JPH0154852B2 - - Google Patents

Info

Publication number
JPH0154852B2
JPH0154852B2 JP56104998A JP10499881A JPH0154852B2 JP H0154852 B2 JPH0154852 B2 JP H0154852B2 JP 56104998 A JP56104998 A JP 56104998A JP 10499881 A JP10499881 A JP 10499881A JP H0154852 B2 JPH0154852 B2 JP H0154852B2
Authority
JP
Japan
Prior art keywords
tube
opening
closing
mounting shaft
diffusion furnace
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56104998A
Other languages
English (en)
Japanese (ja)
Other versions
JPS587820A (ja
Inventor
Akyuki Furuya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP56104998A priority Critical patent/JPS587820A/ja
Publication of JPS587820A publication Critical patent/JPS587820A/ja
Publication of JPH0154852B2 publication Critical patent/JPH0154852B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3311—Horizontal transfer of a batch of workpieces

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP56104998A 1981-07-07 1981-07-07 拡散炉におけるチユ−ブ入口開閉装置 Granted JPS587820A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56104998A JPS587820A (ja) 1981-07-07 1981-07-07 拡散炉におけるチユ−ブ入口開閉装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56104998A JPS587820A (ja) 1981-07-07 1981-07-07 拡散炉におけるチユ−ブ入口開閉装置

Publications (2)

Publication Number Publication Date
JPS587820A JPS587820A (ja) 1983-01-17
JPH0154852B2 true JPH0154852B2 (enExample) 1989-11-21

Family

ID=14395761

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56104998A Granted JPS587820A (ja) 1981-07-07 1981-07-07 拡散炉におけるチユ−ブ入口開閉装置

Country Status (1)

Country Link
JP (1) JPS587820A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60169660A (ja) * 1984-02-14 1985-09-03 Nippon Mining Co Ltd デイ−ゼルエンジン燃料の燃焼性改良方法
JPH06105692B2 (ja) * 1988-06-24 1994-12-21 ソニー株式会社 熱処理装置
DE8902607U1 (de) * 1989-03-04 1989-06-22 Owis GmbH, 7813 Staufen Vorrichtung an einer Oxidations- oder Diffusions-Ofenanlage

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57121246A (en) * 1981-01-21 1982-07-28 Hitachi Ltd Semiconductor treating device
JPS6311719Y2 (enExample) * 1981-03-09 1988-04-05

Also Published As

Publication number Publication date
JPS587820A (ja) 1983-01-17

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