JPH0145979B2 - - Google Patents
Info
- Publication number
- JPH0145979B2 JPH0145979B2 JP58076951A JP7695183A JPH0145979B2 JP H0145979 B2 JPH0145979 B2 JP H0145979B2 JP 58076951 A JP58076951 A JP 58076951A JP 7695183 A JP7695183 A JP 7695183A JP H0145979 B2 JPH0145979 B2 JP H0145979B2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- semiconductor device
- semiconductor devices
- characteristic
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58076951A JPS59202652A (ja) | 1983-04-30 | 1983-04-30 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58076951A JPS59202652A (ja) | 1983-04-30 | 1983-04-30 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59202652A JPS59202652A (ja) | 1984-11-16 |
| JPH0145979B2 true JPH0145979B2 (enExample) | 1989-10-05 |
Family
ID=13620075
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58076951A Granted JPS59202652A (ja) | 1983-04-30 | 1983-04-30 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59202652A (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02230760A (ja) * | 1989-03-02 | 1990-09-13 | Rohm Co Ltd | 半導体部品の製造方法 |
| JPH065759A (ja) * | 1992-06-23 | 1994-01-14 | Sharp Corp | 半導体デバイスの製造方法 |
| JP3862411B2 (ja) * | 1998-05-12 | 2006-12-27 | 三菱電機株式会社 | 半導体装置の製造方法及びその構造 |
| US20080265248A1 (en) * | 2007-04-27 | 2008-10-30 | Microchip Technology Incorporated | Leadframe Configuration to Enable Strip Testing of SOT-23 Packages and the Like |
| DE102013217892A1 (de) * | 2012-12-20 | 2014-06-26 | Continental Teves Ag & Co. Ohg | Elektronische Vorrichtung und Verfahren zur Herstellung einer elektronischen Vorrichtung |
| CN106926565B (zh) * | 2017-03-30 | 2023-05-05 | 深圳市极而峰工业设备有限公司 | Lcd立面导电银浆印刷装置 |
-
1983
- 1983-04-30 JP JP58076951A patent/JPS59202652A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59202652A (ja) | 1984-11-16 |
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