JPH0148357B2 - - Google Patents
Info
- Publication number
- JPH0148357B2 JPH0148357B2 JP2643583A JP2643583A JPH0148357B2 JP H0148357 B2 JPH0148357 B2 JP H0148357B2 JP 2643583 A JP2643583 A JP 2643583A JP 2643583 A JP2643583 A JP 2643583A JP H0148357 B2 JPH0148357 B2 JP H0148357B2
- Authority
- JP
- Japan
- Prior art keywords
- storage box
- printed wiring
- hanger
- board
- transfer device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 23
- 238000007747 plating Methods 0.000 claims description 13
- 239000004020 conductor Substances 0.000 claims description 8
- 238000004513 sizing Methods 0.000 description 9
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 7
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000005238 degreasing Methods 0.000 description 3
- 230000032258 transport Effects 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2643583A JPS59153894A (ja) | 1983-02-19 | 1983-02-19 | プリント配線用基板の自動鍍金装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2643583A JPS59153894A (ja) | 1983-02-19 | 1983-02-19 | プリント配線用基板の自動鍍金装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59153894A JPS59153894A (ja) | 1984-09-01 |
| JPH0148357B2 true JPH0148357B2 ( ) | 1989-10-18 |
Family
ID=12193428
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2643583A Granted JPS59153894A (ja) | 1983-02-19 | 1983-02-19 | プリント配線用基板の自動鍍金装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59153894A ( ) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62224700A (ja) * | 1986-03-26 | 1987-10-02 | Toyo Giken Kogyo Kk | マスキング板の保持方法 |
| JPS637396A (ja) * | 1986-06-27 | 1988-01-13 | Fujitsu Ltd | めつき装置およびそのクランプ治具 |
| JPH0261094A (ja) * | 1988-08-26 | 1990-03-01 | Electroplating Eng Of Japan Co | 処理対象物の供給・取り出し装置 |
| KR100575111B1 (ko) | 2004-06-29 | 2006-04-28 | 주식회사 티케이씨 | 도금기판의 로딩 및 언로딩장치 |
| CN113560271B (zh) * | 2021-07-28 | 2023-06-23 | 厦门海辰储能科技股份有限公司 | 一种导电夹清洗液回收装置及清洗液回收方法、镀膜机 |
-
1983
- 1983-02-19 JP JP2643583A patent/JPS59153894A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59153894A (ja) | 1984-09-01 |
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