JPH0148343B2 - - Google Patents
Info
- Publication number
- JPH0148343B2 JPH0148343B2 JP58142461A JP14246183A JPH0148343B2 JP H0148343 B2 JPH0148343 B2 JP H0148343B2 JP 58142461 A JP58142461 A JP 58142461A JP 14246183 A JP14246183 A JP 14246183A JP H0148343 B2 JPH0148343 B2 JP H0148343B2
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- less
- blisters
- cold
- rolled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910045601 alloy Inorganic materials 0.000 claims description 18
- 239000000956 alloy Substances 0.000 claims description 18
- 229910000640 Fe alloy Inorganic materials 0.000 claims description 5
- 239000012535 impurity Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 description 13
- 229910003271 Ni-Fe Inorganic materials 0.000 description 11
- 230000007547 defect Effects 0.000 description 7
- 229910000831 Steel Inorganic materials 0.000 description 6
- 239000010959 steel Substances 0.000 description 6
- 238000007789 sealing Methods 0.000 description 4
- 229910019589 Cr—Fe Inorganic materials 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 239000010960 cold rolled steel Substances 0.000 description 2
- 238000005097 cold rolling Methods 0.000 description 2
- 238000005098 hot rolling Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 229910001018 Cast iron Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000009659 non-destructive testing Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000000452 restraining effect Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000009849 vacuum degassing Methods 0.000 description 1
Landscapes
- Electrodes For Cathode-Ray Tubes (AREA)
Description
本発明は冷延薄鋼帯における内部欠陥の一つで
ある「フクレ」の発生を防止した電子部品用高
Ni−Fe合金を提供するものである。
高Ni−Fe合金は電子部品用材料として不可欠
なもので、例えば、カラーテレビ受像機のシヤド
ーマスク用材には熱膨張率の最も小さい36%Ni
−Fe合金が、ICリードフレーム用材にはパツケ
ージとの封着性に優れ、かつ、メツキ性、ハンダ
性も良好な42%Ni−Fe合金、51%Ni−Fe合金
が、また、ガラスとの強固な封着を必要とする蛍
光表示管用リードフレーム材には、42%Ni−6
%Cr−Fe合金が使用されている。
これら、シヤドーマスク、リードフレームには
板厚0.25〜0.15mmの冷延薄板コイルが素材として
用いられており、フオトエツチング、パンチング
加工によつて所定のマスク形状、フレーム形状に
加工される。これらは精密部品であるがため、そ
の加工精度、品質精度に対する要求は極めて厳し
く、素材に要求される特性としては厚み精度、平
担度の他に粗大介在物、二枚割れ、「フクレ」な
どの内部欠陥に対して厳しい規制が設けられてい
る。しかし、当該高Ni−Fe合金の冷延薄板コイ
ルには圧延方向に伸展した幅約1mm、長さ15mm程
度の「フクレ」と称する内部欠陥がしばしば発生
する場合があり、この「フクレ」は板厚が薄い程
顕著に現われる。このような「フクレ」はシヤド
ーマスク、リードフレームの形状、すなわち加工
精度を著しく阻害し、品質も損なうため、冷延コ
イルでの「フクレ」の発生は電子部品用素材とし
て致命的欠陥となりうる。
本発明者らは高Ni−Fe合金冷延薄鋼帯に発生
する「フクレ」を防止すべく鋭意研究の結果、N
含有量を厳しく制限し、0.002%以下とすること
で「フクレ」を完全に防止しえることを究明し、
本発明を完成した。
高Ni−Fe合金中ではNは著しく活性化し、極
く微量のN、例えば平衡状態として定まる砲和溶
解度以下であつても、凝固時の濃化現象によつて
鋳魂に微小な気泡を生じる。このような鋳塊に発
生した微小なN2気泡は通常の用途においては熱
間加工性など本合金の加工性を何ら阻害するもの
でなく、また非破壊検査等によつても容易に検出
しえないものである。
しかし、電子部品用品材として必要な0.2mm程
度の板厚まで圧延されると、焼鈍中に熱間圧延〜
冷間圧延で完全に密着消失しなかつた一部のN2
気泡が膨張し、この時の内圧が板厚による拘束力
に打勝つた場合、「フクレ」を生ずるものと推定
される。
すなわち、本発明は、Ni:35〜55%、Mn:
1.2%以下、Si:0.3%以下、または、Ni:35〜55
%、Cr:3〜10%、Mn:1.2%以下、Si:0.3%
以下で、残部がFeおよび不何避的不純物よりな
る合金においてN量を0.002%以下に制限するこ
とで、内部欠陥「フクレ」のない健全な電子部品
用を製造し得る高Ni−Fe合金冷延薄帯用合金を
提供するものである。
本発明における成分限定理由は以下のとおりで
ある。
Ni:電子部品用材料として、最も重要な、熱膨
張性を支配する元素であり、常温域では36%
で、300℃域では42%で、500℃域では52%で熱
膨張率は最小となる。したがつて、低熱膨張性
をうるためには35〜55%を必要とする。
Cr:電子部品用材として必要な特性であるガラ
スとの封着性を左右する元素であり、3%未満
では封着性が劣り、10%を越えると低熱膨張性
を損う。したがつて、3〜10%が必要である。
N:フクレの原因となる元素であり、可及的に小
量であることが好ましい。電子部品用材として
必要な板厚0.2mm前後の冷延鋼帯におけるフク
レの発生を防止するには0.002%以下とする必
要がある。
Mn:脱酸元素として不可欠なものであり、ま
た、熱間加工性にも有効な元素である。しか
し、1.2%を越えると熱膨張係数を著しく増大
させるため1.2%以下とする。
Si:脱酸剤として不可欠な元素であるが、0.3%
以上を含むと熱膨張係数が著しく増大し、ま
た、熱間加工性も劣化するため0.3以下とする。
本発明は以上の条件を満足することにより内部
欠陥のない良好な品質を有する電子部品用冷延薄
鋼帯を得ることが可能となるのである。
以下に具体例にもとづき詳細な説明を行なう。
第1表は試験した高Ni−Fe合金冷延鋼帯の化
学組成、板厚および、フクレ発生の有無を示した
ものである。
The present invention has developed a steel plate for electronic parts that prevents the occurrence of "blister", which is one of the internal defects in cold-rolled thin steel strips.
The present invention provides a Ni-Fe alloy. High Ni-Fe alloys are essential as materials for electronic components.For example, 36%Ni, which has the lowest coefficient of thermal expansion, is used as a material for shadow masks for color television receivers.
-Fe alloy is used for IC lead frame materials, while 42% Ni-Fe alloy and 51% Ni-Fe alloy, which have excellent sealing properties with the package and good plating and solderability, are also used for IC lead frame materials. 42% Ni-6 is used for lead frame materials for fluorescent display tubes that require strong sealing.
%Cr-Fe alloy is used. These shadow masks and lead frames are made of cold-rolled thin plate coils with a thickness of 0.25 to 0.15 mm, and are processed into predetermined mask and frame shapes by photo-etching and punching processes. Since these are precision parts, the requirements for processing accuracy and quality accuracy are extremely strict, and the characteristics required of the material include thickness accuracy, flatness, coarse inclusions, two-piece cracking, ``blister'', etc. Strict regulations are in place for internal defects. However, internal defects called "blisters", which extend in the rolling direction and are about 1 mm wide and 15 mm long, often occur in the cold-rolled thin sheet coils made of the high Ni-Fe alloy. The thinner the thickness, the more noticeable it becomes. Such "blisters" significantly impede the shape of the shadow mask and lead frame, that is, the processing accuracy, and impair quality, so the occurrence of "blisters" in cold-rolled coils can be a fatal defect as a material for electronic components. As a result of intensive research to prevent "blisters" that occur in high-Ni-Fe alloy cold-rolled thin steel strips, the present inventors found that N
We found that "blister" can be completely prevented by strictly limiting the content to 0.002% or less.
The invention has been completed. In high Ni-Fe alloys, N is significantly activated, and even a very small amount of N, for example, below the bombardment solubility determined as an equilibrium state, will cause minute bubbles in the cast iron due to the concentration phenomenon during solidification. . Such minute N 2 bubbles generated in the ingot do not impede the workability of this alloy, such as hot workability, in normal applications, and are easily detected by non-destructive testing. It is impossible. However, when the plate is rolled to a thickness of about 0.2 mm, which is required for electronic component materials, hot rolling during annealing...
Some N 2 that did not completely disappear during cold rolling
If the bubble expands and the internal pressure at this time overcomes the restraining force due to the plate thickness, it is estimated that "blister" will occur. That is, in the present invention, Ni: 35 to 55%, Mn:
1.2% or less, Si: 0.3% or less, or Ni: 35 to 55
%, Cr: 3-10%, Mn: 1.2% or less, Si: 0.3%
In the following, by limiting the amount of N to 0.002% or less in an alloy in which the balance consists of Fe and unavoidable impurities, we will discuss how to cool a high Ni-Fe alloy that can produce sound electronic parts without internal defects "blisters". The present invention provides an alloy for rolled ribbon. The reasons for limiting the components in the present invention are as follows. Ni: As a material for electronic components, it is the most important element that controls thermal expansion, 36% at room temperature.
The coefficient of thermal expansion is the lowest at 42% in the 300°C range and 52% in the 500°C range. Therefore, 35 to 55% is required to obtain low thermal expansion. Cr: This is an element that affects the sealing property with glass, which is a necessary property as a material for electronic parts.If it is less than 3%, the sealing property is poor, and if it exceeds 10%, the low thermal expansion property is impaired. Therefore, 3-10% is required. N: This is an element that causes blisters, and the amount thereof is preferably as small as possible. In order to prevent blistering in cold-rolled steel strips with a thickness of around 0.2 mm, which are required as materials for electronic parts, the content must be 0.002% or less. Mn: Indispensable as a deoxidizing element, and also effective in hot workability. However, if it exceeds 1.2%, the coefficient of thermal expansion will increase significantly, so it should be kept at 1.2% or less. Si: An essential element as a deoxidizing agent, but 0.3%
If the above content is included, the coefficient of thermal expansion will increase significantly and the hot workability will also deteriorate, so it should be set to 0.3 or less. By satisfying the above conditions, the present invention makes it possible to obtain a cold-rolled thin steel strip for electronic components that is free from internal defects and has good quality. A detailed explanation will be given below based on a specific example. Table 1 shows the chemical composition, plate thickness, and presence or absence of blistering of the high Ni-Fe alloy cold-rolled steel strips tested.
【表】【table】
【表】
これらの材料は大略以下の工程で製造したもの
である。いずれも、40トン電炉→転炉→真空脱ガ
ス→鋳造により製造した6.5トン鋳魂を分魂→熱
間圧延→冷間圧延→焼鈍→仕上げ圧延し、最終板
厚を0.18〜0.25mm、硬度をHv=200前後に調整し
たものである。
これら鋼帯におけるフクレ発生の有無のチエツ
クは、当該コイルを検査ラインに通板し、コイル
の両表面を目視検査し、当該コイル内にフクレが
一ケ所でも発見された場合はフクレ有りとした。
第1表ではコイルNo.1、2、9、10が36%Ni
−Fe合金、コイルNo.3、4、11、12が42%Ni−
Fe合金、コイルNo.5、6、13、14が51%Ni−Fe
合金、コイルNo.7、8、15、16が42%Ni−6%
Cr−Fe合金の場合を示したものであるが、いず
れの合金系においてもフクレの発生の有無はN含
有量に支配されており、N含有量を0.002%以下
とすることでフクレの発生はない。
以上説明したように、本発明は高Ni−Fe合金
薄鋼帯に発生するフクレ防止に極めて効果的で内
部欠陥のない良質な電子部品用材を提供すること
が可能となり、工業的価値は大である。[Table] These materials were roughly manufactured using the following steps. In both cases, a 6.5 ton cast soul produced by 40 ton electric furnace → converter → vacuum degassing → casting is divided into pieces → hot rolling → cold rolling → annealing → finish rolling, and the final plate thickness is 0.18 to 0.25 mm and the hardness is is adjusted to Hv = around 200. To check for the occurrence of blisters in these steel strips, the coils were passed through an inspection line and both surfaces of the coils were visually inspected, and if even one blister was found within the coils, it was determined that there were blisters. In Table 1, coils No. 1, 2, 9, and 10 are made of 36% Ni.
-Fe alloy, coil No. 3, 4, 11, 12 is 42% Ni-
Fe alloy, coil No. 5, 6, 13, 14 is 51% Ni-Fe
Alloy, coil No.7, 8, 15, 16 is 42%Ni-6%
The figure shows the case of a Cr-Fe alloy, but the occurrence of blisters in any alloy system is controlled by the N content, and the occurrence of blisters can be prevented by keeping the N content below 0.002%. do not have. As explained above, the present invention makes it possible to provide a high-quality material for electronic components that is extremely effective in preventing blisters that occur in high Ni-Fe alloy thin steel strips and has no internal defects, and has great industrial value. be.
Claims (1)
Fe合金において: N量が0.002%以下であることを特徴とする電
子部品用合金。 2 Ni:35〜55% Cr:3〜10% Mn:1.2%以下 Si:0.3%以下 残部がFeおよび不可避的不純物からなる高Ni
−Fe合金において: N量が0.002%以下であることを特徴とする電
子部品用合金。[Claims] 1 Ni: 35 to 55% Mn: 1.2% or less Si: 0.3% or less High Ni- consisting of balance Fe and unavoidable impurities
In Fe alloy: An alloy for electronic parts characterized by having a N content of 0.002% or less. 2 Ni: 35-55% Cr: 3-10% Mn: 1.2% or less Si: 0.3% or less High-Ni content with the balance consisting of Fe and unavoidable impurities
-In the Fe alloy: An alloy for electronic parts, characterized in that the amount of N is 0.002% or less.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14246183A JPS6033337A (en) | 1983-08-05 | 1983-08-05 | High ni-fe alloy for electronic parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14246183A JPS6033337A (en) | 1983-08-05 | 1983-08-05 | High ni-fe alloy for electronic parts |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6033337A JPS6033337A (en) | 1985-02-20 |
JPH0148343B2 true JPH0148343B2 (en) | 1989-10-18 |
Family
ID=15315853
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14246183A Granted JPS6033337A (en) | 1983-08-05 | 1983-08-05 | High ni-fe alloy for electronic parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6033337A (en) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61113746A (en) * | 1984-11-07 | 1986-05-31 | Nippon Mining Co Ltd | Material for shadow mask |
JPH02236255A (en) * | 1985-03-08 | 1990-09-19 | Nippon Mining Co Ltd | Alloy for glass sealing |
JPH0748652A (en) * | 1986-06-04 | 1995-02-21 | Nkk Corp | Shadow mask original sheet excellent in press formability |
JPH0739612B2 (en) * | 1986-06-04 | 1995-05-01 | 日本鋼管株式会社 | Method for manufacturing shadow mask original plate excellent in press formability |
JP2597994B2 (en) * | 1986-06-09 | 1997-04-09 | 株式会社東芝 | Amber alloy for shadow mask |
JPS6425944A (en) * | 1987-04-27 | 1989-01-27 | Nippon Mining Co | Shadow mask material |
JPH0624094B2 (en) * | 1987-05-09 | 1994-03-30 | 双葉電子工業株式会社 | Fluorescent display tube control electrode |
JPH0759741B2 (en) * | 1988-04-15 | 1995-06-28 | 日本鋼管株式会社 | Fe-Ni-based high permeability alloy and method for producing the same |
JPH0759742B2 (en) * | 1988-04-22 | 1995-06-28 | 日本鋼管株式会社 | Fe-Ni-based high-permeability magnetic alloy and method for producing the same |
JP2719551B2 (en) * | 1989-03-10 | 1998-02-25 | 日鉱金属株式会社 | Lead frame material |
US5252151A (en) * | 1990-02-15 | 1993-10-12 | Nkk Corporation | Fe-Ni alloy sheet for shadow mask having a low silicon segregation and method for manufacturing same |
JP3316909B2 (en) * | 1992-01-31 | 2002-08-19 | 日本鋼管株式会社 | Fe-Ni-based and Fe-Ni-Co-based alloy sheets for shadow masks with excellent blackening properties |
JP2681606B2 (en) * | 1993-11-18 | 1997-11-26 | 東洋鋼鈑株式会社 | Fe-Ni metal plate for shadow mask with excellent workability and shape fixability |
JP2734979B2 (en) * | 1994-03-14 | 1998-04-02 | 日本鋼管株式会社 | Method for producing original shadow mask plate with excellent press moldability |
JP2939118B2 (en) * | 1994-05-06 | 1999-08-25 | 日本鋼管株式会社 | Fe-Ni alloy for electronic and electromagnetic applications |
JPH07180072A (en) * | 1994-10-25 | 1995-07-18 | Dainippon Printing Co Ltd | Production of etched parts |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4884722A (en) * | 1972-02-17 | 1973-11-10 | ||
JPS5514801A (en) * | 1978-06-27 | 1980-02-01 | Toshiba Corp | Sealing alloy |
JPS5542141A (en) * | 1978-09-19 | 1980-03-25 | Sumitomo Metal Ind Ltd | Coat die forming method of large-sized cast iron casting |
JPS56146861A (en) * | 1980-04-14 | 1981-11-14 | Sumitomo Special Metals Co Ltd | Alloy for seal bonding soft glass |
JPS582583A (en) * | 1981-06-27 | 1983-01-08 | ウルリク ベツケンバツハ | Charger for shaft furnace |
JPS58100661A (en) * | 1981-12-11 | 1983-06-15 | Nippon Steel Corp | High ni alloy with superior weldability and corrosion resistance |
JPS5996245A (en) * | 1982-11-22 | 1984-06-02 | Daido Steel Co Ltd | Material for lead frame and its manufacture |
-
1983
- 1983-08-05 JP JP14246183A patent/JPS6033337A/en active Granted
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4884722A (en) * | 1972-02-17 | 1973-11-10 | ||
JPS5514801A (en) * | 1978-06-27 | 1980-02-01 | Toshiba Corp | Sealing alloy |
JPS5542141A (en) * | 1978-09-19 | 1980-03-25 | Sumitomo Metal Ind Ltd | Coat die forming method of large-sized cast iron casting |
JPS56146861A (en) * | 1980-04-14 | 1981-11-14 | Sumitomo Special Metals Co Ltd | Alloy for seal bonding soft glass |
JPS582583A (en) * | 1981-06-27 | 1983-01-08 | ウルリク ベツケンバツハ | Charger for shaft furnace |
JPS58100661A (en) * | 1981-12-11 | 1983-06-15 | Nippon Steel Corp | High ni alloy with superior weldability and corrosion resistance |
JPS5996245A (en) * | 1982-11-22 | 1984-06-02 | Daido Steel Co Ltd | Material for lead frame and its manufacture |
Also Published As
Publication number | Publication date |
---|---|
JPS6033337A (en) | 1985-02-20 |
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