JPH0152899B2 - - Google Patents

Info

Publication number
JPH0152899B2
JPH0152899B2 JP14104680A JP14104680A JPH0152899B2 JP H0152899 B2 JPH0152899 B2 JP H0152899B2 JP 14104680 A JP14104680 A JP 14104680A JP 14104680 A JP14104680 A JP 14104680A JP H0152899 B2 JPH0152899 B2 JP H0152899B2
Authority
JP
Japan
Prior art keywords
electrodes
electrode
electrostatic
insulator
adsorption device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP14104680A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5764950A (en
Inventor
Naomichi Abe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP14104680A priority Critical patent/JPS5764950A/ja
Priority to US06/304,902 priority patent/US4384918A/en
Priority to EP81304409A priority patent/EP0049588B1/de
Priority to DE8181304409T priority patent/DE3171924D1/de
Priority to IE2268/81A priority patent/IE52318B1/en
Publication of JPS5764950A publication Critical patent/JPS5764950A/ja
Publication of JPH0152899B2 publication Critical patent/JPH0152899B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Jigs For Machine Tools (AREA)
  • Weting (AREA)
JP14104680A 1980-09-30 1980-10-08 Electrostatically attracting device and method therefor Granted JPS5764950A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP14104680A JPS5764950A (en) 1980-10-08 1980-10-08 Electrostatically attracting device and method therefor
US06/304,902 US4384918A (en) 1980-09-30 1981-09-23 Method and apparatus for dry etching and electrostatic chucking device used therein
EP81304409A EP0049588B1 (de) 1980-09-30 1981-09-24 Verfahren und Vorrichtung zum Trockenätzen und darin benutzte Halterungsvorrichtung
DE8181304409T DE3171924D1 (en) 1980-09-30 1981-09-24 Method and apparatus for dry etching and electrostatic chucking device used therein
IE2268/81A IE52318B1 (en) 1980-09-30 1981-09-29 Method and apparatus for dry etching and electrostatic chucking device used therein

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14104680A JPS5764950A (en) 1980-10-08 1980-10-08 Electrostatically attracting device and method therefor

Publications (2)

Publication Number Publication Date
JPS5764950A JPS5764950A (en) 1982-04-20
JPH0152899B2 true JPH0152899B2 (de) 1989-11-10

Family

ID=15282984

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14104680A Granted JPS5764950A (en) 1980-09-30 1980-10-08 Electrostatically attracting device and method therefor

Country Status (1)

Country Link
JP (1) JPS5764950A (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001297971A (ja) * 2000-04-14 2001-10-26 Ulvac Japan Ltd 露光装置
JP2001358193A (ja) * 2000-06-13 2001-12-26 Ulvac Japan Ltd 静電吸着装置、基板搬送装置、真空処理装置及び基板保持方法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5848434A (ja) * 1981-09-17 1983-03-22 Toshiba Corp 静電チヤツク装置
JP2633516B2 (ja) * 1982-10-29 1997-07-23 株式会社東芝 試料加工装置および試料搬送方法
JP2582410B2 (ja) * 1988-04-26 1997-02-19 東陶機器株式会社 静電チャック基板
JP2514255B2 (ja) * 1989-09-19 1996-07-10 富士通株式会社 静電チャック
JP3238925B2 (ja) * 1990-11-17 2001-12-17 株式会社東芝 静電チャック
JP2503364B2 (ja) * 1992-08-20 1996-06-05 富士通株式会社 ウエハの静電吸着装置、ウエハの静電吸着方法、ウエハの離脱方法及びドライエッチング方法
JP2006049357A (ja) * 2004-07-30 2006-02-16 Toto Ltd 静電チャックおよび静電チャックを搭載した装置
JP5936361B2 (ja) 2012-01-12 2016-06-22 株式会社日立ハイテクノロジーズ プラズマ処理装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001297971A (ja) * 2000-04-14 2001-10-26 Ulvac Japan Ltd 露光装置
JP2001358193A (ja) * 2000-06-13 2001-12-26 Ulvac Japan Ltd 静電吸着装置、基板搬送装置、真空処理装置及び基板保持方法
JP4640876B2 (ja) * 2000-06-13 2011-03-02 株式会社アルバック 基板搬送装置

Also Published As

Publication number Publication date
JPS5764950A (en) 1982-04-20

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