (en) | 2004-10-29 | 2009-09-01 | 3M Innovative Properties Company | Variable position cooling apparatus |
| US10015905B2 (en) | 2016-03-28 | 2018-07-03 | Fujitsu Limited | Immersion cooling device and seal tank |
| US10080308B2 (en) | 2016-09-16 | 2018-09-18 | Fujitsu Limited | Immersion cooling apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0155584B2 (en) | 1989-11-27 |
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