JPH0153504B2 - - Google Patents

Info

Publication number
JPH0153504B2
JPH0153504B2 JP58103420A JP10342083A JPH0153504B2 JP H0153504 B2 JPH0153504 B2 JP H0153504B2 JP 58103420 A JP58103420 A JP 58103420A JP 10342083 A JP10342083 A JP 10342083A JP H0153504 B2 JPH0153504 B2 JP H0153504B2
Authority
JP
Japan
Prior art keywords
gold
ball
wire bonding
wire
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58103420A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59229830A (ja
Inventor
Susumu Kamyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP58103420A priority Critical patent/JPS59229830A/ja
Publication of JPS59229830A publication Critical patent/JPS59229830A/ja
Publication of JPH0153504B2 publication Critical patent/JPH0153504B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]

Landscapes

  • Wire Bonding (AREA)
JP58103420A 1983-06-09 1983-06-09 ワイヤボンデイング方法 Granted JPS59229830A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58103420A JPS59229830A (ja) 1983-06-09 1983-06-09 ワイヤボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58103420A JPS59229830A (ja) 1983-06-09 1983-06-09 ワイヤボンデイング方法

Publications (2)

Publication Number Publication Date
JPS59229830A JPS59229830A (ja) 1984-12-24
JPH0153504B2 true JPH0153504B2 (enExample) 1989-11-14

Family

ID=14353543

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58103420A Granted JPS59229830A (ja) 1983-06-09 1983-06-09 ワイヤボンデイング方法

Country Status (1)

Country Link
JP (1) JPS59229830A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020242417A1 (en) * 2019-05-30 2020-12-03 Turkcell Teknoloji Arastirma Ve Gelistirme Anonim Sirketi A system for creating an annotation for cases containing anomaly
EP4063984A1 (en) 2021-03-26 2022-09-28 Yokogawa Electric Corporation Apparatus, method, and program for the estimation of a state of a device
EP4242767A1 (en) 2022-03-03 2023-09-13 Yokogawa Electric Corporation Apparatus, method, and program

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020242417A1 (en) * 2019-05-30 2020-12-03 Turkcell Teknoloji Arastirma Ve Gelistirme Anonim Sirketi A system for creating an annotation for cases containing anomaly
EP4063984A1 (en) 2021-03-26 2022-09-28 Yokogawa Electric Corporation Apparatus, method, and program for the estimation of a state of a device
EP4242767A1 (en) 2022-03-03 2023-09-13 Yokogawa Electric Corporation Apparatus, method, and program

Also Published As

Publication number Publication date
JPS59229830A (ja) 1984-12-24

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