JPH0147893B2 - - Google Patents

Info

Publication number
JPH0147893B2
JPH0147893B2 JP57022503A JP2250382A JPH0147893B2 JP H0147893 B2 JPH0147893 B2 JP H0147893B2 JP 57022503 A JP57022503 A JP 57022503A JP 2250382 A JP2250382 A JP 2250382A JP H0147893 B2 JPH0147893 B2 JP H0147893B2
Authority
JP
Japan
Prior art keywords
bonding
wire
bonding tool
loop
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57022503A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58139435A (ja
Inventor
Masayoshi Yamaguchi
Toshiro Tsuruta
Nobushi Suzuki
Sumio Nagashima
Koichi Chiba
Koichiro Atsumi
Noryasu Kashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP57022503A priority Critical patent/JPS58139435A/ja
Publication of JPS58139435A publication Critical patent/JPS58139435A/ja
Publication of JPH0147893B2 publication Critical patent/JPH0147893B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP57022503A 1982-02-15 1982-02-15 ボンディング方法 Granted JPS58139435A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57022503A JPS58139435A (ja) 1982-02-15 1982-02-15 ボンディング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57022503A JPS58139435A (ja) 1982-02-15 1982-02-15 ボンディング方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2242466A Division JPH03114238A (ja) 1990-09-14 1990-09-14 ボンディング方法

Publications (2)

Publication Number Publication Date
JPS58139435A JPS58139435A (ja) 1983-08-18
JPH0147893B2 true JPH0147893B2 (enFirst) 1989-10-17

Family

ID=12084543

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57022503A Granted JPS58139435A (ja) 1982-02-15 1982-02-15 ボンディング方法

Country Status (1)

Country Link
JP (1) JPS58139435A (enFirst)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6342135A (ja) * 1986-08-08 1988-02-23 Shinkawa Ltd ワイヤボンデイング方法
JPH03114238A (ja) * 1990-09-14 1991-05-15 Toshiba Corp ボンディング方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS501648A (enFirst) * 1973-05-07 1975-01-09
JPS5041818U (enFirst) * 1973-08-13 1975-04-28
JPS5451476A (en) * 1977-09-30 1979-04-23 Shinkawa Seisakusho Kk Device for bonding wires
JPS5458352A (en) * 1977-10-19 1979-05-11 Shinkawa Seisakusho Kk Method of bonding wire
JPS5466769A (en) * 1977-11-08 1979-05-29 Shinkawa Seisakusho Kk Device for bonding wires

Also Published As

Publication number Publication date
JPS58139435A (ja) 1983-08-18

Similar Documents

Publication Publication Date Title
JPH0147893B2 (enFirst)
JPH03114238A (ja) ボンディング方法
JPS58125842A (ja) ワイヤボンデイング装置
JPS5988841A (ja) ワイヤボンデイング装置
JPH0522384B2 (enFirst)
JPH04247631A (ja) ワイヤボンディング装置
JPS5823743B2 (ja) ワイヤボンデイングソウチ
JPH09191023A (ja) ワイヤボンディング装置
JPH0236064B2 (enFirst)
JPS6364896B2 (enFirst)
JPS5834935A (ja) ボンディング方法
JPS6098634A (ja) ワイヤボンデイング方法
JPS58194346A (ja) ボンデイング方法
JPS589331A (ja) 半導体装置のワイヤボンデイング装置
JP2817314B2 (ja) ワイヤボンダおよびワイヤボンディング方法
JPS6146052B2 (enFirst)
JPS6352778B2 (enFirst)
JP3615934B2 (ja) バンプ形成方法及びバンプボンダー
JPS59181027A (ja) ワイヤボンデイング装置
JPS6041856B2 (ja) ワイヤボンデイング装置
JPS59227135A (ja) ワイヤボンデイング装置
JPS5856052Y2 (ja) 半田供給装置
JP3590171B2 (ja) ワイヤボンディング方法およびワイヤボンディング装置
JPS6083342A (ja) ワイヤボンデイング方法
JPS60113439A (ja) ワイヤボンディング方法