JPS5115973A - - Google Patents

Info

Publication number
JPS5115973A
JPS5115973A JP49087000A JP8700074A JPS5115973A JP S5115973 A JPS5115973 A JP S5115973A JP 49087000 A JP49087000 A JP 49087000A JP 8700074 A JP8700074 A JP 8700074A JP S5115973 A JPS5115973 A JP S5115973A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP49087000A
Other languages
Japanese (ja)
Inventor
Akira Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP49087000A priority Critical patent/JPS5115973A/ja
Publication of JPS5115973A publication Critical patent/JPS5115973A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/163—Connection portion, e.g. seal
JP49087000A 1974-07-31 1974-07-31 Pending JPS5115973A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP49087000A JPS5115973A (en) 1974-07-31 1974-07-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP49087000A JPS5115973A (en) 1974-07-31 1974-07-31

Publications (1)

Publication Number Publication Date
JPS5115973A true JPS5115973A (en) 1976-02-07

Family

ID=13902593

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49087000A Pending JPS5115973A (en) 1974-07-31 1974-07-31

Country Status (1)

Country Link
JP (1) JPS5115973A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60117760A (en) * 1983-11-30 1985-06-25 Fujitsu Ltd Hermetic bonding method for ceramic terminal plate
US4974769A (en) * 1988-04-28 1990-12-04 Hitachi, Ltd. Method of joining composite structures
US7851903B2 (en) 2007-06-04 2010-12-14 Showa Optronics Co., Ltd. Infrared detector with plurality of metallization between first and second container members

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60117760A (en) * 1983-11-30 1985-06-25 Fujitsu Ltd Hermetic bonding method for ceramic terminal plate
JPH0155584B2 (en) * 1983-11-30 1989-11-27 Fujitsu Ltd
US4974769A (en) * 1988-04-28 1990-12-04 Hitachi, Ltd. Method of joining composite structures
US7851903B2 (en) 2007-06-04 2010-12-14 Showa Optronics Co., Ltd. Infrared detector with plurality of metallization between first and second container members

Similar Documents

Publication Publication Date Title
JPS50107155A (en)
FR2268989B1 (en)
FR2295175B1 (en)
FR2270651B1 (en)
FR2269998A1 (en)
FR2294812B1 (en)
FR2263770A1 (en)
FR2281936B1 (en)
FR2265119B1 (en)
JPS5115973A (en)
JPS50122859A (en)
JPS50101002A (en)
JPS50106070U (en)
JPS50113712U (en)
AU7478474A (en)
JPS50129297U (en)
JPS50125951A (en)
JPS50127840A (en)
AU482369A (en)
CH578252A5 (en)
BG19643A1 (en)
BE827400A (en)
BG19899A1 (en)
AU7253373A (en)
CH577686A5 (en)